المؤلفون: ALAVI, Omid, DE CEUNINCK, Ward, DAENEN, Michael

المساهمون: Daenen, Michael/0000-0002-9221-4932, ALAVI, Omid, DE CEUNINCK, Ward, DAENEN, Michael

مصطلحات موضوعية: Bayerer lifetime model, Coffin-Manson, IGBT lifetime prediction, junction temperature, Monte Carlo simulations, power cycling tests

وصف الملف: application/pdf

Relation: Energies (Basel), 17 (11) (Art N° 2616); http://hdl.handle.net/1942/43305; 11; 17; 001245556600001

الاتاحة: http://hdl.handle.net/1942/43305
https://doi.org/10.3390/en17112616

المؤلفون: G. Kiesiewicz, T. Knych, A. Mamala, P. Kwasniewski, K. Korzen, M. Zasadzinska, A. Kawecki, P. Kowalewski

المصدر: Metalurgija, Vol 62, Iss 3-4, Pp 461-463 (2023)

مصطلحات موضوعية: enameled wires, copper alloy, Shark connectors, power cycling tests, resistance, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: https://hrcak.srce.hr/file/434331; https://doaj.org/toc/0543-5846; https://doaj.org/toc/1334-2576

URL الوصول: https://doaj.org/article/92b41706554e4b77a5fb929ec1e8ff24

المؤلفون: Khatir, Zoubir, Lallemand, Richard, Ibrahim, Ali, Ingrosso, Damien

المساهمون: Systèmes et Applications des Technologies de l'Information et de l'Energie (SATIE), École normale supérieure - Rennes (ENS Rennes)-Conservatoire National des Arts et Métiers CNAM (CNAM)-Université Paris-Saclay-Centre National de la Recherche Scientifique (CNRS)-Ecole Normale Supérieure Paris-Saclay (ENS Paris Saclay)-Université Gustave Eiffel-CY Cergy Paris Université (CY)

المصدر: ISSN: 0885-8993 ; IEEE Transactions on Power Electronics ; https://hal.science/hal-04154662 ; IEEE Transactions on Power Electronics, 2023, 38 (9), ⟨10.1109/TPEL.2023.3289890⟩.

مصطلحات موضوعية: Power cycling tests, IGBT power modules, DC and switching tests, thermal stresses, lifetime, [SPI.TRON]Engineering Sciences [physics]/Electronics

Relation: hal-04154662; https://hal.science/hal-04154662; https://hal.science/hal-04154662/document; https://hal.science/hal-04154662/file/FINAL%20VERSION.pdf

الاتاحة: https://hal.science/hal-04154662
https://hal.science/hal-04154662/document
https://hal.science/hal-04154662/file/FINAL%20VERSION.pdf
https://doi.org/10.1109/TPEL.2023.3289890

المؤلفون: Zhang, Kaichen, Iannuzzo, Francesco

المصدر: Zhang , K & Iannuzzo , F 2022 , Measuring Temperature Swing with Optical Fibers during Power Cycling of Power Components . in 2022 IEEE 13th International Symposium on Power Electronics for Distributed Generation Systems, PEDG 2022 . IEEE (Institute of Electrical and Electronics Engineers) , IEEE International Symposium on Power Electronics for Distributed Generation Systems (PEDG) , 13th International Symposium on Power Electronics for Distributed Generation Systems (PEDG 2022) , Kiel , Germany , 26/06/2022 . https://doi.org/10.1109/PEDG54999.2022.9923077

مصطلحات موضوعية: Accelerated power cycling tests, Junction temperature measurement, Lifetime prediction, On-line monitoring, Reliability

وصف الملف: application/pdf

Relation: urn:ISBN:9781665466189

الاتاحة: https://vbn.aau.dk/da/publications/13aeb78e-584f-42e2-b9a0-7bdb60216a18
https://doi.org/10.1109/PEDG54999.2022.9923077
https://vbn.aau.dk/ws/files/492365183/Measuring_Temperature_Swing_with_Optical_Fibers_during_Power_Cycling_of_Power_Components.pdf
http://www.scopus.com/inward/record.url?scp=85142087438&partnerID=8YFLogxK
https://ieeexplore.ieee.org/document/9923077

المؤلفون: Reigosa, Paula Diaz, Luo, Haoze, Iannuzzo, Francesco

المصدر: Reigosa , P D , Luo , H & Iannuzzo , F 2019 , ' Implications of Ageing through Power Cycling on the Short Circuit Robustness of 1.2-kV SiC MOSFETs ' , IEEE Transactions on Power Electronics , vol. 34 , no. 11 , 8634945 , pp. 11182 - 11190 . https://doi.org/10.1109/TPEL.2019.2897636

مصطلحات موضوعية: Logic gates, Silicon carbide, MOSFET, Wires, Degradation, Reliability, Junctions, SiC MOSFET, short circuit, accelerated power cycling tests, aging indicators, thermal cycling, Kelvin terminal, gate-oxide, power semiconductor device, Silicon carbide (SiC) mosfet

وصف الملف: application/pdf

الاتاحة: https://vbn.aau.dk/da/publications/acbaf80c-98df-4435-a894-60a918916c50
https://doi.org/10.1109/TPEL.2019.2897636
https://vbn.aau.dk/ws/files/308305143/Implications_of_Ageing_through_Power_Cycling_on_the_Short_Circuit_Robustness_of_1.2_kV_SiC_MOSFETs.pdf
http://www.scopus.com/inward/record.url?scp=85072099352&partnerID=8YFLogxK

المؤلفون: Kiesiewicz, G., Knych, T., Mamala, A., Kwasniewski, P., Korzen, K., Zasadzinska, M., Kawecki, A., Kowalewski, P.

المصدر: Metalurgija
Volume 62
Issue 3-4

مصطلحات موضوعية: enameled wires, copper alloy, Shark connectors, power cycling tests, resistance

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=od_______951::6afd4578d116690bb603bc4c3b17e50d
https://hrcak.srce.hr/file/434331

المؤلفون: Luo, Haoze, Reigosa, Paula Diaz, Iannuzzo, Francesco, Blaabjerg, Frede

المصدر: Luo , H , Reigosa , P D , Iannuzzo , F & Blaabjerg , F 2018 , ' On-line solder layer degradation measurement for SiC-MOSFET modules under accelerated power cycling condition ' , Microelectronics Reliability , vol. 88-90 , pp. 563-567 . https://doi.org/10.1016/j.microrel.2018.07.128

مصطلحات موضوعية: Body diode, Power cycling tests, Scanning acoustic microscopy, SiC power MOSFETs, Solder layer degradation

وصف الملف: application/pdf

Relation: https://vbn.aau.dk/da/publications/301b2ddb-9260-4878-8519-819521075fde

الاتاحة: https://vbn.aau.dk/da/publications/301b2ddb-9260-4878-8519-819521075fde
https://doi.org/10.1016/j.microrel.2018.07.128
https://vbn.aau.dk/ws/files/295468256/Submission_2018.pdf
http://www.scopus.com/inward/record.url?scp=85054816099&partnerID=8YFLogxK

المؤلفون: Francesco Iannuzzo, Kaichen Zhang

المصدر: Zhang, K & Iannuzzo, F 2022, Measuring Temperature Swing with Optical Fibers during Power Cycling of Power Components . in 2022 IEEE 13th International Symposium on Power Electronics for Distributed Generation Systems, PEDG 2022 . IEEE, IEEE International Symposium on Power Electronics for Distributed Generation Systems (PEDG), 13th International Symposium on Power Electronics for Distributed Generation Systems (PEDG 2022), Kiel, Germany, 26/06/2022 . https://doi.org/10.1109/PEDG54999.2022.9923077

مصطلحات موضوعية: Accelerated power cycling tests, On-line monitoring, Lifetime prediction, Junction temperature measurement, Reliability

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6ecb4830b9f87e9aa20f5a0c68d59b9c
https://doi.org/10.1109/pedg54999.2022.9923077

المؤلفون: Nuzzo, G. Di, Tuellmann, M., Methfessel, Torsten S., Rzepka, Sven

مصطلحات موضوعية: Condition monitoring, Electric vehicles, Inverter, Power cycling tests, Predictive maintenance, Reliability, Remaining useful life, Si power modules, SiC power modules

Relation: Microelectronics reliability; https://publica.fraunhofer.de/handle/publica/443035

الاتاحة: https://publica.fraunhofer.de/handle/publica/443035
https://doi.org/10.1016/j.microrel.2022.114614

المؤلفون: G. Di Nuzzo, M. Tuellmann, T. Methfessel, S. Rzepka

المساهمون: Publica

مصطلحات موضوعية: Power cycling tests, Electric vehicles, Remaining useful life, Predictive maintenance, Si power modules, Condensed Matter Physics, Reliability, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Condition monitoring, SiC power modules, Inverter, Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::329e0f90358dc9f651df69e023552fce
https://publica.fraunhofer.de/handle/publica/443035

المصدر: Other Information: From Fuels and materials development program quarterly progress report for period ending December 31, 1969. UNCL. Orig. Receipt Date: 31-DEC-70

وصف الملف: Medium: ED

URL الوصول: http://www.osti.gov/scitech/servlets/purl/4128186

المؤلفون: Brinkfeldt, Klas, Wetter, Göran, Lövberg, Andreas, Andersson, Dag, Toth-Pal, Zsolt, Forslund, Mattias, Shisha, Samer

المصدر: ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018.

مصطلحات موضوعية: Automotive industry, Efficiency, Electric railroads, Electronics industry, Electronics packaging, Failure (mechanical), High temperature operations, Microsystems, Outages, Silicon carbide, Blocking voltage, Failure mechanism, Higher frequencies, Lower switching loss, Power cycling tests, Scanning Acoustic Microscopy, Si-based devices, Silicon carbides (SiC), Power semiconductor devices

وصف الملف: print

URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:ri:diva-37000