Dynamics of electromigration induced void/hillock growth and precipitation/dissolution of addition elements studied by in-situ scanning electron microscopy resistance measurements

التفاصيل البيبلوغرافية
العنوان: Dynamics of electromigration induced void/hillock growth and precipitation/dissolution of addition elements studied by in-situ scanning electron microscopy resistance measurements
المؤلفون: D'Haen, J., Cosemans, P., Manca, J.V., Lekens, G., Martens, T., Ceuninck, W. De, D'Olieslaeger, M., Schepper, L. De, Maex, K.
المصدر: Microelectronics Reliability; 1999, Vol. 39 Issue: 11 p1617-1630, 14p
قاعدة البيانات: Supplemental Index
الوصف
تدمد:00262714
DOI:10.1016/S0026-2714(99)00169-9