المؤلفون: Krivovitca, Aleksandr, 1991, Shah, Umer, 1982, Gustafsson, Andreas, Svedin, Jan, Malmqvist, Robert, Oberhammer, Joachim, Professor

المصدر: IEEE Electron Device Letters. 44(12):2019-2022

مصطلحات موضوعية: Wire bonding, W-band, CPW, microwave packaging

وصف الملف: electronic

URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-340218
https://kth.diva-portal.org/smash/get/diva2:1815900/FULLTEXT01.pdf

المؤلفون: Bourouina, Tarik, Courtois, B., Ghodssi, R., Karam, J.M., Soma, A., Yang, H.Y.

المساهمون: Electronique, Systèmes de communication et Microsystèmes (ESYCOM), Conservatoire National des Arts et Métiers CNAM (CNAM)-Université Paris-Est Marne-la-Vallée (UPEM)-ESIEE Paris, Circuits Multi-Projets (CMP), Université Joseph Fourier - Grenoble 1 (UJF)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP)-Centre National de la Recherche Scientifique (CNRS), Dept. of Electrical and Computer Engineering, Memscap, MEMSCAP, Department of Mechanics, Politecnico di Torino = Polytechnic of Turin (Polito), Center of Nanoscience and Nanotechnology, National Chung Hsing University (NCHU), EDA Publishing Association

المصدر: https://hal.science/hal-00395521 ; EDA Publishing Association. EDA Publishing Association, pp.429, 2009, Proceedings.

مصطلحات موضوعية: Technology CAD in general, Modeling and simulation of fabrication processes, Devices and components (sensors, actuators, MEMS/MOEMS libraries and IP, Signal processing, Integrated CAD tools, Numerical simulation, Yield estimation, Failure mechanisms, Fault modeling, Fault simulation and test pattern generation, Mechanical simulation, Thermal evaluation, Interoperability of CAD/CAE tools, Multiphysics simulation, Structured design methodologies, Languages for interchange data among designs and tools, Model order reduction, Integrated processes (micromachining, micromolding), Process integration between MEMS and electronics, Microlithography issues unique to MEMS/MOEMS, Manufacturing, Materials, Assembly technologies, Packaging for harsh environments, MOEMS packaging, RF and microwave packaging, Test structures

الاتاحة: https://hal.science/hal-00395521

المؤلفون: Yamamoto, Silas Demmy

Thesis Advisors: UNIVERSIDADE ESTADUAL DE CAMPINAS, Swart, Jacobus Willibrordus, 1950, Rotondaro, Antonio Luis Pacheco, Diniz, José Alexandre

المصدر: Repositório Institucional da UnicampUniversidade Estadual de CampinasUNICAMP.

مصطلحات موضوعية: Circuitos integrados - Comunicação em larga escala, Sistemas de comunicação sem fio, Ceramica eletronica, Ondas milimétricas, Circuitos integrados de microondas, Integrated circuits - Communication on a large-scale, Wireless communication systems, Electronic ceramics, Millimeter waves, Microwave packaging

وصف الملف: 114 p. : il.; application/pdf

الاتاحة: http://repositorio.unicamp.br/jspui/handle/REPOSIP/259229

المؤلفون: Silas Demmy Yamamoto

المساهمون: Swart, Jacobus Willibrordus, 1950, Rotondaro, Antonio Luis Pacheco, Diniz, José Alexandre, Universidade Estadual de Campinas. Faculdade de Engenharia Elétrica e de Computação, Programa de Pós-Graduação em Engenharia Elétrica, UNIVERSIDADE ESTADUAL DE CAMPINAS

المصدر: Biblioteca Digital de Teses e Dissertações da Universidade Estadual de Campinas (UNICAMP)
Universidade Estadual de Campinas (UNICAMP)
instacron:UNICAMP

مصطلحات موضوعية: Ondas milimétricas, Integrated circuits - Communication on a large-scale, Sistemas de comunicação sem fio, Ceramica eletronica, Millimeter waves, Microwave packaging, Circuitos integrados - Comunicação em larga escala, Circuitos integrados de microondas, Wireless communication systems, Electronic ceramics

وصف الملف: application/pdf; 114 p. : il.

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::566bbd272c8bfe527cdbc6b909ba67dd

المؤلفون: Lesage, Jean-Marc

المساهمون: Institut d'Electronique et de Télécommunications de Rennes (IETR), Centre National de la Recherche Scientifique (CNRS)-Ecole Supérieure d'Electricité - SUPELEC (FRANCE)-Institut National des Sciences Appliquées - Rennes (INSA Rennes), Institut National des Sciences Appliquées (INSA)-Université de Rennes (UNIV-RENNES)-Institut National des Sciences Appliquées (INSA)-Université de Rennes (UNIV-RENNES)-Université de Rennes 1 (UR1), Université de Rennes (UNIV-RENNES), INSA de Rennes, Raphaël Gillard(raphael.gillard@insa-rennes.fr)

المصدر: Autre. INSA de Rennes, 2005. Français

مصطلحات موضوعية: compression approach, [SPI.OTHER]Engineering Sciences [physics]/Other, global EM modelling, MMIC, approche de compression, modélisation EM globale, numerical calibration for internal ports, microwave packaging, calibrage numérique pour ports internes, boîtier hyperfréquence

URL الوصول: https://explore.openaire.eu/search/publication?articleId=od______2592::12eb4592c96ccaa9b662a33d66e9d191
https://tel.archives-ouvertes.fr/tel-00011792

المؤلفون: Lesage, Jean-Marc

المساهمون: Institut d'Electronique et de Télécommunications de Rennes (IETR), Centre National de la Recherche Scientifique (CNRS)-Ecole Supérieure d'Electricité - SUPELEC (FRANCE)-Institut National des Sciences Appliquées - Rennes (INSA Rennes), Institut National des Sciences Appliquées (INSA)-Université de Rennes (UNIV-RENNES)-Institut National des Sciences Appliquées (INSA)-Université de Rennes (UNIV-RENNES)-Université de Rennes 1 (UR1), Université de Rennes (UNIV-RENNES), INSA de Rennes, Raphaël Gillard(raphael.gillard@insa-rennes.fr), Université de Rennes (UR)-Institut National des Sciences Appliquées - Rennes (INSA Rennes), Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Ecole Supérieure d'Electricité - SUPELEC (FRANCE)-Centre National de la Recherche Scientifique (CNRS)

المصدر: Autre. INSA de Rennes, 2005. Français
Autre. INSA de Rennes, 2005. Français. ⟨NNT : ⟩

مصطلحات موضوعية: compression approach, [SPI.OTHER]Engineering Sciences [physics]/Other, global EM modelling, MMIC, approche de compression, modélisation EM globale, numerical calibration for internal ports, microwave packaging, calibrage numérique pour ports internes, boîtier hyperfréquence

URL الوصول: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::12eb4592c96ccaa9b662a33d66e9d191
https://tel.archives-ouvertes.fr/tel-00011792

المؤلفون: Wang, ZY, Jackson, RW

المصدر: Electrical and Computer Engineering Faculty Publication Series

مصطلحات موضوعية: microwave multichip modules, microwave packaging model, MMIC CAD, MMIC coupling, MMIC sealant, module isolation

Relation: https://scholarworks.umass.edu/ece_faculty_pubs/662

الاتاحة: https://scholarworks.umass.edu/ece_faculty_pubs/662
https://doi.org/10.1109/22.899973

المؤلفون: Jackson, RW

المصدر: Electrical and Computer Engineering Faculty Publication Series

مصطلحات موضوعية: ball grid arrays, coupling, microwave multichip assemblies, microwave multichip modules, microwave packaging, multilayer structures, mutual impedance, parallel-plate modes

Relation: https://scholarworks.umass.edu/ece_faculty_pubs/663

الاتاحة: https://scholarworks.umass.edu/ece_faculty_pubs/663
https://doi.org/10.1109/22.883879

المؤلفون: Lesage, Jean-Marc

المساهمون: Institut d'Electronique et de Télécommunications de Rennes (IETR), Université de Rennes (UR)-Institut National des Sciences Appliquées - Rennes (INSA Rennes), Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Ecole Supérieure d'Electricité - SUPELEC (FRANCE)-Centre National de la Recherche Scientifique (CNRS), INSA de Rennes, Raphaël Gillard(raphael.gillard@insa-rennes.fr)

المصدر: https://theses.hal.science/tel-00011792 ; Autre. INSA de Rennes, 2005. Français. ⟨NNT : ⟩.

مصطلحات موضوعية: global EM modelling, microwave packaging, MMIC, compression approach, numerical calibration for internal ports, modélisation EM globale, boîtier hyperfréquence, approche de compression, calibrage numérique pour ports internes, [SPI.OTHER]Engineering Sciences [physics]/Other

Relation: tel-00011792; https://theses.hal.science/tel-00011792; https://theses.hal.science/tel-00011792/document; https://theses.hal.science/tel-00011792/file/these_version_finale.pdf

الاتاحة: https://theses.hal.science/tel-00011792
https://theses.hal.science/tel-00011792/document
https://theses.hal.science/tel-00011792/file/these_version_finale.pdf

المؤلفون: Liu, Y, Xie, L, Yuan, HQ, Zhang, JB, Zhu, NH, Sun, CZ, Xiong, B, Luo, B, Liu, Y, Chinese Acad Sci, Inst Semicond, State Key Lab Integrated Optoelect, Beijing 100083, Peoples R China.

مصطلحات موضوعية: Optoelectronic Devices, Electro-absorption Modulators, Microwave Packaging, Frequency Response, Design, 光电子学, electroabsorption modulators, photo electric devices, photo electronic devices, photoelectronic devices, opto-isolators, opto-couplers, optrons, photoelectric devices, 频率响应, phase response, conception, dessin, entwurf (konstruktion), etude, forme, tailoring, design engineering, appearance

Relation: Optoelectronic Materials and Devices for Optical Communications丛书标题: PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE); Liu, Y; Xie, L; Yuan, HQ; Zhang, JB; Zhu, NH; Sun, CZ; Xiong, B; Luo, B .Microwave packaging for 10 Gb/s EML modulators - art. no. 60201O .见：SPIE-INT SOC OPTICAL ENGINEERING .Optoelectronic Materials and Devices for Optical Communications丛书标题: PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE) ,1000 20TH ST, PO BOX 10, BELLINGHAM, WA 98227-0010 USA ,2005,6020: O201-O201; http://ir.semi.ac.cn/handle/172111/9898

الاتاحة: http://ir.semi.ac.cn/handle/172111/9898

المؤلفون: Ito, R, Jackson, RW, Hongsmatip, T

المصدر: Electrical and Computer Engineering Faculty Publication Series

مصطلحات موضوعية: BGA, electrical isolation, microwave packaging, multichip module, package isolation, package model

Relation: https://scholarworks.umass.edu/ece_faculty_pubs/665

الاتاحة: https://scholarworks.umass.edu/ece_faculty_pubs/665
https://doi.org/10.1109/22.788517

المؤلفون: Jackson, RW, Ito, R

المصدر: Electrical and Computer Engineering Faculty Publication Series

مصطلحات موضوعية: flip chip, microwave packaging, MMIC packaging

Relation: https://scholarworks.umass.edu/ece_faculty_pubs/667

الاتاحة: https://scholarworks.umass.edu/ece_faculty_pubs/667
https://doi.org/10.1109/22.641791

المساهمون: DCS CORP ALEXANDRIA VA

المصدر: DTIC AND NTIS

مصطلحات موضوعية: Electrical and Electronic Equipment, MICROWAVE EQUIPMENT, ANTENNA ARRAYS, GALLIUM ARSENIDES, INTEGRATED CIRCUITS, SUBSTRATES, SEMICONDUCTOR DEVICES, QUALITY ASSURANCE, RESEARCH MANAGEMENT, MONOLITHIC STRUCTURES(ELECTRONICS), MAST(MARITME AVIONICS SUBSYSTEMS AND TECHNOLOGY), HDMP(HIGH DENSITY MICROWAVE PACKAGING)

وصف الملف: text/html

Relation: http://www.dtic.mil/docs/citations/ADA320552

الاتاحة: http://www.dtic.mil/docs/citations/ADA320552
http://oai.dtic.mil/oai/oai?&verb=getRecord&metadataPrefix=html&identifier=ADA320552

المؤلفون: Enchelmaier, David Samuel

مصطلحات الفهرس: Broadband, electronics, frequency synthesiser, microwave, microwave circuit design, microwave packaging, millimetre wave, wideband, phase locked loop, voltage controlled oscillator, wideband, Thesis

URL: https://eprints.qut.edu.au/31851/1/David_Enchelmaier_Thesis.pdf
https://eprints.qut.edu.au/31851/1/David_Enchelmaier_Thesis.pdf
Enchelmaier, David Samuel (2009) A miniaturised wideband frequency synthesiser. Masters by Research thesis, Queensland University of Technology.