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1Academic Journal
المؤلفون: Cheng, Xin1 (AUTHOR) xin.cheng.5x@stu.hosei.ac.jp, Zhou, Jinjia1 (AUTHOR) zhou@hosei.ac.jp, Zhang, Zhiqiang2 (AUTHOR) zzq.zhangzhiqiang2018@gmail.com, Yu, Wenxin2 (AUTHOR) yuwenxin@swust.edu.cn
المصدر: Journal of Circuits, Systems & Computers. 11/15/2024, Vol. 33 Issue 16, p1-18. 18p.
مصطلحات موضوعية: *THREE-dimensional integrated circuits, *FORCE density, *INTEGRATED circuits, *DEEP learning, *LEGALIZATION
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2Academic JournalThermal Modeling and Analysis of 3D ICS with Heat Dissipation Effect of Power Distribution Networks.
المؤلفون: Feng, Yinghao1 (AUTHOR), Dong, Gang1 (AUTHOR) gdong@xidian.edu.cn, Liu, Daihang1 (AUTHOR), Zhi, Changle1 (AUTHOR), Yang, Deguang1 (AUTHOR), Wang, Yang1 (AUTHOR), Zhu, Zhangming1 (AUTHOR), Yang, Yintang1 (AUTHOR)
المصدر: Journal of Circuits, Systems & Computers. 11/30/2024, Vol. 33 Issue 17, p1-24. 24p.
مصطلحات موضوعية: *THREE-dimensional integrated circuits, *POWER distribution networks, *TEMPERATURE distribution, *FINITE element method, *DEBYE temperatures
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3Academic Journal
المؤلفون: Zhao, Qiutong1,2, Guo, Jingquan1,2, Ye, Shujun1,2 ye.shujun@bit.edu.cn, Zhang, Jingjing1,2, Yu, Lihui1,2
المصدر: ChemistrySelect. 9/4/2024, Vol. 9 Issue 33, p1-8. 8p.
مصطلحات موضوعية: *SILICON nitride, *THREE-dimensional integrated circuits, *ETCHING, *SEMICONDUCTOR manufacturing, *PHOSPHORIC acid, *BOILING-points, *SOLVENT extraction
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4Academic Journal
المؤلفون: Jordan L. Lawson (ORCID
0009-0002-1108-5903 ), Laura M. O'Dwyer, Eric Dearing, Anastasia E. Raczek, Claire Foley, Noman Khanani (ORCID0000-0001-5392-1725 ), Mary E. Walsh, Yan R. Leigh (ORCID0009-0001-4911-5752 )المصدر: AERA Open. 2024 10(1).
Peer Reviewed: Y
Page Count: 23
Sponsoring Agency: Institute of Education Sciences (ED)
Descriptors: Elementary School Students, Academic Achievement, Intervention, Urban Schools, Grade 3, Grade 4, Grade 5, Integrated Services, Program Effectiveness, Public Schools, Mathematics Achievement, Language Arts, Educational Environment, Poverty
مصطلحات جغرافية: Massachusetts (Boston)
Assessment and Survey Identifiers: Massachusetts Comprehensive Assessment System
IES Funded: Yes
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5Academic Journal
المؤلفون: Martina Vasil (ORCID
0000-0001-9655-0565 )المصدر: Update: Applications of Research in Music Education. 2024 43(1):59-69.
Peer Reviewed: Y
Page Count: 11
Descriptors: Music Teachers, Integrated Curriculum, Music Education, Musicians, Music Activities, Learner Engagement, Elementary School Teachers, Teacher Attitudes, Musical Instruments, Active Learning, Musical Composition, Check Lists, Performance, Grade 4, Grade 3, Grade 5, Grade 6, Barriers, Influences, Music
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6Academic Journal
المؤلفون: Zhao-Pei XU1, Kang-Jia WANG1 konka05@163.com
المصدر: Thermal Science. 2024, Vol. 28 Issue 5B, p4081-4088. 8p.
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7Academic Journal
المؤلفون: Li, Yuepei1,2 (AUTHOR), Rao, Jiayu3 (AUTHOR), Wang, Lei1 (AUTHOR), Ding, Yuan1 (AUTHOR), Podilchak, Symon K.1,2 (AUTHOR) s.podilchak@ed.ac.uk
المصدر: Electronics Letters (Wiley-Blackwell). Jan2024, Vol. 60 Issue 2, p1-6. 6p.
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8Academic Journal
المؤلفون: Tejaswini Dalvi (ORCID
0000-0001-7205-2246 ), Kristen Wendellالمصدر: Science Education. 2024 108(4):1051-1071.
Peer Reviewed: Y
Page Count: 21
Sponsoring Agency: National Science Foundation (NSF)
Descriptors: Elementary School Students, Grade 3, Comprehension, Science Education, Design, Engineering Education, Problem Solving, Decision Making, Learning Processes, Integrated Curriculum, Animals, Animal Husbandry, Learning Activities, Student Attitudes, Conflict, Expectation, Failure
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9Academic Journal
المؤلفون: Lu, Tsan-Feng1 (AUTHOR) s0881513.c@nycu.edu.tw, Yen, Yu-Ting1 (AUTHOR), Wang, Pei-Wen1 (AUTHOR), Cheng, Yuan-Fu1 (AUTHOR), Chen, Cheng-Hsiang1 (AUTHOR), Wu, YewChung Sermon1 (AUTHOR) sermonwu@stanfordalumni.org
المصدر: Nanomaterials (2079-4991). May2024, Vol. 14 Issue 10, p861. 8p.
مصطلحات موضوعية: *THREE-dimensional integrated circuits, *MOORE'S law, *STRAIN energy, *COPPER, *SURFACE morphology, *SUBSTRATES (Materials science), *SURFACE preparation, *SOLDER & soldering
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10Academic Journal
المؤلفون: Lu, Tsan-Feng1 (AUTHOR) s0881513.c@nycu.edu.tw, Wang, Pei-Wen1 (AUTHOR), Cheng, Yuan-Fu1 (AUTHOR), Yen, Yu-Ting1 (AUTHOR), Wu, YewChung Sermon1 (AUTHOR) sermonwu@stanfordalumni.org
المصدر: Nanomaterials (2079-4991). May2024, Vol. 14 Issue 9, p771. 13p.
مصطلحات موضوعية: *COPPER surfaces, *THREE-dimensional integrated circuits, *MOORE'S law, *KIRKENDALL effect, *EPOXY resins, *COPPER
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11Academic Journal
المؤلفون: Nakamura, Nathan1,2 (AUTHOR) paul.szypryt@nist.gov, Szypryt, Paul1,2 (AUTHOR) bradley.alpert@nist.gov, Dagel, Amber L.3 (AUTHOR) aldagel@sandia.gov, Alpert, Bradley K.1 (AUTHOR) douglas.bennett@nist.gov, Bennett, Douglas A.1 (AUTHOR) william.doriese@nist.gov, Doriese, William Bertrand1 (AUTHOR) malcolm.durkin@nist.gov, Durkin, Malcolm1,2 (AUTHOR) joe.fowler@nist.gov, Fowler, Joseph W.1,2 (AUTHOR) johnathon.gard@colorado.edu, Fox, Dylan T.3 (AUTHOR) dylfox@sandia.gov, Gard, Johnathon D.1,2 (AUTHOR) kelsey.morgan@nist.gov, Goodner, Ryan N.3 (AUTHOR) rngoodn@sandia.gov, Harris, James Zachariah3 (AUTHOR) esjimen@sandia.gov, Hilton, Gene C.1 (AUTHOR) galen.oneil@nist.gov, Jimenez, Edward S.3 (AUTHOR) blkerne@sandia.gov, Kernen, Burke L.3 (AUTHOR) dmcarth@sandia.gov, Larson, Kurt W.3 (AUTHOR) paschul@sandia.gov, Levine, Zachary H.4 (AUTHOR) zachary.levine@nist.gov, McArthur, Daniel3 (AUTHOR) krthomp@sandia.gov, Morgan, Kelsey M.1,2 (AUTHOR) nathan.ortiz@nist.gov, O'Neil, Galen C.1 (AUTHOR) carl.reintsema@nist.gov
المصدر: Sensors (14248220). May2024, Vol. 24 Issue 9, p2890. 17p.
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12Academic Journal
المؤلفون: Jacobs, Kristof J. P.1 (AUTHOR) kristof.j.p.jacobs@imec.be, Beyne, Eric2 (AUTHOR) eric.beyne@imec.be
المصدر: IEEE Transactions on Semiconductor Manufacturing. Nov2023, Vol. 36 Issue 4, p673-675. 3p.
مصطلحات موضوعية: *HYBRID securities, *INTEGRATED circuits, THREE-dimensional integrated circuits, ETCHING techniques, VISIBLE spectra
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13Academic Journal
المؤلفون: Huang, Shou-Yi, Huang, Shih-Hsu
المصدر: Electronics (2079-9292); Sep2024, Vol. 13 Issue 18, p3759, 17p
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14Academic Journal
المؤلفون: Tianyu Gong, Yaosong Long, Zhongtao Cheng, Yiqing Li
المصدر: Advances in Aerodynamics, Vol 6, Iss 1, Pp 1-24 (2024)
مصطلحات موضوعية: Waverider, Three-dimensional inward turning inlet, Integrated design, Improving method, Engineering (General). Civil engineering (General), TA1-2040, Motor vehicles. Aeronautics. Astronautics, TL1-4050
وصف الملف: electronic resource
Relation: https://doaj.org/toc/2524-6992
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15Academic Journal
المؤلفون: Cassie F. Quigley, Danielle Herro, Holly Plank, Aileen Owens, Oluwadara Abimbade
المصدر: Computer Science Education. 2024 34(4):778-805.
Peer Reviewed: Y
Page Count: 28
Descriptors: Computer Science Education, Minority Group Students, Student Interests, Self Concept, Individual Development, Disproportionate Representation, Instructional Effectiveness, Integrated Curriculum, Student Attitudes, Mental Computation, Elementary School Students, Middle School Students, Grade 3, Grade 4, Grade 5, Grade 6, Grade 7, Grade 8
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16Dissertation/ Thesis
المؤلفون: Lynette Gross
المصدر: ProQuest LLC. 2024Ph.D. Dissertation, Grand Canyon University.
Peer Reviewed: N
Page Count: 247
Descriptors: Cultural Pluralism, Educational Strategies, Diversity (Institutional), Teacher Attitudes, Kindergarten, Grade 1, Grade 2, Grade 3, Public Schools, Elementary School Teachers, Teaching Methods, Language Acquisition, Knowledge Level, Integrated Activities, Learning Activities, Cultural Influences, English Language Learners, English (Second Language), Second Language Instruction
مصطلحات جغرافية: Arizona
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17Academic Journal
المؤلفون: Tamanna Sultana, Zeba Farhana, Sameul Hoque, Md. Al-Amin
المصدر: Discover Education. 2024 3.
Peer Reviewed: Y
Page Count: 17
Descriptors: Foreign Countries, STEM Education, Elementary School Teachers, Textbook Evaluation, Science Curriculum, Mathematics Curriculum, Grade 3, Grade 4, Grade 5, Teaching Guides, Expertise, Learning Activities, Validated Programs, Curriculum Development, Integrated Curriculum, 21st Century Skills
مصطلحات جغرافية: Bangladesh
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18Academic Journal
المؤلفون: Haider, Iqram, Basu, Ananjan, Koul, Shiban Kishen
المصدر: Progress in Electromagnetics Research Letters; 2024, Vol. 119, p59-65, 7p
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19Academic Journal
المؤلفون: Lu, Yi-Chen1 yclu@gatech.edu, Pentapati, Sai1, Zhu, Lingjun1, Murali, Gauthaman1, Samadi, Kambiz2, Lim, Sung Kyu3
المصدر: IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems. Nov2022, Vol. 41 Issue 11, p4575-4586. 12p.
مصطلحات موضوعية: *INTEGRATED circuits, *INDUSTRIAL design, *COMMERCIAL art, MULTICORE processors, THREE-dimensional integrated circuits, MACHINE learning, PARALLEL algorithms, ELECTRONIC design automation
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20Academic Journal
المؤلفون: Li, Jie1, Tang, Min1 tm222@sjtu.edu.cn, Mao, Junfa1
المصدر: IEEE Transactions on Components, Packaging & Manufacturing Technology. Sep2022, Vol. 12 Issue 9, p1484-1491. 8p.
مصطلحات موضوعية: *PARALLEL programming, *INTEGRATED circuits, THREE-dimensional integrated circuits, GRAPHICS processing units