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1Academic Journal
المؤلفون: Sofya Efimova, Florica Simescu Lazar, Jean-Paul Chopart, François Debray, Anne-Lise Daltin
المصدر: Compounds, Vol 4, Iss 3, Pp 453-478 (2024)
مصطلحات موضوعية: Cu–Ag alloy, electrodeposition, coating, electrocatalyst, metal interconnection, Physics, QC1-999, Physical and theoretical chemistry, QD450-801
وصف الملف: electronic resource
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2Academic Journal
المؤلفون: Hongfeng Wan (14341064), Weixuan Li (3814123), Xiaoqing Ma (3761947), Yanqi Mu (8889365), Guancai Xie (4636819), Mengshan Li (14341067), Beidou Guo (1949074), Jian Ru Gong (1511131)
مصطلحات موضوعية: Biophysics, Molecular Biology, Neuroscience, Physiology, Biotechnology, Cancer, Biological Sciences not elsewhere classified, Chemical Sciences not elsewhere classified, Physical Sciences not elsewhere classified, induced barrier lowering, ideal subthreshold swing, generation electronic devices, extend moore ’, comsol multiphysics simulation, better gate control, 67 mv dec, 2 × 10, short channel effects, 2 sup, 2 sub, 5 sup, 378 v v, 2 cm, channel lengths, 5 nm, 5 cm, transistor downscaling, metal interconnection, lithography limit, highest value
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3Academic Journal
المؤلفون: Hisashi Kino, Mitsumasa Koyanagi, Shi-yang Ji, Takafumi Fukushima, Tetsu Tanaka, 小柳 光正, 木野 久志, 田中 徹, 福島 誉史, 紀 世陽
المصدر: Proceedings of JIEP Annual Meeting. 2008, :59
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4Academic Journal
المؤلفون: Hideki OHKAWA, Masaharu KINOSHITA, Masahiro ISHIDA, 大川 秀樹, 木下 正治, 石田 全寛
المصدر: 精密工学会誌 / Journal of the Japan Society for Precision Engineering. 1996, 62(4):496
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5Academic Journal
مصطلحات موضوعية: 圆片级封装, 气浮沉积, 金属互联, 欧姆接触, 纳米银浆, wafer level package, aerosol deposition, metal interconnection, ohmic contact, nano silver
Relation: 厦门大学学报(自然科学版),2014,(5):85-88; XDZK201405011; http://dspace.xmu.edu.cn/handle/2288/105800
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6Dissertation/ Thesis
المؤلفون: 권기욱
المساهمون: 김재정, 화학생물공학부
مصطلحات موضوعية: 인쇄회로기판, printed circuit board(PCB), 금속 배선, metal interconnection, 구리, copper, 전해 도금, electro plating, 관통 마스크 도금, through mask plating, 관통 홀 도금, through hole plating, 첨가제, additives
وصف الملف: ix, 66 장
Relation: http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000039694; https://hdl.handle.net/10371/13161
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7Dissertation/ Thesis
المؤلفون: 김서영
المساهمون: 김재정, 화학생물공학부
مصطلحات موضوعية: 반도체, semiconductor, 금속 배선, metal interconnection, 은, Ag, 무전해 도금, electroless plating, 주석, Sn, 팔라듐, Pd, 전처리 방법, pretreatment, 씨앗층, seed layer
وصف الملف: ix, 73 장
Relation: http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000047856; http://hdl.handle.net/10371/13451
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8Academic Journal
المؤلفون: Lo, Tai-chin, Chan, Miu Ying
مصطلحات موضوعية: Gold, Electroplating, Metal interconnection, VLSI fabrication
Relation: http://repository.ust.hk/ir/Record/1783.1-26437; Japanese Journal of Applied Physics, v. 35, pt. 1, no. 11, Nov 1996, p. 5674-5679; https://doi.org/10.1143/JJAP.35.5674; http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=0021-4922&rft.volume=35&rft.issue=11&rft.date=1996&rft.spage=5674&rft.epage=5679&rft.aulast=Lo&rft.aufirst=TC&rft.atitle=Optimization+of+a+novel+self-planarizing+Au+metallization+process+for+practical+VLSI+applications; http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=A1996VV24100015; http://www.scopus.com/record/display.url?eid=2-s2.0-0030285101&origin=inward
الاتاحة: http://repository.ust.hk/ir/Record/1783.1-26437
https://doi.org/10.1143/JJAP.35.5674
http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=0021-4922&rft.volume=35&rft.issue=11&rft.date=1996&rft.spage=5674&rft.epage=5679&rft.aulast=Lo&rft.aufirst=TC&rft.atitle=Optimization+of+a+novel+self-planarizing+Au+metallization+process+for+practical+VLSI+applications
http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=A1996VV24100015
http://www.scopus.com/record/display.url?eid=2-s2.0-0030285101&origin=inward -
9Academic Journal
المؤلفون: LO, Tai-chin, CHAN, Miu Ying
مصطلحات موضوعية: SUBMICRON, GOLD ELECTROPLATING, METAL INTERCONNECTION, PLANARIZATION
Relation: http://repository.ust.hk/ir/Record/1783.1-29618; Japanese Journal of Applied Physics, v. 34, pt. 2, no. 7B, 15 Jul 1995, p. L945-L947; https://doi.org/10.1143/JJAP.34.L945; http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=0021-4922&rft.volume=34&rft.issue=7B&rft.date=1995&rft.spage=945&rft.epage=&rft.aulast=LO&rft.aufirst=TC&rft.atitle=DOWNSIZING+GOLD+WIRES+TO+SUBMICRON+RANGE+-+A+SELF-PLANARIZED+AU+METALLIZATION+PROCESS+BY+SELECTIVE+ELECTROPLATING+FOR+SI+LSI+APPLICATIONS; http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=A1995RK73200023; http://www.scopus.com/record/display.url?eid=2-s2.0-0029344957&origin=inward
الاتاحة: http://repository.ust.hk/ir/Record/1783.1-29618
https://doi.org/10.1143/JJAP.34.L945
http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=0021-4922&rft.volume=34&rft.issue=7B&rft.date=1995&rft.spage=945&rft.epage=&rft.aulast=LO&rft.aufirst=TC&rft.atitle=DOWNSIZING+GOLD+WIRES+TO+SUBMICRON+RANGE+-+A+SELF-PLANARIZED+AU+METALLIZATION+PROCESS+BY+SELECTIVE+ELECTROPLATING+FOR+SI+LSI+APPLICATIONS
http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=A1995RK73200023
http://www.scopus.com/record/display.url?eid=2-s2.0-0029344957&origin=inward -
10Patent
المؤلفون: Huang, Yimin, Liu, Chih-Chien, Yew, Tri-Rung
المساهمون: 游萃蓉
مصطلحات موضوعية: inter-metal interconnection, dielectric layer, metal plug, IMD layer, insulating layer, PE-oxide layer, photolithography, etching
Time: 3
Relation: 專利權人:United Microelectronics Corp., Hsinchu, Taiwan; US6352918; http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/58539