المؤلفون: Daisuke Kono, Iwao Yamaji, Maruka Shimoyama, Yohei Oda, Yuki Kuroiwa, 下山 丸加, 小田 陽平, 山路 伊和夫, 河野 大輔, 黒岩 佑樹

المصدر: Proceedings of JSPE Semestrial Meeting. 2021, :317

المؤلفون: Arakawa Martins, L., Soebarto, V., Williamson, T., Pisaniello, D.

المساهمون: 53rd International Conference of the Architectural Science Association (ANZAScA) (28 Nov 2019 - 30 Nov 2019 : Roorkee, India)

المصدر: https://anzasca.net/paper/developing-occupant-centric-models-to-better-understand-the-thermal-comfort-and-wellbeing-of-older-australians/.

مصطلحات موضوعية: Thermal conduct, personal comfort model, machine learning, older people

Relation: http://purl.org/au-research/grants/arc/DP180102019; Proceedings of the 53rd International Conference of the Architectural Science Association (ANZAScA): Revisiting the Role of Architecture for 'Surviving’ Development, 2019, vol.2019-November, pp.595-604; http://hdl.handle.net/2440/126812; Arakawa Martins, L. [0000-0003-3224-8556]; Soebarto, V. [0000-0003-1397-8414]; Pisaniello, D. [0000-0002-4156-0608]

الاتاحة: http://hdl.handle.net/2440/126812

المؤلفون: Fatiha Souahi, Ykhlef Laidani, Ghania Henini

المصدر: Energy Procedia. 6:449-458

مصطلحات موضوعية: Engineering, Computer cooling, business.industry, Nuclear engineering, Batch reactor, Plate heat exchanger, Mechanical engineering, supervision system, thermal flux, Electrical resistance and conductance, Heat flux, Energy(all), mono-fluid, Thermal, Heat exchanger, Water cooling, Batch chemical reactor, business, thermal conduct, temperature control

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::65b67c45da081d8dc31624efb74803a2

المؤلفون: Yao, Rong-Qian, Fu, Chang-Ping, Zhang, Shuai-F, Mao, Y, Feng, Zu-, 姚荣迁, 冯祖德

المصدر: http://dx.doi.org/10.3969/j.issn.1001-9731.2014.23.024.

مصطلحات موضوعية: Heat transfer, High temperature applications, Light emitting diodes, Melt spinning, Nanocomposite films, Nanocomposites, Optoelectronic devices, Polysilanes, Scanning electron microscopy, Silicon carbide, Sintering, Substrates, Thermal conduct

Relation: Gongneng Cailiao/Journal of Functional Materials, 2014,45(23):23122-23125; 20150300425872; http://dspace.xmu.edu.cn/handle/2288/87481

الاتاحة: http://dspace.xmu.edu.cn/handle/2288/87481