المؤلفون: Saif Wakeel, A. S. M. A. Haseeb, Khoo Ly Hoon, M. A. Amalina

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:1386-1394

مصطلحات موضوعية: Flip-chip devices, High temperature storage life, No-clean flux, Thermal cycling, Reliability, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, Sensitivity, Moisture sensitivity, Delamination, Underfill delamination, Electrical and Electronic Engineering, Reliability analysis, Electronic packaging thermal management, Copper, Moisture

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::543845f7795ebae8671258d983162f27
https://doi.org/10.1109/tcpmt.2022.3191604

المؤلفون: Wakeel, Saif, Haseeb, A. S. M. A., Hoon, Khoo Ly, Amalina, M. A.

مصطلحات موضوعية: Copper, Delamination, Electronic packaging thermal management, Flip-chip devices, High temperature storage life, Moisture, Moisture sensitivity, No-clean flux, Reliability, Reliability analysis, Sensitivity, Thermal cycling, Underfill delamination

وصف الملف: application/pdf

Relation: Wakeel, S., Haseeb, A. S. M. A., Hoon, K. L. and Amalina, M. A. (2022) 'Effects of commercial no-clean flux on reliability of fine pitch flip-chip package with solder bumps and copper pillars', IEEE Transactions on Components Packaging and Manufacturing Technology, 12(8), pp. 1386-1394. doi:10.1109/TCPMT.2022.3191604; 1394; IEEE Transactions on Components Packaging and Manufacturing Technology; 1386; http://hdl.handle.net/10468/13581; 12

الاتاحة: http://hdl.handle.net/10468/13581
https://doi.org/10.1109/TCPMT.2022.3191604

المؤلفون: LUEDERS, BILL

المصدر: Progressive. Aug/Sep2021, Vol. 85 Issue 4, p65-65. 1p. 1 Color Photograph.

مصطلحات موضوعية: *EQUALITY

Reviews & Products: DIRTY Work, No Clean Hands (Book)

People: LUEDERS, Bill

المؤلفون: Taprogge, Jens, Beyeler, Felix, Steinecker, Alexander, Nelson, Bradley, J.

المساهمون: Centre Suisse d'Electronique et Microtechnique SA (CSEM), FemtoTools GmbH Zurich, Eidgenössische Technische Hochschule - Swiss Federal Institute of Technology Zürich (ETH Zürich), Svetan Ratchev, TC 5, WG 5.5

المصدر: IFIP Advances in Information and Communication Technology ; 6th International Precision Assembly Seminar (IPAS) ; https://inria.hal.science/hal-01363876 ; 6th International Precision Assembly Seminar (IPAS), Feb 2012, Chamonix, France. pp.28-35, ⟨10.1007/978-3-642-28163-1_4⟩

مصطلحات موضوعية: flip-chip, C-4, self-alignment, MEMS, MOEMS, no clean, force sensor, solder paste, bismuth, FemtoTools, wafer level packaging, WLP, chip scale packaging, CSP, direct chip attach, DCA, DRIE, SOI, [INFO]Computer Science [cs]

جغرافية الموضوع: Chamonix, France

Relation: hal-01363876; https://inria.hal.science/hal-01363876; https://inria.hal.science/hal-01363876/document; https://inria.hal.science/hal-01363876/file/978-3-642-28163-1_4_Chapter.pdf

الاتاحة: https://inria.hal.science/hal-01363876
https://inria.hal.science/hal-01363876/document
https://inria.hal.science/hal-01363876/file/978-3-642-28163-1_4_Chapter.pdf
https://doi.org/10.1007/978-3-642-28163-1_4

المصدر: Soldering & Surface Mount Technology, 1999, Vol. 11, Issue 1.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/ssmt.1999.21911aad.012

المساهمون: Williams, Kenneth [Livermore, CA]

وصف الملف: Medium: ED

URL الوصول: http://www.osti.gov/scitech/servlets/purl/874502

المؤلفون: Opheim, Dawn

المصدر: Canadian Review of Materials (CM). 11/18/2022, Vol. 29 Issue 12, p1-1. 1p. 1 Color Photograph.

مصطلحات موضوعية: *CLOTHING & dress, *CHILDREN'S books, *FICTION

Reviews & Products: NO Clean Clothes (Book)

People: MUNSCH, Robert N., 1945-, MARTCHENKO, Michael

المساهمون: Williams, Kenneth [Livermore, CA]

وصف الملف: Medium: ED

URL الوصول: http://www.osti.gov/scitech/servlets/purl/870154

المؤلفون: Eiji Higurashi, Shinichi Yamamoto, Tadatomo Suga, hiroki oshikawa, sakie okada, 山本 真一, 岡田 咲枝, 押川 紘樹, 日暮 栄治, 須賀 唯知

المصدر: Proceedings of JIEP Annual Meeting. 2011, :336

المؤلفون: Ambat, Rajan, Gudla, Helene Virginie Conseil, Verdingovas, Vadimas

المساهمون: Reedijk, Jan

المصدر: Ambat , R , Gudla , H V C & Verdingovas , V 2017 , Corrosion in Electronics . in J Reedijk (ed.) , Reference Module in Chemistry, Molecular Sciences and Chemical Engineering . Elsevier . https://doi.org/10.1016/B978-0-12-409547-2.13437-7

مصطلحات موضوعية: Climate, Condensation, Corrosion, Electrochemical migration, Electronics, Enclosure, Failure, Humidity, Ionic contamination, Leakage current, No-clean, Reliability, Residue, Solder flux, Surface insulation resistance

Relation: https://orbit.dtu.dk/en/publications/d598be06-9a7c-4341-ae76-de495cec99f6; urn:ISBN:978-0-12-409547-2

الاتاحة: https://orbit.dtu.dk/en/publications/d598be06-9a7c-4341-ae76-de495cec99f6
https://doi.org/10.1016/B978-0-12-409547-2.13437-7

المؤلفون: Rathinavelu, Umadevi, Jellesen, Morten Stendahl, Ambat, Rajan

المصدر: Rathinavelu , U , Jellesen , M S & Ambat , R 2013 , ' Effect of solder flux residue on the performance of silicone conformal coatings on printed circuit board assemblies ' , Corrosion Engineering Science and Technology , vol. 48 , no. 6 , pp. 436-444 . https://doi.org/10.1179/1743278213Y.0000000096

مصطلحات موضوعية: Blisters, Coating failure, Conformal coating, Electrochemical migration, No-clean flux residue, Silicone

Relation: https://orbit.dtu.dk/en/publications/50120729-a58a-44b3-a2a0-7e22c3c1bd6d

الاتاحة: https://orbit.dtu.dk/en/publications/50120729-a58a-44b3-a2a0-7e22c3c1bd6d
https://doi.org/10.1179/1743278213Y.0000000096

المؤلفون: Rathinavelu, Umadevi, Jellesen, Morten S., Møller, Per, Ambat, Rajan

المصدر: Rathinavelu , U , Jellesen , M S , Møller , P & Ambat , R 2012 , ' Effect of No-Clean Flux Residues on the Performance of Acrylic Conformal Coating in Aggressive Environments ' , I E E E Transactions on Components, Packaging and Manufacturing Technology , vol. 2 , no. 4 , pp. 719-728 . https://doi.org/10.1109/TCPMT.2012.2186456

مصطلحات موضوعية: Acrylic, Blisters, Conformal coating, electrochemical migration, No-clean flux

Relation: https://orbit.dtu.dk/en/publications/85c41386-6f89-4e6f-8e66-a767e5aaa18d

الاتاحة: https://orbit.dtu.dk/en/publications/85c41386-6f89-4e6f-8e66-a767e5aaa18d
https://doi.org/10.1109/TCPMT.2012.2186456

المؤلفون: Wakeel, Saif, Haseeb, A. S. M. A., Afifi, M. A., Bingöl, Sedat, Hoon, Khoo Ly

مصطلحات موضوعية: Chemistry of no-clean flux, Soldering process, Flux residue, Hygroscopicity, Underfill compatibility

وصف الملف: application/pdf

Relation: Microelectronics Reliability; Diğer; Wakeel, S., Haseeb, A. S. M. A., Afifi, M. A., Bingöl, S. ve Hoon, K.L. (2021). Constituents and performance of no-clean flux for electronic solder. Microelectronics Reliability, 123, 1-12.; https://www.sciencedirect.com/science/article/pii/S0026271421001438?via%3Dihub; https://hdl.handle.net/11468/11070; 123; 12; WOS:000687828700003; 2-s2.0-85108171322; Q2; Q4

الاتاحة: https://hdl.handle.net/11468/11070
https://www.sciencedirect.com/science/article/pii/S0026271421001438?via%3Dihub
https://doi.org/10.1016/j.microrel.2021.114177

المؤلفون: Hansen, Kirsten Stentoft, Jellesen, Morten Stendahl, Møller, Per, Westermann, Peter Jacob Schwencke, Ambat, Rajan

المصدر: Hansen , K S , Jellesen , M S , Møller , P , Westermann , P J S & Ambat , R 2009 , Effect of Solder Flux Residues on Corrosion of Electronics . in Annual Reliability and Maintainability Symposium, 2009. RAMS 2009. . IEEE Press , RAMS , Las Vegas , 01/01/2008 . https://doi.org/10.1109/RAMS.2009.4914727

مصطلحات موضوعية: leakage current, flux residues, no-clean flux, corrosion reliability

Relation: https://orbit.dtu.dk/en/publications/1ccf341b-4714-4279-b0c2-4fefb13ca1ad; urn:ISBN:978-1-4244-2508-2

الاتاحة: https://orbit.dtu.dk/en/publications/1ccf341b-4714-4279-b0c2-4fefb13ca1ad
https://doi.org/10.1109/RAMS.2009.4914727

المؤلفون: Bukat, K., Morawska, Z., Sitek, J.

المصدر: Elektronika : konstrukcje, technologie, zastosowania.

مصطلحات موضوعية: topniki, lutowanie, korozyjność topników, topniki no-clean, topniki low-solid, fluxes, soldering, fluxes - corrosivity, low - solid fluxes, no-clean fluxes

URL الوصول: http://yadda.icm.edu.pl/baztech/element/bwmeta1.element.baztech-article-BWA0-0015-0012

المؤلفون: Bukat, K., Roćak, D., Sitek, J.

المصدر: Elektronika : konstrukcje, technologie, zastosowania.

مصطلحات موضوعية: topniki no-clean, TN/4A, C1/C, badania, porównanie wyników, no-clean fluxes carried, research, comparison of results

URL الوصول: http://yadda.icm.edu.pl/baztech/element/bwmeta1.element.baztech-article-BWA9-0004-0066

المؤلفون: Kiddey, Karen

المصدر: Canadian Review of Materials (CM). 12/22/2006, Vol. 13 Issue 9, p22-22. 1p.

مصطلحات موضوعية: *T-shirts, *FICTION

Reviews & Products: NO Clean Clothes (Book)

People: MUNSCH, Robert N., 1945-

المؤلفون: DAVID ALLEN WONG

المساهمون: SINGAPORE-MIT ALLIANCE

المصدر: SMA BATCHLOAD 20190422

مصطلحات موضوعية: Copper pillar bumps, oven reflow (attach and reflow), local reflow (thermocompression), no-clean flux

Relation: DAVID ALLEN WONG (2010). Die-to-Die Interconnect Studies using Copper Pillars with Tin-Silver Solder Bumps. ScholarBank@NUS Repository.; https://scholarbank.nus.edu.sg/handle/10635/153885

الاتاحة: https://scholarbank.nus.edu.sg/handle/10635/153885

المؤلفون: Nieminen, Markku

المساهمون: Pere, Juha, Teknillinen korkeakoulu, Helsinki University of Technology, Materiaali- ja kalliotekniikan osasto, Kivilahti, Jorma, Aalto-yliopisto, Aalto University

مصطلحات موضوعية: wave soldering, foam fluxing, spray fluxing, no-clean fluxes, surface insulation resistance, ionograph, aaltojuotosprosessi, vaahtofluksaus, sprayfluksaus, pesemättömät juoksutteet, pintaresistanssi, ionograafi

Relation: https://aaltodoc.aalto.fi/handle/123456789/87614; URN:NBN:fi:aalto-2020120446452

الاتاحة: https://aaltodoc.aalto.fi/handle/123456789/87614