المؤلفون: Jincheng Lin, Di Yu, Panpan Lin, Decai Ma, Lili Xing, Peng He, Tiesong Lin, Weiqi Yang

المصدر: Journal of Materials Research and Technology, Vol 28, Iss , Pp 3670-3675 (2024)

مصطلحات موضوعية: Superalloy, Pulsed electric current, Low-temperature diffusion bonding, Heat treatment, Mechanical properties, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785423033458; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/deb818e38b69495d8adf3c70bb92ec45

المؤلفون: Wenqi Zhao, Chun Li, Tong Lin, Jianwei Gao, Xiaoqing Si, Junlei Qi, Xiangyu Dai, Jian Cao

المصدر: Journal of Materials Research and Technology, Vol 24, Iss , Pp 7599-7613 (2023)

مصطلحات موضوعية: Ti6Al4V alloy, Hydrogenation, Nanocrystallization, Low temperature diffusion bonding, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S223878542301027X; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/645c3e18eef6491e961ee22053ee7c80

المؤلفون: Yuqing Chen, Guofeng Wang, Yongkang Liu, Liqiang Zhan, He Diao, Yuelin Wang

المصدر: Metals; Volume 12; Issue 1; Pages: 94

مصطلحات موضوعية: surface mechanical attrition treatment, nanostructure, low-temperature diffusion bonding

وصف الملف: application/pdf

Relation: Metal Casting, Forming and Heat Treatment; https://dx.doi.org/10.3390/met12010094

الاتاحة: https://doi.org/10.3390/met12010094

المؤلفون: Cherng-Yuh Su, Jia-Liang Huang, Po-Chun Chen, Hsin-Jung Yu, Dai-Liang Ma, Bang-Ying Yu

المصدر: Coatings; Volume 8; Issue 11; Pages: 401

مصطلحات موضوعية: alumina/copper heterojunction, low-temperature diffusion bonding, thin-film pre-metallization

وصف الملف: application/pdf

Relation: https://dx.doi.org/10.3390/coatings8110401

الاتاحة: https://doi.org/10.3390/coatings8110401

المؤلفون: Tatsuhiko Aizawa, Tomomi Shiratori

المصدر: MATERIALS TRANSACTIONS. 2020, 61(2):266

المؤلفون: junya inoue, kittipan pongmorakot, shoichi nambu, toshihiko koseki, ポンモラゴット ギッティパン, 井上 純哉, 南部 将一, 小関 敏彦

المصدر: Preprints of the National Meeting of JWS. 2015, :182

المؤلفون: Dai-Liang Ma, Po Chun Chen, Cherng-Yuh Su, Bang-Ying Yu, Jia-Liang Huang, Hsin-Jung Yu

المصدر: Coatings, Vol 8, Iss 11, p 401 (2018)
Coatings
Volume 8
Issue 11

مصطلحات موضوعية: Materials science, 020502 materials, Diffusion, Doping, chemistry.chemical_element, 02 engineering and technology, Surfaces and Interfaces, Substrate (electronics), Atmospheric temperature range, 021001 nanoscience & nanotechnology, Copper, Surfaces, Coatings and Films, 0205 materials engineering, chemistry, Chemical engineering, low-temperature diffusion bonding, Transmission electron microscopy, lcsh:TA1-2040, alumina/copper heterojunction, Materials Chemistry, thin-film pre-metallization, 0210 nano-technology, lcsh:Engineering (General). Civil engineering (General), Diffusion bonding, Titanium

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::74f8b4a58e92cdf3967858d8a6f1039f
https://www.mdpi.com/2079-6412/8/11/401