المؤلفون: Jimesh D. Bhagatji, Christopher Morris, Yogaraja Sridhar, Bodhisatwa Bhattacharjee, Krishnanand N. Kaipa, Oleksandr G. Kravchenko

المصدر: Materials, Vol 17, Iss 14, p 3389 (2024)

مصطلحات موضوعية: through-thickness reinforcement, crack resistance, interlaminate toughing, cohesive zone modeling, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85

Relation: https://www.mdpi.com/1996-1944/17/14/3389; https://doaj.org/toc/1996-1944; https://doaj.org/article/5ecca242c94448ecb30c2abb6a4e346e

الاتاحة: https://doi.org/10.3390/ma17143389
https://doaj.org/article/5ecca242c94448ecb30c2abb6a4e346e