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1Conference
المؤلفون: Stoukatch, Serguei, André, Nicolas, Delhaye, Thibault, Dupont, François, Redouté, Jean-Michel, Flandre, Denis
المصدر: Proceedings of IEEE Sensors, 1-4 (2020-10-25); 2020 IEEE Sensors, Rotterdam, Netherlands [NL], 25-28 Oct. 2020
مصطلحات موضوعية: low-cost flip-chip assembly, anisotropic conductive films, sensors assembly on flex, assembly methods for prototypes, Engineering, computing & technology, Electrical & electronics engineering, Ingénierie, informatique & technologie, Ingénierie électrique & électronique
Relation: https://ieeexplore.ieee.org/abstract/document/9278669; urn:issn:1930-0395; urn:issn:2168-9229
URL الوصول: https://orbi.uliege.be/handle/2268/256428
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2
المؤلفون: Nicolas André, Jean-Michel Redoute, Serguei Stoukatch, François Dupont, Thibault Delhaye, Denis Flandre
المساهمون: UCL - SST/ICTM/ELEN - Pôle en ingénierie électrique
المصدر: IEEE Sensors, Vol. 2020, p. 1-4 (2020)
مصطلحات موضوعية: Materials science, business.industry, Low-cost flip-chip assembly, Anisotropic conductive films, Sensors assembly on flex, Assembly methods for prototypes, Process (computing), Anisotropic conductive film, Hardware_PERFORMANCEANDRELIABILITY, 02 engineering and technology, Temperature measurement, Die (integrated circuit), 020202 computer hardware & architecture, 03 medical and health sciences, 0302 clinical medicine, CMOS, Hardware_INTEGRATEDCIRCUITS, 0202 electrical engineering, electronic engineering, information engineering, Optoelectronics, business, Electrical conductor, 030217 neurology & neurosurgery, Flip chip, Strain gauge
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3Electronic Resource
المؤلفون: UCL - SST/ICTM/ELEN - Pôle en ingénierie électrique, Stoukatch, Serguei, André, Nicolas, Delhaye, Thibault, Dupont, François, Redouté, Jean-Michel, Flandre, Denis
المصدر: IEEE Sensors, Vol. 2020, p. 1-4 (2020)