المؤلفون: Kishor, N. Kundan¹ (AUTHOR) kishor@uwm.edu

المصدر: Business Economics. Oct2024, Vol. 59 Issue 4, p220-226. 7p.

مصطلحات موضوعية: *INFLATION forecasting, *COVID-19 pandemic, *VALUE (Economics), *ECONOMETRICS, FLIP-flops (Sandals)

المؤلفون: Anonymous.

الموضوعات: Drinking glasses 18th century. Czech Republic Bohemia, Drinking glasses 19th century. Czech Republic Bohemia, Decorative arts 18th century. Czech Republic Bohemia, Decorative arts 19th century. Czech Republic Bohemia, Glassware 18th century. Czech Republic Bohemia, Glassware 19th century. Czech Republic Bohemia, Verres à boire 18e siècle. République tchèque Bohême, Verres à boire 19e siècle. République tchèque Bohême, Arts décoratifs 18e siècle. République tchèque Bohême, Arts décoratifs 19e siècle. République tchèque Bohême, Verrerie 18e siècle. République tchèque Bohême, Verrerie 19e siècle. République tchèque Bohême, flip glasses., mold-blown glass., Decorative arts., Drinking glasses., Glassware., Czech Republic Bohemia.

مصطلحات الفهرس: Glass., glassware., flip glasses., drinking glasses., mold-blown glass., Decorative Arts and Utilitarian Objects.

URL: http://www.clarkart.edu/museum_programs/index.cfm?ID=85

المؤلفون: Rajesh Krishna, G.¹ (AUTHOR) krishna.21phd7111@vitap.ac.in, Lorenzo, Rohit¹ (AUTHOR) rohit.lorenzo@vitap.ac.in

المصدر: IETE Journal of Research. Oct2024, Vol. 70 Issue 10, p7889-7898. 10p.

مصطلحات موضوعية: *MONTE Carlo method, *FLIP-flop circuits, *TRANSISTORS, *FLIP-flops (Sandals)

المؤلفون: Schlag, Martine

مصطلحات موضوعية: Digital design, logic gates, combinational logic, sequential logic, boolean algebra, Kmaps, state machines, static timing, flip-flop timing.

وصف الملف: application/pdf

URL الوصول: https://escholarship.org/uc/item/9q1786xf
https://escholarship.org/content/qt9q1786xf/qt9q1786xf.pdf

المؤلفون: Hlevyack, Joseph A, Najafzadeh, Sahand, Li, Yao, Nagashima, Tsubaki, Mine, Akifumi, Zhong, Yigui, Suzuki, Takeshi, Fukushima, Akiko, Lin, Meng-Kai, Babu, Soorya Suresh, Hwang, Jinwoong, Lee, Ji-Eun, Mo, Sung-Kwan, Eckstein, James N, Shin, Shik, Okazaki, Kozo, Chiang, Tai-Chang

المصدر: ACS Nano. 18(45)

مصطلحات موضوعية: Physical Sciences, Condensed Matter Physics, Proximity effects, topological superconductivity, p-doped topological insulators, interbandsuperconducting coherence, flip-chip method, thin-filmheterostructures, interband superconducting coherence, p-doped topological insulators, thin-film heterostructures, Nanoscience & Nanotechnology

وصف الملف: application/pdf

URL الوصول: https://escholarship.org/uc/item/93w6p9vq
https://escholarship.org/content/qt93w6p9vq/qt93w6p9vq.pdf

المؤلفون: Li, Hangxi, 1994

المصدر: Open Superconducting Quantum Computers (OpenSuperQPlus) An Open Superconducting Quantum Computer (OpenSuperQ).

مصطلحات موضوعية: flip-chip integration, design workflow, quantum computing, simulation and design speed-up, superconducting quantum processor, 3D integration

وصف الملف: electronic

URL الوصول: https://research.chalmers.se/publication/544309
https://research.chalmers.se/publication/544309/file/544309_Fulltext.pdf

المؤلفون: Mecellem, Amer¹ (AUTHOR) ameurmecellem@gmail.com, Belhenini, Soufyane¹ (AUTHOR) soufyane.belhenini@univ-temouchent.edu.dz, Khelladi, Douaa¹ (AUTHOR) douaa.khelladi@univ-temouchent.edu.dz, Richard, Caroline² (AUTHOR) caroline.richard@univ-tours.fr

المصدر: Microelectronics International. 2024, Vol. 41 Issue 3, p172-178. 7p.

مصطلحات موضوعية: *FLIP chip technology, *BEND testing, *DEAD loads (Mechanics), *RELIABILITY in engineering, *ACCELERATED life testing, *FINITE element method, *PRINTED circuits

المصدر: Journal of Electronic Testing. Oct2024, Vol. 40 Issue 5, p591-593. 3p.

مصطلحات موضوعية: *FLIP-flops (Sandals), *ELECTRONIC journals, *ENGINEERS, *AWARDS, *PERCENTILES

المؤلفون: Barker, BA, Seshappan, A, Strubbe, DA

المصدر: Electronic Structure. 6(2)

مصطلحات موضوعية: Nuclear and Plasma Physics, Physical Sciences, spin contamination, open shell, excited states, Bethe-Salpeter equation, spin flip, quantum defects

URL الوصول: https://escholarship.org/uc/item/5wb553pd

المؤلفون: Mehdi Niroubakhsh, Alireza Masjedi, Mohammad Heidarnejad, Amin Bordbar

المصدر: Water Science, Vol 38, Iss 1, Pp 65-76 (2024)

مصطلحات موضوعية: riprap, stability number, simple flip bucket, dentated flip bucket, simple triangular, Hydraulic engineering, TC1-978, Environmental technology. Sanitary engineering, TD1-1066

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2357-0008

URL الوصول: https://doaj.org/article/8813059b00f748b9974d5f8f55d6faa5

المؤلفون: VALENTINE, PATRICK pvalentine@uyemura.com

المصدر: Printed Circuit Design & Fab: Circuits Assembly. Nov2024, Vol. 41 Issue 11, p1-9. 9p.

مصطلحات موضوعية: *STATISTICAL process control, FLIP chip technology, PLATINUM group, FOCUSED ion beams, CARTESIAN coordinates, ELECTROLYTIC corrosion

المؤلفون: Belhenini, Soufyane¹ (AUTHOR) soufyane.belhenini@univ-temouchent.edu.dz, El Fatmi, Imad¹ (AUTHOR) imad92dz@outlook.fr, Richard, Caroline² (AUTHOR) caroline.richard@univ-tours.fr, Tougui, Abdellah³ (AUTHOR) abdellah.tougui@univ-tours.fr

المصدر: Soldering & Surface Mount Technology. 2023, Vol. 35 Issue 4, p199-207. 9p.

مصطلحات موضوعية: FLIP chip technology, NONLINEAR mechanics, FRACTURE mechanics, FRACTURE toughness, PRINTED circuits, MECHANICAL models

المؤلفون: Keyan Li¹, Yongle Wu¹ ywu@bupt.edu.cn, Zhiguo Lai², Qinghua Yang³, Weimin Wang³, Yuhao Yang¹

المصدر: International Journal of RF & Microwave Computer-Aided Engineering. 5/25/2024, Vol. 2024, p1-14. 14p.

مصطلحات موضوعية: *FLIP chip technology, *ACOUSTIC resonators, *TRANSMISSION zeros, *PASSIVE components, *BANDPASS filters, *HYBRID computer simulation, *HYBRID integrated circuits

المؤلفون: Dai, Yanyun¹ (AUTHOR), Yang, Yanfei¹ (AUTHOR), Chen, Qi¹ (AUTHOR), Gao, Faqing¹ (AUTHOR), Jiang, Nan¹ (AUTHOR), Qi, Pengjia¹ (AUTHOR), Tong, Jijun¹ (AUTHOR) jijuntong@zstu.edu.cn

المصدر: International Journal of Circuit Theory & Applications. May2024, Vol. 52 Issue 5, p2550-2559. 10p.

مصطلحات موضوعية: *INFORMATION sharing, *FLIP-flops (Sandals), *TRANSISTORS

المؤلفون: Yang, Hui¹ (AUTHOR) 474055963@qq.com, Cheng, Shuai¹ (AUTHOR)

المصدر: AIP Advances. May2024, Vol. 14 Issue 5, p1-9. 9p.

مصطلحات موضوعية: *FATIGUE life, *FLIP chip technology, *SOLDER joints, *THERMAL fatigue, *FAILURE mode & effects analysis, *THERMOCYCLING, *ECCENTRIC loads

المؤلفون: Zhang, Xiangou¹ (AUTHOR) zhangxiangou_mtrc@caep.cn, Wang, Yuexing¹ (AUTHOR) wangyuexing_mtrc@caep.cn, Sun, Xiangyu² (AUTHOR) sunxiangyu_mtrc@caep.cn, Deng, Zejia¹ (AUTHOR) dengzejia_mtrc@caep.cn, Pu, Yingdong¹ (AUTHOR) puyingdong_mtrc@caep.cn, Zhang, Ping³ (AUTHOR) 594709916@qq.com, Huang, Zhiyong⁴ (AUTHOR) huangzy@scu.edu.cn, Zhou, Quanfeng¹ (AUTHOR) zhouquanfeng_mtrc@caep.cn

المصدر: Microelectronics International. 2024, Vol. 41 Issue 2, p82-88. 7p.

مصطلحات موضوعية: *HIGH temperatures, *FLIP chip technology, *SEALING (Technology), *DENTAL adhesives, *SCANNING electron microscopes, *INTERMETALLIC compounds, *ELECTRONIC packaging, *SCREWS

المؤلفون: Premananda, B.S.¹ (AUTHOR) premanandabs@gmail.com, Valivati, Shaswat¹ (AUTHOR) shaswatvalivati@gmail.com, Rehman, Abdur¹ (AUTHOR) ar.sait128@gmail.com

المصدر: IETE Journal of Research. Apr2024, Vol. 70 Issue 4, p4149-4158. 10p.

مصطلحات موضوعية: *PHASE-locked loops, *FLIP-flops (Sandals), *TRANSISTORS, *VOLTAGE, *LOGIC

المؤلفون: Capria, Ennio¹ (AUTHOR), Ciuffini, Andrea¹ (AUTHOR), Drnec, Jakub¹ (AUTHOR), De Nolf, Wout¹ (AUTHOR), Fares-Slim, Mohamed¹ (AUTHOR), Frey, Johannes¹ (AUTHOR), Hinrichsen, Bernd² (AUTHOR), Honkimäki, Veijo¹ (AUTHOR), Levantino, Matteo¹ (AUTHOR), Mathon, Olivier¹ (AUTHOR), Mitchell, Edward¹ (AUTHOR) mitchell@esrf.eu, Munoz, Manuel³ (AUTHOR), Papazoglou, Athanasios¹ (AUTHOR), Terban, Maxwell W.² (AUTHOR), Watier, Yves¹ (AUTHOR)

المصدر: Synchrotron Radiation News. Mar/Apr2024, Vol. 37 Issue 2, p10-15. 6p.

مصطلحات موضوعية: *FLIP chip technology, *MATERIALS science, *SYNCHROTRON radiation, *SINGLE event effects, *NEUTRON diffraction

المؤلفون: Van Til, John A.¹

المصدر: Pro Rege. Mar2024, Vol. 52 Issue 3, p37-46. 9p.

مصطلحات موضوعية: *HUMAN behavior, *JEWS, *DENIAL (Psychology), BIBLICAL commentaries

People: WILSON, Flip

المؤلفون: Wu, Erjun¹ (AUTHOR), Wang, Bo^1,2 (AUTHOR), Zhang, Shuai¹ (AUTHOR), Su, Yu¹ (AUTHOR), Chen, Xiaodong^1,2 (AUTHOR) xiaodong.chen@bit.edu.cn

المصدر: Physics of Fluids. Mar2024, Vol. 36 Issue 3, p1-15. 15p.

مصطلحات موضوعية: *FLIP chip technology, *CONTACT angle, *VISCOSITY, *ELECTRONIC packaging, *PACKAGING, *COMPUTER simulation