المؤلفون: Mohamed Ali, Ahmad Hassan, Mohammad Honarparvar, Morteza Nabavi, Yves Audet, Mohamad Sawan, Yvon Savaria

المصدر: IEEE Access, Vol 10, Pp 24540-24555 (2022)

مصطلحات موضوعية: Industrial applications, sensor interface, versatility, system-on-chip (SoC), system-in-package (SiP), thermal management, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/9721533/; https://doaj.org/toc/2169-3536

URL الوصول: https://doaj.org/article/7bcaed7241be4db995e9097bf83827ab

المؤلفون: Aziz Oukaira, Dhaou Said, Jamal Zbitou, Ahmed Lakhssassi

المصدر: Electronics; Volume 12; Issue 14; Pages: 3154

مصطلحات موضوعية: chip cooling laminate chip (CCLC), finite element method (FEM), system-in-package (SiP)

وصف الملف: application/pdf

Relation: Computer Science & Engineering; https://dx.doi.org/10.3390/electronics12143154

الاتاحة: https://doi.org/10.3390/electronics12143154

المؤلفون: Fan Yang, Bowen Zhang, Leijun Song

المصدر: Micromachines; Volume 13; Issue 11; Pages: 1817

مصطلحات موضوعية: system in package (SIP), Ku-band, four channels, high temperature co-fired ceramics (HTCC)

وصف الملف: application/pdf

Relation: https://dx.doi.org/10.3390/mi13111817

الاتاحة: https://doi.org/10.3390/mi13111817

المؤلفون: Totorica, Nathan, Li, Feng

المصدر: Semiconductor Science and Information Devices; Vol. 4 , Iss. 2 (July 2022); 1-9 ; 2661-3212

مصطلحات موضوعية: System on package (SoP), System in package (SiP), System on chip (SoC), Through silicon via (TSV), Signal integrity, Power integrity, Thermal integrity

وصف الملف: application/pdf

Relation: https://journals.bilpubgroup.com/index.php/ssid/article/view/4475/3793; https://journals.bilpubgroup.com/index.php/ssid/article/view/4475

الاتاحة: https://journals.bilpubgroup.com/index.php/ssid/article/view/4475

المؤلفون: de Milleri N., Valli L., Fueldner M., Wiesbauer A., Baschirotto A.

المساهمون: de Milleri, N, Valli, L, Fueldner, M, Wiesbauer, A, Baschirotto, A

مصطلحات موضوعية: Acoustic, audio, digital microphone, high signal-to-noise ratio (SNR), low noise, micro-electromechanical systems (MEMS) microphone, optical microphone, system-in-package (SiP)

وصف الملف: STAMPA

Relation: info:eu-repo/semantics/altIdentifier/wos/WOS:001230819300001; volume:59; issue:7; firstpage:2005; lastpage:2018; numberofpages:14; journal:IEEE JOURNAL OF SOLID-STATE CIRCUITS; https://hdl.handle.net/10281/511659; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-85194050174

الاتاحة: https://hdl.handle.net/10281/511659
https://doi.org/10.1109/JSSC.2024.3396669

المؤلفون: Santagata, Fabio, Sun, Jianwen, Iervolino, Elina, Yu, Hongyu, Wang, Fei, Zhang, Guoqi, Sarro, P.M., Zhang, Guoyi

المصدر: Microelectronics International, 2018, Vol. 35, Issue 4, pp. 231-243.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/MI-09-2017-0045

المؤلفون: Zhihao Ren, Jikai Xu, Xianhao Le, Chengkuo Lee

المصدر: Micromachines; Volume 12; Issue 8; Pages: 946

مصطلحات موضوعية: heterogeneous integration, wafer bonding, thin-film transfer, System-in-Package (SiP), sensor, 5G, 6G, photonics, power electronics, Internet of Thing (IoT), Artificial Intelligence of Thing (AIoT), wearable electronics

وصف الملف: application/pdf

Relation: https://dx.doi.org/10.3390/mi12080946

الاتاحة: https://doi.org/10.3390/mi12080946

المؤلفون: Fischer, Andreas C., 1982, Forsberg, Fredrik, Lapisa, Martin, Bleiker, Simon J., Stemme, Göran, Roxhed, Niclas, Niklaus, Frank

المصدر: Microsystems & Nanoengineering. 1(1):1-16

مصطلحات موضوعية: Cofabrication platforms, integrated circuits (ICs), microelectromechanical system (MEMS), More-Than-Moore, multichip modules (MCMs), system-in-package (SiP), system-on-chip (SoC), three-dimensional (3D) heterogeneous integration

وصف الملف: electronic

URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-169103
https://doi.org/10.1038/micronano.2015.5
http://www.nature.com/articles/micronano20155
https://kth.diva-portal.org/smash/get/diva2:819950/FULLTEXT01.pdf

المؤلفون: Konstantin O. Petrosyants, Nikita I. Ryabov

المصدر: Energies; Volume 13; Issue 12; Pages: 3054

مصطلحات موضوعية: LSI packages, system in package (SiP), thermal analysis, 3D simulation

وصف الملف: application/pdf

Relation: https://dx.doi.org/10.3390/en13123054

الاتاحة: https://doi.org/10.3390/en13123054

المؤلفون: Hengqian Yi, Efe Ozturk, Marco Koelink, Jana Krimmling, Andrei A. Damian, Wojciech Debski, H. W. van Zeijl, Guoqi Zhang, Rene H. Poelma

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:893-901

مصطلحات موضوعية: metalized polymer, film-assisted molding, patch antennas, 0.13-µm silicon germanium bipolar complementary metal-oxide semiconductor (SiGe BiCMOS), system-in-package (SiP), radar antenna-in-package (AiP), Electrical and Electronic Engineering, monostatic frequency modulated continuous-wave (FMCW) radar, through-polymer via (TPV), Industrial and Manufacturing Engineering, SU-8, Electronic, Optical and Magnetic Materials

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a9eaf339882464385d988003f4f9b3a9
https://doi.org/10.1109/tcpmt.2022.3172618

المؤلفون: Yi, H. (author), Öztürk, E. (author), Koelink, Marco (author), Krimmling, Jana (author), Damian, Andrei A. (author), Debski, Wojciech (author), van Zeijl, H.W. (author), Zhang, Kouchi (author), Poelma, René H. (author)

مصطلحات موضوعية: 0.13-µm silicon germanium bipolar complementary metal-oxide semiconductor (SiGe BiCMOS), film-assisted molding, metalized polymer, monostatic frequency modulated continuous-wave (FMCW) radar, patch antennas, radar antenna-in-package (AiP), SU-8, system-in-package (SiP), through-polymer via (TPV)

Relation: IEEE Transactions on Components, Packaging and Manufacturing Technology--2156-3950--d704d33d-1ab7-4204-a863-8c76e16d4902; http://resolver.tudelft.nl/uuid:4bb660dd-31b0-4504-b467-0790dd2ae709; https://doi.org/10.1109/TCPMT.2022.3172618

الاتاحة: http://resolver.tudelft.nl/uuid:4bb660dd-31b0-4504-b467-0790dd2ae709
https://doi.org/10.1109/TCPMT.2022.3172618

المؤلفون: Jikai Xu, Zhihao Ren, Chengkuo Lee, Xianhao Le

المصدر: Micromachines
Micromachines, Vol 12, Iss 946, p 946 (2021)

مصطلحات موضوعية: Materials science, Fabrication, Internet of Thing (IoT), Wafer bonding, photonics, Silicon on insulator, wafer bonding, Nanotechnology, Hardware_PERFORMANCEANDRELIABILITY, Review, wearable electronics, sensor, System-in-Package (SiP), TJ1-1570, Hardware_INTEGRATEDCIRCUITS, Artificial Intelligence of Thing (AIoT), Wafer, Electronics, Mechanical engineering and machinery, Electrical and Electronic Engineering, Thin film, Wearable technology, 6G, business.industry, Mechanical Engineering, power electronics, Control and Systems Engineering, thin-film transfer, Photonics, business, heterogeneous integration, 5G

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::82e8b287eefa8e1796f76c282d031a1c
https://pubmed.ncbi.nlm.nih.gov/34442568

المؤلفون: Giuseppe Palmisano, Alessandro Parisi, Nunzio Spina, Egidio Ragonese

المصدر: Electronics, Vol 10, Iss 2328, p 2328 (2021)

مصطلحات موضوعية: TK7800-8360, Computer Networks and Communications, Computer science, amplitude shift keying (ASK), Integrated circuit, polyimide, Bottleneck, law.invention, law, Electronic engineering, Schottky diode, Electrical and Electronic Engineering, Transformer, multiplexing, transformers, Converters, electromagnetic coupling, Hardware and Architecture, Control and Systems Engineering, integrated circuits, oxide, rectifiers, system-in-package (SiP), Signal Processing, Electronics, Galvanic isolation, Electrical efficiency, Data transmission, Communication channel

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9c2c6aea07c6c24bcd671042b662f85b
http://hdl.handle.net/20.500.11769/512377

المؤلفون: Yi, H.

المساهمون: Zhang, Kouchi, Delft University of Technology

مصطلحات موضوعية: Radar, PCB, Mechanical characterization, Microelectronic packaging, Film assisted molding, Optical encoder, QFN, Through-Polymer Via, System-in-package (SiP), Shear test, Antenna-in-package, Vertical interconnection, Polymer, 3D integration

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::43903ee163664845dcebd741b8a490a7
https://doi.org/10.4233/uuid:df917670-8d78-4021-b409-5b3961b00f66

المؤلفون: Weerasekera, Roshan, 1973

المساهمون: Tenhunen, Hannu, Prof., Zheng, Li-Rong, Professor, Alvandpour, Atila, Professor

المصدر: Trita-ICT-ECS AVH.

مصطلحات موضوعية: Interconnects, Parasitic Extraction, Repeaters, Signal Integrity, System-on-Chip (SoP), System-in-Package (SiP), System-on-Package (SoP), Three-dimensional (3-D) Integration, Through-Silicon-Via (TSV), Vertical Integration, TECHNOLOGY, Information technology, TEKNIKVETENSKAP, Informationsteknik

وصف الملف: electronic

URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-9586
https://kth.diva-portal.org/smash/get/diva2:126651/FULLTEXT01.pdf
https://kth.diva-portal.org/smash/get/diva2:126651/ERRATA02.pdf

المؤلفون: Ren, Zhihao, Xu, Jikai, Le, Xianhao, Lee, Chengkuo

المساهمون: COLLEGE OF DESIGN AND ENGINEERING, ELECTRICAL AND COMPUTER ENGINEERING

المصدر: Scopus OA2021

مصطلحات موضوعية: 5G, 6G, Artificial intelligence of thing (AIoT), Heterogeneous integration, Internet of thing (IoT), Photonics, Power electronics, Sensor, System-in-package (SiP), Thin-film transfer, Wafer bonding, Wearable electronics

Relation: Ren, Zhihao, Xu, Jikai, Le, Xianhao, Lee, Chengkuo (2021-08-11). Heterogeneous wafer bonding technology and thin-film transfer technology-enabling platform for the next generation applications beyond 5g. Micromachines 12 (8) : 946. ScholarBank@NUS Repository. https://doi.org/10.3390/mi12080946; https://scholarbank.nus.edu.sg/handle/10635/233780

الاتاحة: https://scholarbank.nus.edu.sg/handle/10635/233780

المؤلفون: Gadhiya, Ghanshyam, Brämer, Birgit, Rzepka, Sven

مصطلحات موضوعية: system-in-package (SiP), fan-out wafer level packaging (FOWLP), parametric FE modelling, thermal cycling (TC), Package on Package (PoP)

وصف الملف: application/pdf

Relation: Electronic System-Integration Technology Conference (ESTC) 2018; 7th Electronic System-Integration Technology Conference, ESTC 2018. Proceedings; EuroPAT-MASIP; MERGE; 737497; 194654001; https://publica.fraunhofer.de/handle/publica/403530

الاتاحة: https://publica.fraunhofer.de/handle/publica/403530
https://doi.org/10.1109/ESTC.2018.8546352

المؤلفون: Dyck, Alexander, Rösch, Markus, Tessmann, Axel, Leuther, Arnulf, Kuri, Michael, Wagner, Sandrine, Gashi, Bersant, Schäfer, Jochen, Ambacher, Oliver

مصطلحات موضوعية: dielectric lens, GaAs monolithic microwave integrated circuit (MMIC), H-band, patch antenna, quartz antenna, system-in-package (SiP), terahertz antenna

Time: 667

Relation: IEEE Transactions on Terahertz Science and Technology; https://publica.fraunhofer.de/handle/publica/257697

الاتاحة: https://publica.fraunhofer.de/handle/publica/257697
https://doi.org/10.1109/TTHZ.2019.2910511

المؤلفون: Bersant Gashi, Oliver Ambacher, Markus Rosch, Jochen Schafer, Sandrine Wagner, M. Kuri, Axel Tessmann, Arnulf Leuther, Alexander Dyck

المساهمون: Publica

مصطلحات موضوعية: Materials science, quartz antenna, 02 engineering and technology, Integrated circuit, Effective radiated power, law.invention, Printed circuit board, System in package, law, Hardware_INTEGRATEDCIRCUITS, 0202 electrical engineering, electronic engineering, information engineering, Electrical and Electronic Engineering, Center frequency, terahertz antenna, patch antenna, Patch antenna, Radiation, business.industry, 020208 electrical & electronic engineering, Transmitter, 020206 networking & telecommunications, dielectric lens, Optoelectronics, system-in-package (SiP), Antenna gain, business, GaAs monolithic microwave integrated circuit (MMIC), H-band

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::58d0defdf06844c22684aa9710a0b1c5
https://publica.fraunhofer.de/handle/publica/257697

المؤلفون: Narayanachari, K V L V

Thesis Advisors: Raghavan, Srinivasan

مصطلحات موضوعية: Transition Metal Oxide Thin Films, System On Chip (SoC), System on Package (SiP), Thin Film Deposition, Ultra High Vacuum Thin Film Deposition, Pulsed Laser Ablation, Sputter Deposition, Oxide Thin Film Growth, Oxides On Silicon, Physical Vapor Deposition, ZrO2 Thin Films, ZrO2/Ge Thin Films, BaTiO3 Thin Films, SrTiO3 Thin Films, Materials Science

Relation: G27329

الاتاحة: http://etd.iisc.ernet.in/2005/3590
http://etd.iisc.ernet.in/abstracts/4458/G27329-Abs.pdf