المؤلفون: Eep Kumar Singh, Sameer Kh, Pankaj Srivastava, J. K. Bajpai

المساهمون: The Pennsylvania State University CiteSeerX Archives

المصدر: http://home.iitk.ac.in/%7Esamkhan/Bio_data/publications/Khandekar_Conf_38.pdf.

مصطلحات موضوعية: Microelectronic thermal management, numerical modeling, heat pipes and heat sinks, effective thermal conductivity, passive

وصف الملف: application/pdf

Relation: http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.721.7287; http://home.iitk.ac.in/%7Esamkhan/Bio_data/publications/Khandekar_Conf_38.pdf

الاتاحة: http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.721.7287
http://home.iitk.ac.in/%7Esamkhan/Bio_data/publications/Khandekar_Conf_38.pdf