المؤلفون: Čech, Martin, Beltman, Arend-Jan, Ozols, Kaspars

مصطلحات موضوعية: mechatronika, digitální dvojče, elektronika, průmyslové komunikace, robotika, mechatronics, digital twin, application specific integrated circuit (ASIC), electronics, industrial communication, computer vision, low‐power sensing, smart system integration, robotics, edge computing

وصف الملف: 19 s.; application/pdf

Relation: Applied Sciences; ČECH, M. BELTMAN, A. OZOLS, K. Pushing Mechatronic Applications to the Limits via Smart Motion Control. Applied Sciences, 2021, roč. 11, č. 18, s. 1-19. ISSN: 2076-3417; 2-s2.0-85114735077; http://hdl.handle.net/11025/47010; 699172500001

الاتاحة: http://hdl.handle.net/11025/47010
https://doi.org/10.3390/app11188337

المؤلفون: Mohamed, Sajid, van der Veen, Gijs, Kuppens, Hans, Vierimaa, Matias, Kanellos, Tassos, Stoutjesdijk, Henry, Masiero, Riccardo, Määttä, Kalle, van der Weit, Jan Wytze, Ribeiro, Gabriel, Bergmann, Ansgar, Colombo, Davide, Arenas, Javier, Keary, Alfie, Goubej, Martin, Rouxel, Benjamin, Kilpeläinen, Pekka, Kadikis, Roberts, Armendia, Mikel, Blaha, Petr, Stokkermans, Joep, Čech, Martin, Beltman, Arend-Jan

مصطلحات موضوعية: Reference framework, Smart system integration, AI, Digital twin, Data management, Cyber-physical systems, Mechatronics, Motion control, Edge computing

وصف الملف: application/pdf

Relation: info:eu-repo/grantAgreement/EC/H2020::ECSEL-RIA/101007311/EU/Intelligent Motion Control under Industry 4.E/IMOCO4.E; 2023 IEEE 28th International Conference on Emerging Technologies and Factory Automation (ETFA); Mohamed, S., van der Veen, G., Kuppens, H., Vierimaa, M., Kanellos, T., Stoutjesdijk, H., Masiero, R., Määttä, K., van der Weit, J. W., Ribeiro, G., Bergmann, A., Colombo, D., Arenas, J., Keary, A., Goubej, M., Rouxel, B., Kilpeläinen, P., Kadikis, R., Armendia, M., Blaha, P., Stokkermans, J., Čech, M. and Beltman, A.-J. (2023) 'The IMOCO4. E reference framework for intelligent motion control systems', 2023 IEEE 28th International Conference on Emerging Technologies and Factory Automation (ETFA), Sinaia, Romania, 12-15 September, pp. 1-8, doi:10.1109/ETFA54631.2023.10275410; 979-8-3503-3992-5; 979-8-3503-3990-1; 979-8-3503-3991-8; https://hdl.handle.net/10468/15272

الاتاحة: https://hdl.handle.net/10468/15272
https://doi.org/10.1109/etfa54631.2023.10275410

المؤلفون: Čech, Martin, Beltman, Arend-Jan, Ozols, Kaspars

مصطلحات موضوعية: smart system integration, mechatronics, motion control, digital twin, electronics systems, wireless communication, smart sensors, robotics, embedded systems, machine learning, artificial intelligence, cyber-physical systems

وصف الملف: 7 s.; application/pdf

Relation: IEEE International Conference on Emerging Technologies and Factory Automation, ETFA 2022; ČECH, M. BELTMAN, A. OZOLS, K. Digital Twins and AI in Smart Motion Control Applications. In IEEE International Conference on Emerging Technologies and Factory Automation, ETFA 2022. New York: IEEE, 2022. s. nestránkováno. ISBN: 978-1-66549-996-5 , ISSN: 1946-0740; 2-s2.0-85141412206; http://hdl.handle.net/11025/51461

الاتاحة: http://hdl.handle.net/11025/51461
https://doi.org/10.1109/ETFA52439.2022.9921533

المؤلفون: Martin Cech, Arend-Jan Beltman, Kaspars Ozols

مصطلحات موضوعية: mechatronics, robotics, machine learning, smart system integration, motion control, digital twin, smart sensors, embedded systems, wireless communication, artificial intelligence, cyber-physical systems, electronics systems

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::31bf219eb156e4d29ac26f4a3d3d0dfd
http://hdl.handle.net/11025/51461

المؤلفون: Prosa M., Benvenuti E., Kallweit D., Pellacani P., Toerker M., Bolognesi M., Lopez-Sanchez L., Ragona V., Marabelli F., Toffanin S.

المساهمون: Prosa, M., Benvenuti, E., Kallweit, D., Pellacani, P., Toerker, M., Bolognesi, M., Lopez-Sanchez, L., Ragona, V., Marabelli, F., Toffanin, S.

مصطلحات موضوعية: nanoplasmonic, nanostructured grating, organic light-emitting transistor, organic optical sensor, organic photodiode, organic photonic, smart system integration

وصف الملف: ELETTRONICO

Relation: info:eu-repo/semantics/altIdentifier/wos/WOS:000679842300001; volume:31; issue:50; firstpage:2104927; journal:ADVANCED FUNCTIONAL MATERIALS; http://hdl.handle.net/11571/1452539; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-85111666238

الاتاحة: http://hdl.handle.net/11571/1452539
https://doi.org/10.1002/adfm.202104927
https://onlinelibrary.wiley.com/doi/10.1002/adfm.202104927

المؤلفون: Čech, Martin, Beltman, Arend-Jan, Ozols, Kaspars

مصطلحات موضوعية: smart system integration, mechatronics, motion control, digital twin, electronics systems, wireless communication, smart sensors, robotics, embedded systems, service oriented architecture, cyber-physical systems

وصف الملف: 8 s.; application/pdf

Relation: Proceedings 2019 24th IEEE InternationalConference on Emerging Technologiesand Factory Automation (ETFA); ČECH, M., BELTMAN, A., OZOLS, K. I-MECH – Smart System Integration for Mechatronic Applications. In: Proceedings 2019 24th IEEE InternationalConference on Emerging Technologiesand Factory Automation (ETFA). Zaragoza: Institute of Electrical and Electronics Engineers Inc., 2019. s. 843-850. ISBN 978-1-72810-303-7 , ISSN 1946-0740.; 2-s2.0-85074193152; http://hdl.handle.net/11025/36672

الاتاحة: http://hdl.handle.net/11025/36672
https://doi.org/10.1109/ETFA.2019.8869465

المؤلفون: Michele Lora, Sara Vinco, Franco Fummi

مصطلحات موضوعية: virtual prototyping, Computer science, Design flow, 02 engineering and technology, system-level design, Theoretical Computer Science, Abstraction layer, Unified Modeling Language, 0202 electrical engineering, electronic engineering, information engineering, Representation (mathematics), Smart system integration , platform based design , heterogeneous systems , modeling , simulation , system-level design , virtual platforms , virtual prototyping, Abstraction (linguistics), computer.programming_language, Smart system, business.industry, modeling, computer.file_format, heterogeneous systems, simulation, Smart system integration, platform based design, virtual platforms, 020202 computer hardware & architecture, Variety (cybernetics), Computational Theory and Mathematics, Hardware and Architecture, Executable, Software engineering, business, computer, Software

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0e7d93176d7655514165fb2b873f1e5a
http://hdl.handle.net/11583/2730527

المؤلفون: Mayer, Dirk, Bein, Thilo, Buff, Hendrik, Götz, Benedict, Schwarzhaupt, Oliver, Spancken, Dominik

مصطلحات موضوعية: lightweight design, automotive, composite structure, life cycle analysis, smart system integration

Relation: International MERGE Technologies Conference Lightweight Structures (IMTC) 2017; 3rd International MERGE Technologies Conference 2017. Conference Proceedings; https://publica.fraunhofer.de/handle/publica/399665

الاتاحة: https://publica.fraunhofer.de/handle/publica/399665

المؤلفون: Mayer, Dirk, Bein, Thilo, Buff, Hendrik, Götz, Benedict, Schwarzhaupt, Oliver, Spancken, Dominik

مصطلحات موضوعية: lightweight design, automotive, composite structure, life cycle analysis, smart system integration

Time: 620

Relation: Journal of reinforced plastics and composites : JRPC; https://publica.fraunhofer.de/handle/publica/252458

الاتاحة: https://publica.fraunhofer.de/handle/publica/252458
https://doi.org/10.1177/0731684418762321

المؤلفون: Jeong, Seung Hee, Wu, Zhigang

المصدر: Micro Electro Mechanical Systems (MEMS), 2015 28th IEEE International Conference on Proceedings IEEE Micro Electro Mechanical Systems. :1137-1140

مصطلحات موضوعية: Liquid alloy, Stretchable electronics, Wireless power transfer, Smart system integration, Materialvetenskap, Materials Science

وصف الملف: print

URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-265529

المؤلفون: Oliver Schwarzhaupt, Benedict Götz, Dirk Mayer, Hendrik Buff, Dominik Spancken, Thilo Bein

المساهمون: Publica

مصطلحات موضوعية: composite structure, Materials science, Polymers and Plastics, business.industry, Mechanical Engineering, Automotive industry, life cycle analysis, 02 engineering and technology, 021001 nanoscience & nanotechnology, 020303 mechanical engineering & transports, 0203 mechanical engineering, smart system integration, Mechanics of Materials, Materials Chemistry, Ceramics and Composites, lightweight design, automotive, Composite material, 0210 nano-technology, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cfb844fbbeaf423044dd3bbaac578661
https://publica.fraunhofer.de/handle/publica/252458

المؤلفون: F. R. Bertani, P. Bourgos, L. Businaro, L. Gambacorta, A. Gerardino, S. Hintschich, G. Koutalieris, M. Logothetis, E. Martinelli, G.J. Nychas, M. Solfrizzo, M. Tosic, Y.Weesepoel, G. Wunder

المصدر: MNE 2017, 43rd International CONFERENCE on MICRO AND NANOENGINEERING, pp. 86, Braga, Portugal, 18-22/10/2017
info:cnr-pdr/source/autori:F. R. Bertani, P. Bourgos, L. Businaro, L. Gambacorta, A. Gerardino, S. Hintschich, G. Koutalieris, M. Logothetis, E. Martinelli, G.J. Nychas, M. Solfrizzo, M. Tosic, Y.Weesepoel, G. Wunder/congresso_nome:MNE 2017, 43rd International CONFERENCE on MICRO AND NANOENGINEERING/congresso_luogo:Braga, Portugal/congresso_data:18-22%2F10%2F2017/anno:2017/pagina_da:86/pagina_a:/intervallo_pagine:86

مصطلحات موضوعية: food safety, aflatoxins, spectroscopy based sensors, smart system integration, spoliage

URL الوصول: https://explore.openaire.eu/search/publication?articleId=cnr_________::5a7041559e7b0df5a72c9a08e1eeec6d
https://publications.cnr.it/doc/378092

المؤلفون: Alajoki, Teemu, Koponen, Matti, Huttunen, Arttu, Tuomikoski, Markus, Heikkinen, Mikko, Keränen, Antti, Keränen, Kimmo, Mäkinen, Jukka-Tapani, Jaakola, Tuomo, Aikio, Janne, Rönkä, Kari

المصدر: Alajoki , T , Koponen , M , Huttunen , A , Tuomikoski , M , Heikkinen , M , Keränen , A , Keränen , K , Mäkinen , J-T , Jaakola , T , Aikio , J & Rönkä , K 2013 , Hybrid in-mould integration . in 46th International Symposium on Microelectronics, IMAPS 2013 . Curran Associates Inc. , pp. 188-193 , 46th International Symposium on Microelectronics, IMAPS 2013 , Orlando , California , United States , 30/09/13 .

مصطلحات موضوعية: printed electronics, hybrid integration, injection overmoulding, in-mould labelling, smart system integration, /dk/atira/pure/sustainabledevelopmentgoals/industry_innovation_and_infrastructure, name=SDG 9 - Industry, Innovation, and Infrastructure

الاتاحة: https://cris.vtt.fi/en/publications/73d09978-edcd-405a-ad9e-47352607384b

المؤلفون: Karioja, Pentti, Mäkinen, Jukka-Tapani, Keränen, Kimmo, Aikio, Janne, Alajoki, Teemu, Jaakola, Tuomo, Koponen, Matti, Keränen, Antti, Heikkinen, Mikko, Tuomikoski, Markus, Suhonen, Riikka, Hakalahti, Leena, Kopola, Pälvi, Hast, Jukka, Liedert, Ralph, Hiltunen, Jussi, Masuda, Noriyuki, Kemppainen, Antti, Rönkä, Kari, Korhonen, Raimo

المساهمون: Varadan, Vijay K.

المصدر: Karioja , P , Mäkinen , J-T , Keränen , K , Aikio , J , Alajoki , T , Jaakola , T , Koponen , M , Keränen , A , Heikkinen , M , Tuomikoski , M , Suhonen , R , Hakalahti , L , Kopola , P , Hast , J , Liedert , R , Hiltunen , J , Masuda , N , Kemppainen , A , Rönkä , K & Korhonen , R 2012 , Printed hybrid systems . in V K Varadan (ed.) , Proceedings of SPIE : Nanosensors, Biosensors, and Info-Tech ....

مصطلحات موضوعية: embedding, hot lamination, multilayer polymer substrate, over-molding, printed electronics, smart system integration, /dk/atira/pure/sustainabledevelopmentgoals/industry_innovation_and_infrastructure, name=SDG 9 - Industry, Innovation, and Infrastructure

الاتاحة: https://cris.vtt.fi/en/publications/d05a838b-8b38-4aee-9d4b-1873316c466a
https://doi.org/10.1117/12.915206

مصطلحات موضوعية: smart system integration, hybrid integration, injection overmoulding, in-mould labelling, printed electronics

URL الوصول: https://explore.openaire.eu/search/publication?articleId=dris___01229::f7f01ab916dcb18b96dce9ae5f1e5fb5
https://cris.vtt.fi/en/publications/73d09978-edcd-405a-ad9e-47352607384b

المؤلفون: Weimert, B.

مصطلحات موضوعية: Mikrosystemtechnik, Mikro-Nano-Integration, smart system integration, Herstellungs- und Strukturierungsverfahren, Werkstoff, Smart Dust, MEMS, microsystem, fabrication process, micromanufacturing, material

Time: 620, 356

Relation: Strategie und Technik; https://publica.fraunhofer.de/handle/publica/219116

الاتاحة: https://publica.fraunhofer.de/handle/publica/219116

المؤلفون: Pötter, H., Hampicke, M., Lang, K.-D., Schmitz, S., Reichl, H.

مصطلحات موضوعية: system-in-package, SIP, More than Moore, heterogenous integration, smart system integration, embedding

Time: 621

Relation: Elektronik; https://publica.fraunhofer.de/handle/publica/216867

الاتاحة: https://publica.fraunhofer.de/handle/publica/216867

المؤلفون: Pötter, H., Großer, V., Lang, K.-D., Reichl, H., Schmitz, S., Wolf, J.

مصطلحات موضوعية: heterogenous integration, smart system integration, autarker Sensor, Sensornetzwerk, Maschinenbau

Time: 621, 658

Relation: wt Werkstattstechnik online; https://publica.fraunhofer.de/handle/publica/212820

الاتاحة: https://publica.fraunhofer.de/handle/publica/212820

المؤلفون: H. Pötter, V. Großer, K.-D. Lang, H. Reichl, S. Schmitz, J. Wolf

المساهمون: Publica

مصطلحات موضوعية: autarker Sensor, Sensornetzwerk, smart system integration, Maschinenbau, Control and Systems Engineering, Automotive Engineering, heterogenous integration

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7de7fe6a2bccf7a064ff01b0dd1055f8
https://publica.fraunhofer.de/handle/publica/212820

المؤلفون: Reichl, H., Aschenbrenner, R., Pötter, H., Schmitz, S.

مصطلحات موضوعية: More than Moore, system-in-package, heterogenous integration, smart system integration, sensor network

Time: 621

Relation: German Technology - Electronics Production Equipment. 9th Edition; https://publica.fraunhofer.de/handle/publica/217276

الاتاحة: https://publica.fraunhofer.de/handle/publica/217276