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1Academic Journal
المؤلفون: Shao Weihua, Li Ran, Zeng Zheng, Li Xiaoling, Philip Mawby
المصدر: The Journal of Engineering (2019)
مصطلحات موضوعية: multichip modules, electromagnetic interference, silicon compounds, power semiconductor devices, wide band gap semiconductors, power MOSFET, finite element analysis, SiC multichip power module, symmetrical inductance, silicon carbide devices, SiC power modules, high voltage spikes, unbalanced stray inductance, uneven current sharing, parallel devices, SiC devices, voltage spike mechanisms, multichip power modules, stray inductance distribution, finite element modelling software, current sharing consistency, parallel chips, symmetrical DBC layout, voltage spike reduction, asymmetrical layouts, current loops, stray inductance extraction, equivalent stray inductance, SiC MOSFET MCPM, direct bonded copper layout conditions, EMI issues, double pulse simulation, SiC, Engineering (General). Civil engineering (General), TA1-2040
وصف الملف: electronic resource
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2Academic Journal
المؤلفون: Borong Hu, Sylvia Konaklieva, Shengyou Xu, Jose Ortiz-Gonzalez, Li Ran, Chong Ng, Paul McKeever, Olayiwola Alatise
المصدر: The Journal of Engineering (2019)
مصطلحات موضوعية: multichip modules, reliability, failure analysis, neural nets, temperature distribution, power semiconductor devices, thermal resistance, condition monitoring, solders, multichip power modules, multidevice system, power rating, high power applications, renewable energy, multidevice systems uneven degradation, uneven solder layer degradation, parallel chips translates, higher thermal resistances, degraded chips, current sharing, power module, two-stage neural network approach, stage NN, power losses, parallel devices, health condition, condition monitoring method, different constant current values, Engineering (General). Civil engineering (General), TA1-2040
وصف الملف: electronic resource
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