المؤلفون: Borong Hu, Sylvia Konaklieva, Shengyou Xu, Jose Ortiz-Gonzalez, Li Ran, Chong Ng, Paul McKeever, Olayiwola Alatise

المصدر: The Journal of Engineering (2019)

مصطلحات موضوعية: multichip modules, reliability, failure analysis, neural nets, temperature distribution, power semiconductor devices, thermal resistance, condition monitoring, solders, multichip power modules, multidevice system, power rating, high power applications, renewable energy, multidevice systems uneven degradation, uneven solder layer degradation, parallel chips translates, higher thermal resistances, degraded chips, current sharing, power module, two-stage neural network approach, stage NN, power losses, parallel devices, health condition, condition monitoring method, different constant current values, Engineering (General). Civil engineering (General), TA1-2040

وصف الملف: electronic resource

Relation: https://digital-library.theiet.org/content/journals/10.1049/joe.2018.8025; https://doaj.org/toc/2051-3305

URL الوصول: https://doaj.org/article/d9fcc07002a34484819e61b0e7dd4025