المؤلفون: Norliza Ismail, Wan Yusmawati Wan Yusoff, Nor Azlian Abdul Manaf, Azuraida Amat, Nurazlin Ahmad, Emee Marina Salleh

المصدر: Defence Technology, Vol 39, Iss , Pp 86-102 (2024)

مصطلحات موضوعية: Defence technology, Solder alloy, Solder joints, Radiation-induced effect, Microstructure, Mechanical properties, Military Science

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2214914724000394; https://doaj.org/toc/2214-9147

URL الوصول: https://doaj.org/article/cfef1253c1ce41e8a5be61dbc6dde1d7

المؤلفون: Balázs Illés, Halim Choi, Krzysztof Szostak, Jaeduk Byun, Agata Skwarek

المصدر: Journal of Materials Research and Technology, Vol 32, Iss , Pp 609-620 (2024)

مصطلحات موضوعية: Nanoparticle, CuO, SAC composite solder alloy, Sn whisker, Corrosion, DFT, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785424017320; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/57ce477142754ba89ea5bd4461a3b981

المؤلفون: Jianglei Fan, Jiaojiao Wang, Xiao Wang, Zhanyun Liu, Shen Wu, Yan Wang, Ying Li, Xiangkui Zhou, Shizhong Wei

المصدر: Journal of Materials Research and Technology, Vol 29, Iss , Pp 2585-2596 (2024)

مصطلحات موضوعية: Sn-Cu solder alloy, Solidification parameters, Conductivity, Microstructure evolution, Hardness, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785424003156; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/71ccc14620dd4cfe9d81e49713442696

المؤلفون: Ruiz-Jacinto, Vicente-Segundo, Gutiérrez-Valverde, Karina-Silvana, Aslla-Quispe, Abrahan-Pablo, Burga-Falla, José-Manuel, Alarcón-Sucasaca, Aldo, Huamán-Romaní, Yersi-Luis

المصدر: Soldering & Surface Mount Technology, 2023, Vol. 36, Issue 2, pp. 69-79.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/SSMT-08-2023-0045

المؤلفون: Jana Körmendy, Ján Vavro

المصدر: Applied Sciences, Vol 14, Iss 18, p 8257 (2024)

مصطلحات موضوعية: tin alloys, solder alloy, antioxidant alloy, chemical composition, optical emission spectroscopy, Technology, Engineering (General). Civil engineering (General), TA1-2040, Biology (General), QH301-705.5, Physics, QC1-999, Chemistry, QD1-999

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2076-3417/14/18/8257; https://doaj.org/toc/2076-3417

URL الوصول: https://doaj.org/article/a6405db9648c4ad4911089280f8b29c9

المؤلفون: Pan Yi, Zhen Yang, Weidong Wang, Ting Zhang, Jin Xu, Kui Xiao, Chaofang Dong

المصدر: Journal of Materials Research and Technology, Vol 27, Iss , Pp 5607-5614 (2023)

مصطلحات موضوعية: SAC305 solder alloy, Bias, Electrochemical migration, Dendrite, Electrode reaction, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785423028168; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/dc17e6455ef544f6ae8aa1195f4e9ccf

المؤلفون: Tianhan Hu, Shun Li, Zhen Li, Guanzhi Wu, Ping Zhu, Wufeng Dong, Yu Sun, Jiayi Zhou, Bingjia Wu, Bingge Zhao, Kai Ding, Yulai Gao

المصدر: Journal of Materials Research and Technology, Vol 26, Iss , Pp 5902-5909 (2023)

مصطلحات موضوعية: Sn–Bi solder alloy, Ag addition, In addition, Mechanical properties, Ag3Sn phase, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785423021233; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/dfc43d9535f044e594db1fc0de0785ac

المؤلفون: Abdullah, Muhammad Asyraf, Idris, Siti Rabiatull Aisha

المصدر: Soldering & Surface Mount Technology, 2023, Vol. 35, Issue 4, pp. 208-217.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/SSMT-08-2022-0054

المؤلفون: Yunlong Zhai, Tianguo Wang, Mingyang Liu, Nan Zhou, Xintao Li

المصدر: Metals, Vol 14, Iss 6, p 689 (2024)

مصطلحات موضوعية: Al content, extruded–state, Zn-Al solder alloy, microstructure, property, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2075-4701/14/6/689; https://doaj.org/toc/2075-4701

URL الوصول: https://doaj.org/article/ec0a8b22bc684b0398f315ef8c995989

المؤلفون: Panju Shang, Feifei Tian, Zhi-Quan Liu

المصدر: Metals, Vol 14, Iss 2, p 139 (2024)

مصطلحات موضوعية: In-48Sn solder alloy, Cu substrate, interfacial reaction, intermetallic compound, TEM, Mining engineering. Metallurgy, TN1-997

Relation: https://www.mdpi.com/2075-4701/14/2/139; https://doaj.org/toc/2075-4701; https://doaj.org/article/7c9cd03f50e440f997715a0dad0881b6

الاتاحة: https://doi.org/10.3390/met14020139
https://doaj.org/article/7c9cd03f50e440f997715a0dad0881b6

المؤلفون: Dániel Straubinger, Peter Koltay, Roland Zengerle, Sabrina Kartmann, Zhe Shu

المصدر: Micromachines, Vol 15, Iss 6, p 743 (2024)

مصطلحات موضوعية: liquid metal, jet, solder alloy, 3D printing, lines, printed electronics, Mechanical engineering and machinery, TJ1-1570

Relation: https://www.mdpi.com/2072-666X/15/6/743; https://doaj.org/toc/2072-666X; https://doaj.org/article/96fe0da3298944679877f2f654d23a1f

الاتاحة: https://doi.org/10.3390/mi15060743
https://doaj.org/article/96fe0da3298944679877f2f654d23a1f

المؤلفون: Mohd Izrul Izwan RAMLI, Siti Farahnabilah MUHD AMLI, Norainiza SAUD, Dewi Suriyani CHE HALIN, Nur Akrimi Maswa MD FAUZI

المصدر: European Journal of Materials Science and Engineering, Vol 8, Iss 1, Pp 30-35 (2023)

مصطلحات موضوعية: hot air soldering levelling (hasl), intermetallic compound (imc), sn-0.7cu0.05ni solder alloy, Materials of engineering and construction. Mechanics of materials, TA401-492

وصف الملف: electronic resource

Relation: https://ejmse.ro/articles/08_01_04_EJMSE-22-163.pdf; https://doaj.org/toc/2537-4338; https://doaj.org/toc/2537-4346

URL الوصول: https://doaj.org/article/0017359e96f3466486e84705c8bfc407

المؤلفون: Samia E. Attia Negm, A.S. Abdel Moghny, Syed Ismail Ahmad

المصدر: Results in Materials, Vol 15, Iss , Pp 100316- (2022)

مصطلحات موضوعية: Melt-spin technique, Eutectic lead-free solders, Sn-Zn-Bi solder Alloy, Materials of engineering and construction. Mechanics of materials, TA401-492

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2590048X22000644; https://doaj.org/toc/2590-048X

URL الوصول: https://doaj.org/article/6447553a3b6f452482366f8ed530540d

المؤلفون: Rous, Pavel, Přibek, Petr, Steiner, František

مصطلحات موضوعية: intermetallic compound, intermetallic layers, solder alloy, thermal aging, reflow soldering

وصف الملف: 5 s.; application/pdf

Relation: Proceedings of the 2022 International Conference on Diagnostics in Electrical Engineering (Diagnostika) : CDEE 2022; ROUS, P. PŘIBEK, P. STEINER, F. Influence Of Thermal Aging On Intermetallic Compound Growth In Solder Alloys. In Proceedings of the 2022 International Conference on Diagnostics in Electrical Engineering (Diagnostika) : CDEE 2022. Pilsen: University of West Bohemia in Pilsen, 2022. s. nestránkováno. ISBN: 978-1-66548-082-6; 2-s2.0-85141358676; http://hdl.handle.net/11025/50539

الاتاحة: http://hdl.handle.net/11025/50539
https://doi.org/10.1109/Diagnostika55131.2022.9905224

المؤلفون: Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al Bakri Abdullah, Nur Syahirah Mohamad Zaimi, Andrei Victor Sandu, Petrica Vizureanu, Adam Rylski, Siti Farahnabilah Muhd Amli

المصدر: Materials, Vol 15, Iss 1451, p 1451 (2022)

مصطلحات موضوعية: intermetallic compound, alloying, surface finish, solder alloy, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85

Relation: https://www.mdpi.com/1996-1944/15/4/1451; https://doaj.org/toc/1996-1944; https://doaj.org/article/ef149b6029c34c54aabdbf38de9e3611

الاتاحة: https://doi.org/10.3390/ma15041451
https://doaj.org/article/ef149b6029c34c54aabdbf38de9e3611

المؤلفون: Erer, Ahmet Mustafa, Oguz, Serkan

المصدر: Soldering & Surface Mount Technology, 2019, Vol. 32, Issue 1, pp. 19-23.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/SSMT-08-2018-0028

المساهمون: Hua, Fay

المصدر: Materials Transactions JIM (The Japan Institute of Metals).; 43; 8; Other Information: Submitted to Materials Transactions JIM (The Japan Institute of Metals): Volume 43, No.8; Journal Publication Date: 08/2002; PBD: 15 Mar 2002

وصف الملف: Medium: ED; Size: vp.

URL الوصول: http://www.osti.gov/scitech/servlets/purl/840870

المؤلفون: Karel Dušek, Petr Veselý, David Bušek, Adam Petráč, Attila Géczy, Balázs Illés, Oliver Krammer

المصدر: Materials; Volume 14; Issue 24; Pages: 7909

مصطلحات موضوعية: solder flux, reflow soldering, SAC solder alloy, solder mask, surface finish

وصف الملف: application/pdf

Relation: Metals and Alloys; https://dx.doi.org/10.3390/ma14247909

الاتاحة: https://doi.org/10.3390/ma14247909

المؤلفون: Jialong Qiu, Yanzhi Peng, Peng Gao, Caiju Li

المصدر: Materials; Volume 14; Issue 9; Pages: 2335

مصطلحات موضوعية: Sn-Zn solder alloy, cluster-plus-glue-atom-model, mechanical property, microstructure, interfacial reaction

وصف الملف: application/pdf

Relation: https://dx.doi.org/10.3390/ma14092335

الاتاحة: https://doi.org/10.3390/ma14092335

المؤلفون: Yan Zhi Peng, Cai Ju Li, Jiao Jiao Yang, Jia Tao Zhang, Ju Bo Peng, Guang Ji Zhou, Cun Ji Pu, Jian Hong Yi

المصدر: Metals; Volume 11; Issue 4; Pages: 538

مصطلحات موضوعية: microstructure, lead-free, solder alloy, oxidation resistance, intermetallic

وصف الملف: application/pdf

Relation: https://dx.doi.org/10.3390/met11040538

الاتاحة: https://doi.org/10.3390/met11040538