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1Academic Journal
المؤلفون: Michael Fahrbach, Min Xu, Wilson Ombati Nyang’au, Oleg Domanov, Christian H. Schwalb, Zhi Li, Christian Kuhlmann, Uwe Brand, Erwin Peiner
المصدر: Sensors; Volume 23; Issue 4; Pages: 2003
مصطلحات موضوعية: piezoresistive cantilever, tactile surface scanning, high-throughput metrology, contact mode, resonance frequency, quality factor
وصف الملف: application/pdf
Relation: Physical Sensors; https://dx.doi.org/10.3390/s23042003
الاتاحة: https://doi.org/10.3390/s23042003
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المؤلفون: Fahrbach, Michael, Xu, Min, Nyang'au, Wilson Ombati, Domanov, Oleg, Schwalb, Christian H., Li, Zhi, Kuhlmann, Christian, Brand, Uwe, Peiner, Erwin
المصدر: Sensors, 23(4), 2003, (2023-02-10)
مصطلحات موضوعية: piezoresistive cantilever, tactile surface scanning, high-throughput metrology, contact mode, resonance frequency, quality factor
Relation: https://doi.org/10.3390/s23042003; https://doi.org/10.5281/zenodo.7627016; https://doi.org/10.5281/zenodo.7627017; oai:zenodo.org:7627017
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4Academic Journal
المؤلفون: Sadeghian Marnani, H., Herfst, R.W., Dool, T.C. van den, Crowcombe, W.E., Winters, J., Kramers, G.F.I.J.
المصدر: Cain, J.P.Sanchez, M.I., 30th European Mask and Lithography Conference, 24 June 2014, Dresden, Germany, 9031
مصطلحات موضوعية: Electronics, Scanning Probe Microscopy, Defect inspection, High-throughput metrology, Mask inspection, High Tech Systems & Materials, Industrial Innovation, Mechatronics, Mechanics & Materials, OM - Opto-Mechatronics, TS - Technical Sciences
Relation: Proceedings of SPIE - The International Society for Optical Engineering; uuid:b840cc65-940b-4dcd-818d-921934274250; 520586; http://resolver.tudelft.nl/uuid:b840cc65-940b-4dcd-818d-921934274250
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المؤلفون: Geerten Frans Ijsbrand Kramer, W.E. Crowcombe, R.W. Herfst, Hamed Sadeghian, Jasper Winters, T.C. van den Dool
المصدر: Proceedings of SPIE 9231: 30th European Mask and Lithography Conference, Dresden, Germany, 24-25 June 2014
Cain, J.P.Sanchez, M.I., 30th European Mask and Lithography Conference, 24 June 2014, Dresden, Germany, 9031مصطلحات موضوعية: Engineering, OM - Opto-Mechatronics, TS - Technical Sciences, Industrial Innovation, Image quality, business.industry, Scanning Probe Microscopy, Mask inspection, Defect inspection, High Tech Systems & Materials, Mechatronics, Mechanics & Materials, Sample (graphics), High-throughput metrology, Metrology, Scanning probe microscopy, Electronic engineering, Wafer, Electronics, business, Throughput (business)
وصف الملف: application/x-www-form-urlencoded; charset=utf-8; application/pdf
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مصطلحات موضوعية: OM - Opto-Mechatronics, TS - Technical Sciences, Industrial Innovation, Scanning Probe Microscopy, Defect inspection, High Tech Systems & Materials, Mask inspection, Electronics, Mechanics & Materials, Mechatronics, High-throughput metrology
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7Electronic Resource
المؤلفون: Sadeghian Marnani, H. (author), Herfst, R.W. (author), Van den Dool, T.C. (author), Crowcombe, W.E. (author), Winters, J. (author), Kramer, G.F.I.J. (author)
مصطلحات الفهرس: Scanning Probe Microscopy, defect inspection, high-throughput metrology, mask inspection, conference paper, Text
URL:
http://resolver.tudelft.nl/uuid:133b9bc3-86a0-4e35-b85c-6abcbf41a963
Proceedings of SPIE 9231: 30th European Mask and Lithography Conference, Dresden, Germany, 24-25 June 2014--9781628412857
doi:10.1117/12.2065939