المؤلفون: Yu-Hsuan Hsu, Xin-Dai Lin, Yi-Hsin Lin, Dong-Sing Wuu, Ray-Hua Horng

المصدر: Discover Nano, Vol 19, Iss 1, Pp 1-9 (2024)

مصطلحات موضوعية: Blue light, Micro-LED, Double layers passivation, Atomic layer deposition, Flip-chip bonding, Materials of engineering and construction. Mechanics of materials, TA401-492

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2731-9229

URL الوصول: https://doaj.org/article/2084a40551ed46129c6dc96c4f7d5599

المؤلفون: Yang, Tianxi, Sun, Jie, 1977, Chen, Yiren, Yan, Zhi Bing, Li, Yang, Zhou, Yijian, Huang, Zhonghang, Lin, Chang, Yan, Qun

المصدر: Displays. 86

مصطلحات موضوعية: Flip-chip bonding, Indium, Micro-LED, High resolution, Formic acid reflow

URL الوصول: https://research.chalmers.se/publication/543985

المؤلفون: Huang, Xiaowei, Lang, Taifu, Tang, Xuehuang, Xie, Yujie, Lin, Xin, Yang, Yifan, Wang, Shuaishuai, Zhou, Xiongtu, Zhang, Yongai, Sun, Jie, 1977, Lin, Chang, Yan, Qun

المصدر: Materials Science in Semiconductor Processing. 186

مصطلحات موضوعية: Indium bumps, Flip-chip bonding, Micro-LED, TFT, PDMS

URL الوصول: https://research.chalmers.se/publication/543657

المؤلفون: Wu, Binghan, Song, Cen, Zhao, Gang

المصدر: Journal of Industrial Engineering and Applied Science, 2(4), 66-72, (2024-08-01)

مصطلحات موضوعية: Heterogeneous integration, High-Performance Computing, Telecommunications, Sensors, Semiconductor Technologies, CMOS, GaAs, MEMS, Flip-Chip Bonding, Through-Silicon Vias (TSV), Wafer-Level Packaging (WLP), Power Efficiency, integration Density, Thermal Management, Design Verification, Fabrication Techniques, Processing Speed, Signal integrity, Data Throughput, Energy Consumption

Relation: https://zenodo.org/communities/jieas; https://doi.org/10.5281/zenodo.12794469; https://doi.org/10.5281/zenodo.12794470; oai:zenodo.org:12794470; https://www.suaspress.org/ojs/index.php/JIEAS/article/view/v2n4a11; ark:/40704/JIEAS.v2n4a11

الاتاحة: https://doi.org/10.5281/zenodo.12794470
https://www.suaspress.org/ojs/index.php/JIEAS/article/view/v2n4a11

المؤلفون: Norris, Graham J., Michaud, Laurent, Pahl, David, Kerschbaum, Michael, Eichler, Christopher, Besse, Jean-Claude, id_orcid:0 000-0002-1490-0072, Wallraff, Andreas

المصدر: EPJ Quantum Technology, 11 (1)

مصطلحات موضوعية: Three-dimensional integration, Flip-chip bonding, Superconducting microwave resonators, Coplanar Waveguide or CPW, Frequency targeting, Quality factor

وصف الملف: application/application/pdf

Relation: info:eu-repo/semantics/altIdentifier/wos/001140967300001; info:eu-repo/grantAgreement/SNF/R'Equip/170731; http://hdl.handle.net/20.500.11850/653246

الاتاحة: https://hdl.handle.net/20.500.11850/653246
https://doi.org/10.3929/ethz-b-000653246

المؤلفون: Korotcenkov, G.S., Korotchenkov, G.S., Коротченков, Г.

المصدر: Handbook of II-VI Semiconductor-Based Sensors and Radiation Detectors: Volume 2, Photodetectors

مصطلحات موضوعية: Avalanche photodiodes (APD), CdZnTe (CZT), Charge-coupled devices (CCD), Complementary metal-oxide-semiconductor (CMOS), Cooled, cooling, Dual-band detector, Flip-chip bonding, Focal-plane array (FPA), FPA technology, GaAs/AlGaAs, HDVIP architecture, heterostructures, HgCdTe, HgCdTe (MCT), HgTe/CdTe, HOT, hybridization, InAs/GaSb, Indium bump technique, Loophole technique, Mesa structure, Microbolometric, Molecular beam epitaxy (MBE), Monolithic, Multi-spectral, Multiplexer, NBn barrier structure, Optical-mechanical system, peltier element

وصف الملف: application/pdf

Relation: https://ibn.idsi.md/vizualizare_articol/182000

الاتاحة: https://ibn.idsi.md/vizualizare_articol/182000
https://doi.org/10.1007/978-3-031-20510-1_4

المؤلفون: Tian, Wenjing, Beste, Lucas, Khachikyan, Alexander, Mittelstädt, Christoph, Dekker, Ronald, Wörhoff, Kerstin, van Kerkhof, Joost, Santos, Rui, Williams, Kevin A., Leijtens, Xaveer J.M.

المصدر: Tian , W , Beste , L , Khachikyan , A , Mittelstädt , C , Dekker , R , Wörhoff , K , van Kerkhof , J , Santos , R , Williams , K A & Leijtens , X J M 2023 , ' Flip-chip bonding of InP die on SiN-based TriPleX carrier with novel laser soldering ' , IEEE Journal of Quantum Electronics , vol. 59 , no. 3 , 9963964 . https://doi.org/10.1109/JQE.2022.3224794

مصطلحات موضوعية: Flip-chip bonding, Photonic assembly and packaging, laser soldering

وصف الملف: application/pdf

الاتاحة: https://research.tue.nl/en/publications/28310461-78fb-4db5-b69a-5aaf0c6036cb
https://doi.org/10.1109/JQE.2022.3224794
https://pure.tue.nl/ws/files/301441542/Flip_Chip_Bonding_of_InP_Die_on_SiN_Based_TriPleX_Carrier_With_Novel_Laser_Soldering.pdf
http://www.scopus.com/inward/record.url?scp=85144064825&partnerID=8YFLogxK

المؤلفون: Li, Chenhui, Bhat, Srivathsa, Stabile, Ripalta, Song, Yuchen, Neumeyr, Christian, Raz, Oded

المصدر: Li , C , Bhat , S , Stabile , R , Song , Y , Neumeyr , C & Raz , O 2022 , ' Hybrid Integration of VCSEL and 3-μm Silicon Waveguide Based on a Monolithic Lens System ' , IEEE Transactions on Components, Packaging and Manufacturing Technology , vol. 12 , no. 5 , 9736950 , pp. 883-886 . https://doi.org/10.1109/TCPMT.2022.3160149

مصطلحات موضوعية: Couplings, Lenses, Mirrors, Optical waveguides, Resists, VCSEL, Vertical cavity surface emitting lasers, Waveguide lasers, flip-chip bonding, microlens, silicon photonic waveguide, Flip-chip bonding (FCB), vertical-cavity surface-emitting laser (VCSEL)

وصف الملف: application/pdf

الاتاحة: https://research.tue.nl/en/publications/7b25411a-fc3e-428f-a09e-7e1e24ee4e37
https://doi.org/10.1109/TCPMT.2022.3160149
https://pure.tue.nl/ws/files/206317314/Hybrid_Integration_of_VCSEL_and_3_m_Silicon_Waveguide_Based_on_a_Monolithic_Lens_System.pdf
http://www.scopus.com/inward/record.url?scp=85126536627&partnerID=8YFLogxK

المؤلفون: Stoukatch, Serguei, Nicolas, Andre, Dupont, François, Redouté, Jean-Michel, Flandre, Denis

المصدر: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (2021-11-13); 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), Gothenburg, Sweden [SE], from 13-09-2021 to 16-09-2021

مصطلحات موضوعية: Ultra-thinned SOI die, low-cost ultra-thinning, anisotropic conductive films, flip-chip bonding, Engineering, computing & technology, Electrical & electronics engineering, Ingénierie, informatique & technologie, Ingénierie électrique & électronique

URL الوصول: https://orbi.uliege.be/handle/2268/267019

المؤلفون: Demin Liu, Po-Chih Chen, Tzu-Chieh Chou, Han-Wen Hu, Kuan-Neng Chen

المصدر: IEEE Journal of the Electron Devices Society, Vol 9, Pp 868-875 (2021)

مصطلحات موضوعية: 3D integration, Cu bonding, wafer-level bonding, flip-chip bonding, Au passivation, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/9546807/; https://doaj.org/toc/2168-6734

URL الوصول: https://doaj.org/article/b511054cfba543d4abbaf535d0de84f0

المؤلفون: Meng-Chyi Wu, Ming-Che Chung, Cheng-Yeu Wu

المصدر: Micromachines; Volume 13; Issue 8; Pages: 1350

مصطلحات موضوعية: active matrix, MicroLED, micro-display, high pixels per inch, flip-chip bonding

وصف الملف: application/pdf

Relation: D1: Semiconductor Devices; https://dx.doi.org/10.3390/mi13081350

الاتاحة: https://doi.org/10.3390/mi13081350

المؤلفون: Jongwon Lee, Jae Yong Lee, Jonghyun Song, Gapseop Sim, Hyoungho Ko, Seong Ho Kong

المصدر: Micromachines; Volume 13; Issue 7; Pages: 1072

مصطلحات موضوعية: InP, SiC, flip-chip bonding, millimeter wave, heterogeneous integration

وصف الملف: application/pdf

Relation: A：Physics; https://dx.doi.org/10.3390/mi13071072

الاتاحة: https://doi.org/10.3390/mi13071072

المؤلفون: Muhammad Hassan Malik, Andreas Tsiamis, Hubert Zangl, Alfred Binder, Srinjoy Mitra, Ali Roshanghias

المصدر: Electronics; Volume 11; Issue 6; Pages: 849

مصطلحات موضوعية: ultra-thin-chips, multi-project wafers, hybrid integration, thermoconic flip chip, anisotropic conductive adhesives, flexible electronics, flip chip bonding

وصف الملف: application/pdf

Relation: Microelectronics; https://dx.doi.org/10.3390/electronics11060849

الاتاحة: https://doi.org/10.3390/electronics11060849

المؤلفون: Daiki FURUYAMA, Junta INOUE, Koji TATSUMI, Sho NAKAGAWA, Takuma KATASE, Takuma NAKAGAWA, 中川 卓眞, 中川 将, 井上 順太, 古山 大貴, 巽 康司, 片瀬 琢磨

المصدر: スマートプロセス学会誌 / Journal of Smart Processing. 2022, 11(5):227

المؤلفون: Meng-Chyi Wu, I-Ting Chen

المصدر: Advanced Photonics Research, Vol 2, Iss 7, Pp n/a-n/a (2021)

مصطلحات موضوعية: 960 × 540 and 1920 × 1080 micro light-emitting diode arrays, flip-chip bonding, maskless photolithography, UV micro-LED displays, Applied optics. Photonics, TA1501-1820, Optics. Light, QC350-467

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2699-9293

URL الوصول: https://doaj.org/article/67ee4cb0ca6b4fb5b6b13a2676fdcc21

المؤلفون: Behfar, Mohammad H., Khorramdel, Behnam, Korhonen, Arttu, Jansson, Elina, Leinonen, Aleksis, Tuomikoski, Markus, Mäntysalo, Matti

المصدر: Behfar , M H , Khorramdel , B , Korhonen , A , Jansson , E , Leinonen , A , Tuomikoski , M & Mäntysalo , M 2021 , ' Failure Mechanisms in Flip-Chip Bonding on Stretchable Printed Electronics ' , Advanced Engineering Materials , vol. 23 , no. 12 , 2100264 . https://doi.org/10.1002/adem.202100264

مصطلحات موضوعية: failure mechanism, flip-chip bonding, hybrid integration, printed stretchable electronics, roll-to-roll printing

وصف الملف: application/pdf

الاتاحة: https://cris.vtt.fi/en/publications/03fa4cd2-353c-49fd-8ef9-9aeaa738275c
https://doi.org/10.1002/adem.202100264
https://cris.vtt.fi/ws/files/53434845/adem.202100264.pdf
http://www.scopus.com/inward/record.url?scp=85115738420&partnerID=8YFLogxK

المؤلفون: Gädda, A., Ott, Jennifer, Bharthuar, S., Brücken, Erik, Kalliokoski, Matti, Karadzhinova-Ferrer, A., Bezak, M., Kirschenmann, S., Litichevsky, V., Golovleva, M., Martikainen, Laura, Winkler, Alexander, Chmill, V., Tuovinen, E., Luukka, P., Härkönen, Jaakko

المساهمون: Department of Electronics and Nanoengineering, Hele Savin Group, University of Helsinki, Ruder Boskovic Institute, Advacam Oy, Aalto-yliopisto, Aalto University

مصطلحات موضوعية: Pixel detector, Magnetic Czochralski silicon, Atomic layer deposition, Flip chip bonding

وصف الملف: application/pdf

Relation: NUCLEAR INSTRUMENTS AND METHODS IN PHYSICS RESEARCH SECTION A: ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT; Volume 986; Gädda, A, Ott, J, Bharthuar, S, Brücken, E, Kalliokoski, M, Karadzhinova-Ferrer, A, Bezak, M, Kirschenmann, S, Litichevsky, V, Golovleva, M, Martikainen, L, Winkler, A, Chmill, V, Tuovinen, E, Luukka, P & Härkönen, J 2021, ' AC-coupled n-in-p pixel detectors on MCz silicon with atomic layer deposition (ALD) grown thin film ', NUCLEAR INSTRUMENTS AND METHODS IN PHYSICS RESEARCH SECTION A: ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT, vol. 986, 164714 . https://doi.org/10.1016/j.nima.2020.164714; PURE UUID: 183e40fc-88ff-4d2c-9774-10884fa86b14; PURE ITEMURL: https://research.aalto.fi/en/publications/183e40fc-88ff-4d2c-9774-10884fa86b14; PURE LINK: http://www.sciencedirect.com/science/article/pii/S0168900220311116; PURE FILEURL: https://research.aalto.fi/files/51777608/G_dda_AC_coupled_n_in_p_pixel_detectors_on_mcz.pdf; https://aaltodoc.aalto.fi/handle/123456789/47042; URN:NBN:fi:aalto-202010235929

الاتاحة: https://aaltodoc.aalto.fi/handle/123456789/47042
https://doi.org/10.1016/j.nima.2020.164714

المؤلفون: Tuorila, Heidi

المساهمون: Tekniikan ja luonnontieteiden tiedekunta - Faculty of Engineering and Natural Sciences, Tampere University

مصطلحات موضوعية: hybrid integration, III-V semiconductors, flip-chip bonding, micro transfer printing, photonic integrated circuits, silicon photonics, microfabrication, laser diodes, semiconductor optical amplifiers, Tekniikan ja luonnontieteiden tohtoriohjelma - Doctoral Programme in Engineering and Natural Sciences

وصف الملف: fulltext

Relation: Tampere University Dissertations - Tampereen yliopiston väitöskirjat; 1128; https://trepo.tuni.fi/handle/10024/161185

الاتاحة: https://trepo.tuni.fi/handle/10024/161185

المؤلفون: Hinderling, Manuel

المساهمون: Wegscheider, Werner, Nichele, Fabrizio, Scarlino, Pasquale

مصطلحات موضوعية: Microwave spectroscopy, Flip-chip bonding, superconductor-semiconductor hybrid, Josephson junctions, info:eu-repo/classification/ddc/530, Physics

وصف الملف: application/application/pdf

Relation: http://hdl.handle.net/20.500.11850/674782

الاتاحة: https://hdl.handle.net/20.500.11850/674782
https://doi.org/10.3929/ethz-b-000674782

المؤلفون: Chenhui Li, Srivathsa Bhat, Ripalta Stabile, Yuchen Song, Christian Neumeyr, Oded Raz

المساهمون: Photonics and Semiconductor Nanophysics, Electro-Optical Communication, EAISI High Tech Systems

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology, 12(5):9736950, 883-886. IEEE/LEOS
Li, C, Bhat, S, Stabile, R, Song, Y, Neumeyr, C & Raz, O 2022, ' Hybrid Integration of VCSEL and 3-μm Silicon Waveguide Based on a Monolithic Lens System ', IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 12, no. 5, pp. 883-886 . https://doi.org/10.1109/TCPMT.2022.3160149

مصطلحات موضوعية: Waveguide lasers, microlens, VCSEL, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, Optical waveguides, Resists, silicon photonic waveguide, Flip-chip bonding (FCB), Mirrors, flip-chip bonding, Vertical cavity surface emitting lasers, Couplings, vertical-cavity surface-emitting laser (VCSEL), Electrical and Electronic Engineering, Lenses

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0fa43741ee5d1b005a8c252770c917d0
https://doi.org/10.1109/tcpmt.2022.3160149