المؤلفون: Choi, Uimin, Blaabjerg, Frede, Jørgensen, Søren

المصدر: Choi , U , Blaabjerg , F & Jørgensen , S 2018 , ' Power Cycling Test Methods for Reliability Assessment of Power Device Modules in Respect to Temperature Stress ' , I E E E Transactions on Power Electronics , vol. 33 , no. 3 , 7922584 , pp. 2531-2551 . https://doi.org/10.1109/TPEL.2017.2690500

مصطلحات موضوعية: Failure mechanism, Insulated gate bipolar transistor (IGBT), Power cycling (PC) test, Power device module, Reliability, Wear-out failure

وصف الملف: application/pdf

الاتاحة: https://vbn.aau.dk/da/publications/d49066e4-ad1a-4e82-a7c1-d42402829da9
https://doi.org/10.1109/TPEL.2017.2690500
https://vbn.aau.dk/ws/files/283435456/07922584.pdf
http://www.scopus.com/inward/record.url?scp=85038943924&partnerID=8YFLogxK

المؤلفون: Ke Ma, Frede Blaabjerg, Ui-Min Choi

المصدر: Choi, U-M, Ma, K & Blaabjerg, F 2018, ' Validation of Lifetime Prediction of IGBT Modules Based on Linear Damage Accumulation by Means of Superimposed Power Cycling Tests ', I E E E Transactions on Industrial Electronics, vol. 65, no. 4, 8036253, pp. 3520-3529 . https://doi.org/10.1109/TIE.2017.2752142

مصطلحات موضوعية: Engineering, Power cycling test, 02 engineering and technology, 01 natural sciences, Stress (mechanics), Reliability (semiconductor), IGBT module, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, Electronic engineering, Electrical and Electronic Engineering, Simulation, 010302 applied physics, business.industry, 020208 electrical & electronic engineering, Insulated-gate bipolar transistor, Converters, Swing, Lifetime prediction, Power converter, Reliability, Power device module, Power (physics), Control and Systems Engineering, Power cycling, Junction temperature, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a73dfd2c3b3ca22e6ab6673f2d487e95
https://vbn.aau.dk/da/publications/d80e9554-04ec-4c41-b904-901204e9464b

المؤلفون: Soren Jorgensen, Frede Blaabjerg, Ui-Min Choi

المصدر: Choi, U, Blaabjerg, F & Jørgensen, S 2015, Junction temperature estimation for an advanced active power cycling test . in Proceedings of the 2015 9th International Conference on Power Electronics and ECCE Asia (ICPE-ECCE Asia) . IEEE Press, pp. 2944-2950, 9th International Conference on Power Electronics and ECCE Asia (ICPE-ECCE Asia 2015), Seoul, Korea, Republic of, 01/06/2015 . https://doi.org/10.1109/ICPE.2015.7168194

مصطلحات موضوعية: Power cycling test, Materials science, TSEP, AC power, Temperature measurement, Power device module, Power (physics), Control theory, Power cycling, Electronic engineering, Temperature sensitive, Junction temperature, Cycling, Voltage, Junction temperature estimation

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::de496f562da66a8457a296939e0da2ad
https://vbn.aau.dk/da/publications/61c6e1d6-1bfc-4d83-95aa-bb3be613601f

المؤلفون: 田浩倫, Hao-Luen Tain

المساهمون: 徐清祥, Charles Ching-Hsiang Hsu

مصطلحات موضوعية: 智慧型功率晶片, 功率晶片, 智慧型功率元件模組, 功率元件模組, 自我啟動, intelligent power chip, power chip, intelligent power device module, power device module, self powering

Time: 47

وصف الملف: 3549140 bytes; application/octet-stream

Relation: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/4753

الاتاحة: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/4753