المؤلفون: null Rui Qin, Dongyan Ding, Congqin Ning, null Hegang Liu, null Ming Li, null Dali Mao

المصدر: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::38943f6b5ff0896e099af27b3b9097d8
https://doi.org/10.1109/icept.2010.5582803