المؤلفون: Qingzeng Song, Jiabing Zhang, Liankun Sun, Guanghao Jin

المصدر: IEEE Access, Vol 10, Pp 91497-91508 (2022)

مصطلحات موضوعية: Hardware accelerator, multi-die, object detection, YOLOv4-tiny, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/9858118/; https://doaj.org/toc/2169-3536

URL الوصول: https://doaj.org/article/b82a40c1d41344beac1901fb7b9bdb2d

المؤلفون: Chuan Chen, Meiying Su, Rui Ma, Yunyan Zhou, Jun Li, Liqiang Cao

المصدر: Materials; Volume 15; Issue 5; Pages: 1683

مصطلحات موضوعية: fan-out wafer-level packaging, viscoelastic, warpage, multi-die

وصف الملف: application/pdf

Relation: https://dx.doi.org/10.3390/ma15051683

الاتاحة: https://doi.org/10.3390/ma15051683

المؤلفون: Raikar, Raveena Ramanand, Stroobandt, Dirk

المصدر: 2023 ACM/IEEE SYSTEM LEVEL INTERCONNECT PATHFINDING WORKSHOP, SLIP 2023 ; ISBN: 9798400704741

مصطلحات موضوعية: Technology and Engineering, 2.5D FPGA, Silicon Interposer, Multi-die FPGA Placement

وصف الملف: application/pdf

Relation: https://biblio.ugent.be/publication/01HYD9YH6EDXX8QTK1NND3EP5T; http://doi.org/10.1145/3632409.3632839; https://biblio.ugent.be/publication/01HYD9YH6EDXX8QTK1NND3EP5T/file/01HYDACBVWGFACHRTHWK8D0MCJ

الاتاحة: https://biblio.ugent.be/publication/01HYD9YH6EDXX8QTK1NND3EP5T
http://hdl.handle.net/1854/LU-01HYD9YH6EDXX8QTK1NND3EP5T
https://doi.org/10.1145/3632409.3632839
https://biblio.ugent.be/publication/01HYD9YH6EDXX8QTK1NND3EP5T/file/01HYDACBVWGFACHRTHWK8D0MCJ

المؤلفون: Guo, Licheng, Maidee, Pongstorn, Zhou, Yun, Lavin, Chris, Hung, Eddie, Li, Wuxi, Lau, Jason, Qiao, Weikang, Chi, Yuze, Song, Linghao, Xiao, Yuanlong, Kaviani, Alireza, Zhang, Zhiru, Cong, Jason

المصدر: ACM TRANSACTIONS ON RECONFIGURABLE TECHNOLOGY AND SYSTEMS ; ISSN: 1936-7406 ; ISSN: 1936-7414

مصطلحات موضوعية: Technology and Engineering, Hardware → Hardware accelerators, Reconigurable logic applications, Partitioning and loorplanning, · Computer systems organization → Data low architectures, High-level language architectures, Reconigurable computing, Multi-die FPGA, high-level synthesis, hardware acceleration, floorplanning, frequency optimization, HBM optimization, COMPILATION, PLACEMENT

وصف الملف: application/pdf

Relation: https://biblio.ugent.be/publication/01GZEES44JWBG4SWJYGT6ZE642; http://doi.org/10.1145/3593025; https://biblio.ugent.be/publication/01GZEES44JWBG4SWJYGT6ZE642/file/01HX73RKFMMSEKBHNDF82DRA62

الاتاحة: https://biblio.ugent.be/publication/01GZEES44JWBG4SWJYGT6ZE642
http://hdl.handle.net/1854/LU-01GZEES44JWBG4SWJYGT6ZE642
https://doi.org/10.1145/3593025
https://biblio.ugent.be/publication/01GZEES44JWBG4SWJYGT6ZE642/file/01HX73RKFMMSEKBHNDF82DRA62

المؤلفون: Chuan Chen, Meiying Su, Rui Ma, Yunyan Zhou, Jun Li, Liqiang Cao

المصدر: Materials; Volume 15; Issue 5; Pages: 1683

مصطلحات موضوعية: fan-out wafer-level packaging, viscoelastic, warpage, multi-die, General Materials Science

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::be1b68ba1996570bb9c3647933cfd311
https://pubmed.ncbi.nlm.nih.gov/35268913

المؤلفون: Kor, Katherine Hwee Boon, Liu, Q., Gan, Chee Lip

المساهمون: IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), Temasek Laboratories

مصطلحات موضوعية: Engineering::Materials, Deprocessing, 3D Multi-die Stacked Packages

وصف الملف: application/pdf

Relation: Kor, K. H. B., Liu, Q., & Gan, C. L. (2020). Sample preparation for deprocessing of 3D multi-die stacked package. Proceedings of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 1-6. doi:10.1109/IPFA49335.2020.9260707; https://hdl.handle.net/10356/144906

الاتاحة: https://hdl.handle.net/10356/144906
https://doi.org/10.1109/IPFA49335.2020.9260707

المؤلفون: Voss, N, Quintana, P, Mencer, O, Luk, W, Gaydadjiev, G

المصدر: The 27th IEEE International Symposium On Field-Programmable Custom Computing Machines ; 86 ; 78

مصطلحات موضوعية: Science & Technology, Technology, Computer Science, Hardware & Architecture, Theory & Methods, Engineering, Electrical & Electronic, Memory Allocation, Memory Mapping, Greedy Heuristic, FPGA, Multi Die

جغرافية الموضوع: San Diego

Relation: 2019 IEEE 27th Annual International Symposium on Field-Programmable Custom Computing Machines (FCCM); http://hdl.handle.net/10044/1/69950

الاتاحة: http://hdl.handle.net/10044/1/69950
https://doi.org/10.1109/FCCM.2019.00021

المؤلفون: Andy Miller, Eric Beyne, Fabrice Duval, Giovanni Capuz, Kazuyuki Mitsukura, Keiichi Hatakeyama, Kenneth June Rebibis, Mikael Detalle, Tatsuya Makino, Teng Wang

المصدر: Transactions of The Japan Institute of Electronics Packaging. 2016, 9:E16-1

المؤلفون: Oskar Mencer, Nils Voss, Wayne Luk, Pablo Quintana, Georgi Gaydadjiev

المصدر: FCCM
The 27th IEEE International Symposium On Field-Programmable Custom Computing Machines

مصطلحات موضوعية: Technology, Computer science, 02 engineering and technology, Memory mapping, 01 natural sciences, Die (integrated circuit), Engineering, Memory Allocation, Computer Science, Theory & Methods, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, Resource management, Limit (mathematics), Computer Science, Hardware & Architecture, Greedy algorithm, Field-programmable gate array, FPGA, 010302 applied physics, Greedy Heuristic, Science & Technology, Memory Mapping, Engineering, Electrical & Electronic, Timing closure, Multi Die, 020202 computer hardware & architecture, Computer architecture, Computer Science, Place and route

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::68e02a1979a01d83885becd34da3248c
https://doi.org/10.1109/fccm.2019.00021

المؤلفون: Wang, Qian

المصدر: Masters Theses

مصطلحات موضوعية: De-Embedding, Embedded Multi-Die Interconnect Bridge, High Speed Design, Signal Integrity, Silicon Interposer Technology, Through Silicon Via, Three-dimensional integrated circuits Interconnects (Integrated circuit technology) -- Design and construction Embedded computer systems Systems on a chip, Electrical and Computer Engineering

وصف الملف: application/pdf

Relation: https://scholarsmine.mst.edu/masters_theses/7574; https://scholarsmine.mst.edu/context/masters_theses/article/8573/viewcontent/Wang_Qian_2016r.pdf

الاتاحة: https://scholarsmine.mst.edu/masters_theses/7574
https://scholarsmine.mst.edu/context/masters_theses/article/8573/viewcontent/Wang_Qian_2016r.pdf

المؤلفون: Keppens, Arno, De Smeyter, David, Ryckaert, Wouter R., Deconinck, Geert, Hanselaer, Peter

مصطلحات موضوعية: single-die and multi-die LEDs, current-voltage characteristic, internal series resistance, junction temperature dependence, DC and PWM

وصف الملف: 236726 bytes; application/pdf

Relation: Proceedings of SPIE vol:7058 pages:1-12; Eight International Conference of Solid State Lighting edition:8 location:San Diego date:10-13 August 2008; https://lirias.kuleuven.be/handle/123456789/202390; https://lirias.kuleuven.be/bitstream/123456789/202390/1//paper_AKeppens2.pdf

الاتاحة: https://lirias.kuleuven.be/handle/123456789/202390
https://lirias.kuleuven.be/bitstream/123456789/202390/1//paper_AKeppens2.pdf

المؤلفون: Pawlicki, M.

مصطلحات موضوعية: AutoForm, moduł "Die adviser", symulacja, MES (metoda elementów skończonych), zużycie narzędzi, tłoczenie wielotaktowe, Die adviser, simulation, FEM, die wear, drawing, multi-die stamping

URL الوصول: http://yadda.icm.edu.pl/baztech/element/bwmeta1.element.baztech-article-BPB2-0066-0012

المؤلفون: Mamalis, AG, Gioftsidis, GN

مصطلحات موضوعية: Copper, High Pressure, Engineering, Industrial, Manufacturing, Materials Science, Multidisciplinary, Metallography--Microstructure, Metals and Alloys--Fracture, Microscopes--Applications, Powder Metallurgy--Copper, Compaction of Copper Powder, Consolidation Mechanism, Multi-Die Configuration, Particle Jet Formation, Shock Compaction Mechanism, Shock Wave of High Pressure, Copper Powder

Relation: ISI:A1990EM29900007; 23; 333; 345

الاتاحة: https://doi.org/10.1016/0924-0136(90)90250-X