المؤلفون: Yury Mikhaylov, Ahmed Aboelhassan, Giampaolo Buticchi, Michael Galea

المصدر: Electronics, Vol 13, Iss 2, p 355 (2024)

مصطلحات موضوعية: three-phase inverter, parallel MOSFETs, silicon carbide (SiC), Electronics, TK7800-8360

Relation: https://www.mdpi.com/2079-9292/13/2/355; https://doaj.org/toc/2079-9292; https://doaj.org/article/ee822bf9b18a4ddb9dca32ed9cb99212

الاتاحة: https://doi.org/10.3390/electronics13020355
https://doaj.org/article/ee822bf9b18a4ddb9dca32ed9cb99212

المؤلفون: Race, Salvatore, Nagel, Michel, Brandl, Anja, Kovacevic-Badstuebner, Ivana, id_orcid:0 000-0001-6960-2470, Popescu, Dan, Popescu, Bogdan, Grossner, Ulrike, id_orcid:0 000-0002-2495-8550

المصدر: 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD)

مصطلحات موضوعية: SiC power MOSFET, gate resistance, switching behavior, parallel MOSFETs, device variability

Relation: info:eu-repo/semantics/altIdentifier/isbn/979-8-3503-9482-5; info:eu-repo/semantics/altIdentifier/isbn/979-8-3503-9483-2; info:eu-repo/semantics/altIdentifier/wos/001270353500127; http://hdl.handle.net/20.500.11850/700138

الاتاحة: https://hdl.handle.net/20.500.11850/700138

المؤلفون: Wikkerink, D.P. (author), Gagic, Mladen (author), Mor, A. R. (author), Polinder, H. (author), Ross, Robert (author)

مصطلحات موضوعية: Converter, cryocooled electronics, cryostat, degaussing, high temperature superconductors, magnetic signature, parallel MOSFETs, ReBCO

Relation: http://www.scopus.com/inward/record.url?scp=85181080751&partnerID=8YFLogxK; IEEE Transactions on Applied Superconductivity--1051-8223--1be86713-a06a-4ea3-841d-d59f7e9041b1; http://resolver.tudelft.nl/uuid:cecaa425-5484-40fa-8c27-a130fa014fe2; https://doi.org/10.1109/tasc.2023.3337767

الاتاحة: http://resolver.tudelft.nl/uuid:cecaa425-5484-40fa-8c27-a130fa014fe2
https://doi.org/10.1109/tasc.2023.3337767

المؤلفون: Cheng Zhao, Fan Zhang, Jianpeng Wang, Binyu Wang, Jia Lixin, Christoph Friedrich Bayer, Fengtao Yang, Jan Abraham Ferreira, Laili Wang

المساهمون: Power Electronics, Digital Society Institute, Publica

المصدر: IEEE Transactions on Power Electronics, 37(2):9520279, 1615-1629. IEEE

مصطلحات موضوعية: Materials science, multichip module, Thermal resistance, packaging, Silicon carbide, chemistry.chemical_compound, MOSFET, Reliability (semiconductor), Planar, Power semiconductor device, Multichip modules, Electrical and Electronic Engineering, multichip power module, Electronic packaging thermal management, parallel MOSFETs, Substrates, business.industry, Electrical engineering, chemistry, Power module, 2023 OA procedure, business, Cooling, Switches, Decoupling (electronics)

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9659f44d4febac689729c274f3779b2b
https://doi.org/10.1109/tpel.2021.3106316

المؤلفون: Djurre Wikkerink, Armando Rodrigo Mor, Henk Polinder, Robert Ross

المصدر: IEEE Access, 10

مصطلحات موضوعية: degaussing, magnetic signature, General Computer Science, Resistance, General Engineering, Coils, cryocooled electronics, Capacitors, Converters, Topology, MOSFET, High-temperature superconductors, General Materials Science, Converter, cryostat, HTS, Electrical and Electronic Engineering, parallel MOSFETs

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::dc59bab2a5272d5dd4a1348d6c9940d8
https://doi.org/10.1109/access.2022.3227508

المؤلفون: Wikkerink, D.P. (author), Mor, A. R. (author), Polinder, H. (author), Ross, Robert (author)

مصطلحات موضوعية: Capacitors, Coils, Converter, Converters, cryocooled electronics, cryostat, degaussing, High-temperature superconductors, HTS, magnetic signature, MOSFET, parallel MOSFETs, Resistance, Topology

Relation: http://www.scopus.com/inward/record.url?scp=85144745357&partnerID=8YFLogxK; IEEE Access--2169-3536--10db88dc-1095-4941-a22e-625ab24bc7b9; http://resolver.tudelft.nl/uuid:f82c2435-cc0e-4118-87ec-99d78c983d6d; https://doi.org/10.1109/ACCESS.2022.3227508

الاتاحة: http://resolver.tudelft.nl/uuid:f82c2435-cc0e-4118-87ec-99d78c983d6d
https://doi.org/10.1109/ACCESS.2022.3227508

المؤلفون: Jiang, Y, Shen, Y, Shillaber, L, Jiang, C, Long, T

مصطلحات موضوعية: Switches, Capacitance, Junctions, Inductors, Zero voltage switching, MOSFET, Switching loss, Dual operation modes, parallel MOSFETs, zero-current switching (ZCS), zero-voltage switching (ZVS)

وصف الملف: application/pdf

Relation: https://www.repository.cam.ac.uk/handle/1810/319542

الاتاحة: https://www.repository.cam.ac.uk/handle/1810/319542
https://doi.org/10.17863/CAM.66664

المؤلفون: Yang, F., Lixin, J., Wang, L., Zhang, F., Wang, B., Zhao, C., Wang, J., Bayer, C.F., Ferreira, J.A.

مصطلحات موضوعية: cooling, electronic packaging thermal management, MOSFET, multichip module, multichip power module, packaging, parallel MOSFETs, silicon carbide, substrates, switches

Time: 670, 621, 620, 530

Relation: IEEE transactions on power electronics; https://publica.fraunhofer.de/handle/publica/270283

الاتاحة: https://publica.fraunhofer.de/handle/publica/270283
https://doi.org/10.1109/TPEL.2021.3106316