المؤلفون: Yongjia Wu, Peng Zhang, Sen Chen, Congcong Zhi, Tianhao Shi, Tingrui Gong, Tingzhen Ming

المصدر: Case Studies in Thermal Engineering, Vol 58, Iss , Pp 104350- (2024)

مصطلحات موضوعية: Thermoelectric cooler, Transient cooling, Temperature control, Power chip cooling, Engineering (General). Civil engineering (General), TA1-2040

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2214157X24003812; https://doaj.org/toc/2214-157X

URL الوصول: https://doaj.org/article/e9c9b66e09364c58b30b811b9342ce23

المؤلفون: Zhang Nan, Liu Ruiwen, Kong Yanmei, Ye Yuxin, Du Xiangbin, Cong Bo, Yu Lihang, Wang Zhiqiang, Dai Yang, Li Wei, Jiao Binbin, Duan Zhiyong

المصدر: Thermal Science, Vol 26, Iss 2 Part B, Pp 1531-1543 (2022)

مصطلحات موضوعية: embedded cooling, manifold, micro-channel, thermal test chip, power chip, Mechanical engineering and machinery, TJ1-1570

Relation: https://doaj.org/toc/0354-9836; https://doaj.org/toc/2334-7163; https://doaj.org/article/c6e15b92b19e431685c96a437367a551

الاتاحة: https://doi.org/10.2298/TSCI210908328Z
https://doaj.org/article/c6e15b92b19e431685c96a437367a551

المؤلفون: Liu, Yang, Zhang, Hao, Wang, Lingen, Fan, Xuejun, Zhang, Guoqi, Sun, F.

المصدر: Soldering & Surface Mount Technology, 2019, Vol. 31, Issue 1, pp. 20-27.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/SSMT-01-2018-0005

المؤلفون: Quan, Cao Xuan, Xuan, Vu Khanh, Lan Anh, Luu Thi, Son, Vo Thach

المصدر: Communications in Physics; Vol 24, No 3 (2014); 267 ; 0868-3166 ; 10.15625/0868-3166-24-3

مصطلحات موضوعية: high power chip on board light emitting diode (HPCOBLED), luminous flux and integrated sphere, chip on Board

وصف الملف: application/pdf

Relation: http://vjs.ac.vn/index.php/cip/article/view/4231/pdf; http://vjs.ac.vn/index.php/cip/article/view/4231

الاتاحة: http://vjs.ac.vn/index.php/cip/article/view/4231
https://doi.org/10.15625/0868-3166/24/3/4231

المؤلفون: Guoqi Zhang, Hao Zhang, Lingen Wang, Fenglian Sun, Xuejun Fan, Yang Liu

المصدر: Soldering and Surface Mount Technology, 31(1)

مصطلحات موضوعية: Materials science, Double-side assembly, Power chip, Sintering, Stress distribution, Condensed Matter Physics, Chip, Reliability, Finite element method, Stress (mechanics), Soldering, Power module, General Materials Science, Yield rate, Electrical and Electronic Engineering, Composite material

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6eb704fe1e673eac78deb227a3455a71
https://doi.org/10.1108/ssmt-01-2018-0005

المؤلفون: Duric, Milovan, Palomar Pérez, Óscar, Smith, Aaron, Stanic, Milan, Unsal, Osman Sabri, Cristal Kestelman, Adrián, Valero Cortés, Mateo, Burger, Doug, Veidenbaum, Alexander V

المساهمون: Universitat Politècnica de Catalunya. Departament d'Arquitectura de Computadors, Universitat Politècnica de Catalunya. CAP - Grup de Computació d'Altes Prestacions

مصطلحات موضوعية: Àrees temàtiques de la UPC::Enginyeria electrònica::Microelectrònica, Àrees temàtiques de la UPC::Informàtica::Arquitectura de computadors, Microprocessors, Computer architecture, DLP accelerator, DVX enabled 4-core EDGE CMP, EDGE architecture, Cost-effective technique, Data parallel workloads, Dedicated accelerator, Dynamic vector execution, Energy efficient substrate, Energy-delay product, Explicit data graph execution, Functionality, General purpose CMP, General purpose EDGE chip, Multiprocessor, High performance vector design, Low power chip multiprocessor, Minimal hardware, Modest processor, Special-purpose vector architecture, Vector accelerator, Vector control, Vector processor, Microprocessor chips, Multiprocessing systems, Computational modeling, Hardware

وصف الملف: 8 p.

Relation: http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6893190; info:eu-repo/grantAgreement/EC/FP7/321253/EU/Riding on Moore's Law/ROMOL; Duric, M. [et al.]. Dynamic-vector execution on a general purpose EDGE chip multiprocessor. A: International Conference on Embedded Computer Systems: Architectures, Modeling and Simulation. "International Conference on Embedded Computer Systems: Architectures, Modeling and Simulation (SAMOS XIV): proceedings: July 14-17, 2014: Samos, Greece". Samos: Institute of Electrical and Electronics Engineers (IEEE), 2014, p. 18-25.; http://hdl.handle.net/2117/27788

الاتاحة: http://hdl.handle.net/2117/27788
https://doi.org/10.1109/SAMOS.2014.6893190

المؤلفون: Hamed H. Saber, Mohamed S. El-Genk

المصدر: IEEE Transactions on Components and Packaging Technologies. 31:165-172

مصطلحات موضوعية: Materials science, Incendie, Thermal resistance, Liquid dielectric, Thermodynamics, Fire, Electronic, Optical and Magnetic Materials, Subcooling, Thermal conductivity, Heat flux, Boiling, Heat transfer, composite spreader, copper (CU), dielectric liquid, high-power chip, non-uniform heat flux, nucleate boiling, porous graphite (PG), power dissipation, thermal resistance, Electrical and Electronic Engineering, Composite material, Nucleate boiling

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e767d9e1398d1b2eb012da872e97d256
https://doi.org/10.1109/tcapt.2008.916847

المؤلفون: Jafarian, Hossein, Daneshkhah, Ali, Shrestha, Sudhir, Agarwal, Mangilal, Rizkalla, Maher, Varahramyan, Kody

مصطلحات موضوعية: sensor integrated low-power chip, complementary metal-oxide-semiconductor technology, integrated circuit design, application specific integrated circuits, system on chip

وصف الملف: application/pdf

Relation: Jafarian, Hossein, Ali Daneshkhah, Sudhir Shrestha, Mangilal Agarwal, Maher Rizkalla, and Kody Varahramyan. (2013, April 5). Low-Power ASIC Design for Multiple Integrated Sensors Applications. Poster session presented at IUPUI Research Day 2013, Indianapolis, Indiana.; https://hdl.handle.net/1805/6731

الاتاحة: https://hdl.handle.net/1805/6731

المؤلفون: Osman Unsal, Doug Burger, Alexander V. Veidenbaum, Adrian Cristal, Oscar Palomar, Aaron L. Smith, Milovan Duric, Mateo Valero, Milan Stanic

المساهمون: Universitat Politècnica de Catalunya. Departament d'Arquitectura de Computadors, Barcelona Supercomputing Center, Universitat Politècnica de Catalunya. CAP - Grup de Computació d'Altes Prestacions

المصدر: ICSAMOS
UPCommons. Portal del coneixement obert de la UPC
Universitat Politècnica de Catalunya (UPC)
Recercat. Dipósit de la Recerca de Catalunya
Universitat Jaume I

مصطلحات موضوعية: DVX enabled 4-core EDGE CMP, Speedup, Computer science, Explicit data graph execution, Parallel computing, Instruction set, Energy efficient substrate, Dynamic vector execution, Functionality, General purpose CMP, Vector control, General purpose EDGE chip, Microprocessor chips, Dedicated accelerator, Message systems, 1. No poverty, Registers, Computational modeling, Special-purpose vector architecture, EDGE architecture, Vectors, Chip, Arquitectura d'ordinadors, Enginyeria electrònica::Microelectrònica [Àrees temàtiques de la UPC], Vector processor, High performance vector design, Multiprocessor, Enhanced Data Rates for GSM Evolution, Low power chip multiprocessor, Efficient energy use, Multiprocessing, Data parallel workloads, Cost-effective technique, Instruction sets, Hardware, Energy-delay product, Modest processor, Computer architecture, Microprocessors, Informàtica::Arquitectura de computadors [Àrees temàtiques de la UPC], Multiprocessing systems, business.industry, DLP accelerator, Vector accelerator, Embedded system, Microprocessadors, Minimal hardware, business

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::65626af2bd51d5ffc4980c6882176d10
https://doi.org/10.1109/samos.2014.6893190

المؤلفون: Kudithipudi, Dhireesha, Petko, S., John, E.

مصطلحات موضوعية: cache storage, circuit analysis computing, embedded systems, leakage currents, microprocessor chip, power chip, envir, manag

Relation: http://hdl.handle.net/1850/7267

الاتاحة: http://hdl.handle.net/1850/7267

المؤلفون: Chen, Kevin J., Zhou, Chunhua

مصطلحات موضوعية: Dry etching, Enhancement-mode AlGaN/GaN HEMT, Fluorine plasma ion implantation, Smart power chip technology

Relation: http://repository.ust.hk/ir/Record/1783.1-47427; Physica status solidi. A, Applications and materials science, v. 208, (2), February 2011, p. 434-438; https://doi.org/10.1002/pssa.201000631; http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=1862-6300&rft.volume=208&rft.issue=2&rft.date=2011&rft.spage=434&rft.aulast=Chen&rft.aufirst=Kevin+J.&rft.atitle=Enhancement-mode+AlGaN%2FGaN+HEMT+and+MIS-HEMT+technology&rft.title=Physica+status+solidi.+A,+Applications+and+materials+science; http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000288087100018; http://www.scopus.com/record/display.url?eid=2-s2.0-79751505917&origin=inward

الاتاحة: http://repository.ust.hk/ir/Record/1783.1-47427
https://doi.org/10.1002/pssa.201000631
http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=1862-6300&rft.volume=208&rft.issue=2&rft.date=2011&rft.spage=434&rft.aulast=Chen&rft.aufirst=Kevin+J.&rft.atitle=Enhancement-mode+AlGaN%2FGaN+HEMT+and+MIS-HEMT+technology&rft.title=Physica+status+solidi.+A,+Applications+and+materials+science
http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000288087100018
http://www.scopus.com/record/display.url?eid=2-s2.0-79751505917&origin=inward

المؤلفون: Thian, Ross Josiah

المصدر: Graduate Theses and Dissertations

مصطلحات موضوعية: 2D to 3D conversion methodology, 3D chip design, Low power chip design, Multi-threshold cmos, Computer Engineering, Digital Circuits, Electrical and Computer Engineering

وصف الملف: application/pdf

Relation: https://scholarworks.uark.edu/etd/52; https://scholarworks.uark.edu/context/etd/article/1051/viewcontent/ThianRoss.pdf

الاتاحة: https://scholarworks.uark.edu/etd/52
https://scholarworks.uark.edu/context/etd/article/1051/viewcontent/ThianRoss.pdf

المؤلفون: El-Genk, M. S., Saber, H. H.

مصطلحات موضوعية: composite spreader, copper (CU), dielectric liquid, high-power chip, non-uniform heat flux, nucleate boiling, porous graphite (PG), power dissipation, thermal resistance, Fire, Incendie

وصف الملف: text

Relation: IEEE Transactions on Components and Packaging Technologies, Volume: 31, Issue: March 1, Publication date: 2008-03-01, Pages: 165–172

الاتاحة: https://doi.org/10.1109/TCAPT.2008.916847
https://nrc-publications.canada.ca/eng/view/object/?id=46a64994-85f4-4514-8506-d66da83a5828
https://nrc-publications.canada.ca/fra/voir/objet/?id=46a64994-85f4-4514-8506-d66da83a5828

المؤلفون: Vagnon, Eric

مصطلحات موضوعية: [SPI] Engineering Sciences, Packaging, Structure 3D, Power Chip-on-Chip Concept, convertisseurs polyphasés, refroidissement double face, encapsulation, contact press

الاتاحة: http://tel.archives-ouvertes.fr/tel-00494431
http://tel.archives-ouvertes.fr/docs/00/49/44/31/PDF/manuscrit_EVagnon.pdf

المؤلفون: Sutaria, Ankit Bharatkumar

المساهمون: Agonafer, Dereje, Nomura, Seiichi

مصطلحات موضوعية: Facebook Bigbasin, Nidia V100, High power chip, GPU server, JBOG, Cold plate, Air cooling, Liquid cooling, Jet impingement, CFD analysis

وصف الملف: application/pdf

Relation: http://hdl.handle.net/10106/28616

الاتاحة: http://hdl.handle.net/10106/28616

المؤلفون: 廖建明

المساهمون: 黄联芬

المصدر: http://etd.xmu.edu.cn/detail.asp?serial=63619.

مصطلحات موضوعية: 无线数字助听器, 24GHz无线技术, 超低功耗芯片nRF24L01, Wireless digital hearing aids, 24GHz wireless technology, ultra-low power chip nRF24L01

Relation: http://210.34.4.28/opac/openlink.php?strText=58606&doctype=ALL&strSearchType=callno; https://dspace.xmu.edu.cn/handle/2288/170562

الاتاحة: https://dspace.xmu.edu.cn/handle/2288/170562

المؤلفون: 田浩倫, Hao-Luen Tain

المساهمون: 徐清祥, Charles Ching-Hsiang Hsu

مصطلحات موضوعية: 智慧型功率晶片, 功率晶片, 智慧型功率元件模組, 功率元件模組, 自我啟動, intelligent power chip, power chip, intelligent power device module, power device module, self powering

Time: 47

وصف الملف: 3549140 bytes; application/octet-stream

Relation: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/4753

الاتاحة: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/4753

المؤلفون: Liu, Y. (author), Zhang, H. (author), Wang, Lingen (author), Fan, Xuejun (author), Zhang, Kouchi (author), Sun, Fenglian (author)

مصطلحات الفهرس: Double-side assembly, Power chip, Reliability, Sintering, journal article

URL: http://resolver.tudelft.nl/uuid:ea241a32-56c8-4623-8ea9-762c7022f76a
http://www.scopus.com/inward/record.url?scp=85054907629&partnerID=8YFLogxK
http://www.scopus.com/inward/record.url?scp=85054907629&partnerID=8YFLogxK
Soldering and Surface Mount Technology--0954-0911--81acda52-33f4-4cc8-ae01-6a58df4e61af

المؤلفون: Universitat Politècnica de Catalunya. Departament d'Arquitectura de Computadors, Barcelona Supercomputing Center, Universitat Politècnica de Catalunya. CAP - Grup de Computació d'Altes Prestacions, Duric, Milovan, Palomar Pérez, Óscar, Smith, Aaron, Stanic, Milan, Unsal, Osman Sabri, Cristal Kestelman, Adrián, Valero Cortés, Mateo, Burger, Doug, Veidenbaum, Alexander V

مصطلحات الفهرس: Àrees temàtiques de la UPC::Enginyeria electrònica::Microelectrònica, Àrees temàtiques de la UPC::Informàtica::Arquitectura de computadors, Microprocessors, Computer architecture, DLP accelerator, DVX enabled 4-core EDGE CMP, EDGE architecture, Cost-effective technique, Data parallel workloads, Dedicated accelerator, Dynamic vector execution, Energy efficient substrate, Energy-delay product, Explicit data graph execution, Functionality, General purpose CMP, General purpose EDGE chip, Multiprocessor, High performance vector design, Low power chip multiprocessor, Minimal hardware, Modest processor, Special-purpose vector architecture, Vector accelerator, Vector control, Vector processor, Microprocessor chips, Multiprocessing systems, Computational modeling, Hardware, Instruction sets, Message systems, Registers, Vectors, Microprocessadors, Arquitectura d'ordinadors, Conference report

URL: http://hdl.handle.net/2117/27788
http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6893190
http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6893190
info:eu-repo/grantAgreement/EC/FP7/321253/EU/Riding on Moore's Law/ROMOL