يعرض 1 - 20 نتائج من 10,562 نتيجة بحث عن '"integrated “ 3"', وقت الاستعلام: 0.80s تنقيح النتائج
  1. 1
    Academic Journal

    المؤلفون: Cheng, Xin1 (AUTHOR) xin.cheng.5x@stu.hosei.ac.jp, Zhou, Jinjia1 (AUTHOR) zhou@hosei.ac.jp, Zhang, Zhiqiang2 (AUTHOR) zzq.zhangzhiqiang2018@gmail.com, Yu, Wenxin2 (AUTHOR) yuwenxin@swust.edu.cn

    المصدر: Journal of Circuits, Systems & Computers. 11/15/2024, Vol. 33 Issue 16, p1-18. 18p.

  2. 2
    Academic Journal

    المؤلفون: Feng, Yinghao1 (AUTHOR), Dong, Gang1 (AUTHOR) gdong@xidian.edu.cn, Liu, Daihang1 (AUTHOR), Zhi, Changle1 (AUTHOR), Yang, Deguang1 (AUTHOR), Wang, Yang1 (AUTHOR), Zhu, Zhangming1 (AUTHOR), Yang, Yintang1 (AUTHOR)

    المصدر: Journal of Circuits, Systems & Computers. 11/30/2024, Vol. 33 Issue 17, p1-24. 24p.

  3. 3
    Academic Journal

    المؤلفون: Zhao, Qiutong1,2, Guo, Jingquan1,2, Ye, Shujun1,2 ye.shujun@bit.edu.cn, Zhang, Jingjing1,2, Yu, Lihui1,2

    المصدر: ChemistrySelect. 9/4/2024, Vol. 9 Issue 33, p1-8. 8p.

  4. 4
    Academic Journal

    المؤلفون: Jordan L. Lawson (ORCID 0009-0002-1108-5903), Laura M. O'Dwyer, Eric Dearing, Anastasia E. Raczek, Claire Foley, Noman Khanani (ORCID 0000-0001-5392-1725), Mary E. Walsh, Yan R. Leigh (ORCID 0009-0001-4911-5752)

    المصدر: AERA Open. 2024 10(1).

    Peer Reviewed: Y

    Page Count: 23

    Sponsoring Agency: Institute of Education Sciences (ED)

    مصطلحات جغرافية: Massachusetts (Boston)

    Assessment and Survey Identifiers: Massachusetts Comprehensive Assessment System

    IES Funded: Yes

  5. 5
    Academic Journal
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    Academic Journal
  7. 7
    Academic Journal
  8. 8
    Academic Journal
  9. 9
    Academic Journal

    المؤلفون: Lu, Tsan-Feng1 (AUTHOR) s0881513.c@nycu.edu.tw, Yen, Yu-Ting1 (AUTHOR), Wang, Pei-Wen1 (AUTHOR), Cheng, Yuan-Fu1 (AUTHOR), Chen, Cheng-Hsiang1 (AUTHOR), Wu, YewChung Sermon1 (AUTHOR) sermonwu@stanfordalumni.org

    المصدر: Nanomaterials (2079-4991). May2024, Vol. 14 Issue 10, p861. 8p.

  10. 10
    Academic Journal

    المؤلفون: Lu, Tsan-Feng1 (AUTHOR) s0881513.c@nycu.edu.tw, Wang, Pei-Wen1 (AUTHOR), Cheng, Yuan-Fu1 (AUTHOR), Yen, Yu-Ting1 (AUTHOR), Wu, YewChung Sermon1 (AUTHOR) sermonwu@stanfordalumni.org

    المصدر: Nanomaterials (2079-4991). May2024, Vol. 14 Issue 9, p771. 13p.

  11. 11
    Academic Journal

    المؤلفون: Nakamura, Nathan1,2 (AUTHOR) paul.szypryt@nist.gov, Szypryt, Paul1,2 (AUTHOR) bradley.alpert@nist.gov, Dagel, Amber L.3 (AUTHOR) aldagel@sandia.gov, Alpert, Bradley K.1 (AUTHOR) douglas.bennett@nist.gov, Bennett, Douglas A.1 (AUTHOR) william.doriese@nist.gov, Doriese, William Bertrand1 (AUTHOR) malcolm.durkin@nist.gov, Durkin, Malcolm1,2 (AUTHOR) joe.fowler@nist.gov, Fowler, Joseph W.1,2 (AUTHOR) johnathon.gard@colorado.edu, Fox, Dylan T.3 (AUTHOR) dylfox@sandia.gov, Gard, Johnathon D.1,2 (AUTHOR) kelsey.morgan@nist.gov, Goodner, Ryan N.3 (AUTHOR) rngoodn@sandia.gov, Harris, James Zachariah3 (AUTHOR) esjimen@sandia.gov, Hilton, Gene C.1 (AUTHOR) galen.oneil@nist.gov, Jimenez, Edward S.3 (AUTHOR) blkerne@sandia.gov, Kernen, Burke L.3 (AUTHOR) dmcarth@sandia.gov, Larson, Kurt W.3 (AUTHOR) paschul@sandia.gov, Levine, Zachary H.4 (AUTHOR) zachary.levine@nist.gov, McArthur, Daniel3 (AUTHOR) krthomp@sandia.gov, Morgan, Kelsey M.1,2 (AUTHOR) nathan.ortiz@nist.gov, O'Neil, Galen C.1 (AUTHOR) carl.reintsema@nist.gov

    المصدر: Sensors (14248220). May2024, Vol. 24 Issue 9, p2890. 17p.

  12. 12
    Academic Journal

    المؤلفون: Jacobs, Kristof J. P.1 (AUTHOR) kristof.j.p.jacobs@imec.be, Beyne, Eric2 (AUTHOR) eric.beyne@imec.be

    المصدر: IEEE Transactions on Semiconductor Manufacturing. Nov2023, Vol. 36 Issue 4, p673-675. 3p.

  13. 13
    Academic Journal
  14. 14
    Academic Journal
  15. 15
    Academic Journal
  16. 16
    Dissertation/ Thesis
  17. 17
    Academic Journal
  18. 18
    Academic Journal
  19. 19
    Academic Journal

    المصدر: IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems. Nov2022, Vol. 41 Issue 11, p4575-4586. 12p.

  20. 20
    Academic Journal

    المؤلفون: Li, Jie1, Tang, Min1 tm222@sjtu.edu.cn, Mao, Junfa1

    المصدر: IEEE Transactions on Components, Packaging & Manufacturing Technology. Sep2022, Vol. 12 Issue 9, p1484-1491. 8p.