المؤلفون: Akihiro KAWABE, Hiromitsu OHNO, Sohji SAKATA, Toshio HATSUDA, Toshiro YAMASHINA, Yuko HIROHATA, 初田 俊雄, 坂田 荘司, 大野 啓充, 山科 俊郎, 川辺 明博, 広畑 優子

المصدر: 日本機械学会論文集 A編 / Transactions of the Japan Society of Mechanical Engineers Series A. 1997, 63(607):643

المؤلفون: Wang, Fengtao, Liu, Fuhan, Kong, Linghua, Sundaram, Venky, Tummala, Rao R., Adibi, Ali

المساهمون: Center for Organic Photonics and Electronics, Georgia Institute of Technology. Center for Organic Photonics and Electronics, Georgia Institute of Technology. School of Electrical and Computer Engineering

مصطلحات موضوعية: Flip-chip devices, Interconnections, Lithography, Packaging, Printed circuit board substrates, Printed circuit fabrication

وصف الملف: application/pdf

Relation: Wang, F.; Liu, F.; Kong, L.; Sundaram, V.; Tummala, R.R. and Adibi, A., "Proximity Lithography in Sub-10 Micron Circuitry for Packaging Substrate," IEEE Transactions on Advanced Packaging, Vol. 33, no.4, pp.876-882 (November 2010).; 1521-3323 (print); http://hdl.handle.net/1853/47783

الاتاحة: http://hdl.handle.net/1853/47783
https://doi.org/10.1109/TADVP.2010.2072505

المؤلفون: Koledintseva, Marina, Vincent, Tracey, Scogna, Antonio Ciccomancini, Hinaga, Scott

المصدر: Electrical and Computer Engineering Faculty Research & Creative Works

مصطلحات موضوعية: Dielectric measurements, numerical analysis, printed circuit fabrication, rough surfaces, stripline, Electrical and Computer Engineering

وصف الملف: application/pdf

Relation: https://scholarsmine.mst.edu/ele_comeng_facwork/5113; https://scholarsmine.mst.edu/context/ele_comeng_facwork/article/6142/viewcontent/Method_of_Effective_Roughness_Dielectric_in_a_PCB_Measurement_and_Full_Wave_Simulation_Verificat.pdf

الاتاحة: https://scholarsmine.mst.edu/ele_comeng_facwork/5113
https://doi.org/10.1109/TEMC.2015.2412113
https://scholarsmine.mst.edu/context/ele_comeng_facwork/article/6142/viewcontent/Method_of_Effective_Roughness_Dielectric_in_a_PCB_Measurement_and_Full_Wave_Simulation_Verificat.pdf