المؤلفون: Tsuyoshi TANIGAKI, Yuki KAWAMURA, 河村 祐貴, 谷垣 剛司

المصدر: スマートプロセス学会誌 / Journal of Smart Processing. 2022, 11(5):246

المؤلفون: Jia-Juen Ong, Dinh-Phuc Tran, Shih-Chi Yang, Kai-Cheng Shie, Chih Chen

المصدر: Metals; Volume 11; Issue 11; Pages: 1864

مصطلحات موضوعية: highly <111>-oriented nanotwinned copper, die-to-die bonding, die-to-wafer bonding, post-annealing, grain growth, die shear test

وصف الملف: application/pdf

Relation: https://dx.doi.org/10.3390/met11111864

الاتاحة: https://doi.org/10.3390/met11111864

المؤلفون: Keisuke Wakamoto, Ken Nakahara, Takahiro Namazu, Takukazu Otsuka, 中原 健, 大塚 拓一, 生津 資大, 若本 恵佑

المصدر: The Proceedings of Mechanical Engineering Congress, Japan. 2022, :J223-16

المؤلفون: Kohei Tatsumi, Md. Mijanur Rahman, Norihiro Murakawa, Tatsumasa Wakata, Tomonori Iizuka, Yasunori Tanaka

المصدر: Transactions of The Japan Institute of Electronics Packaging. 2022, 15:E21-1

المؤلفون: Isao ICHIKAWA, 市川 功

المصدر: スマートプロセス学会誌 / Journal of Smart Processing. 2021, 10(6):344

المؤلفون: Na Wu, Yongfang Hu, Shufeng Sun

المصدر: Materials; Volume 13; Issue 6; Pages: 1266

مصطلحات موضوعية: Au-Sn, die bonding, metallization system, microstructure, interfacial reaction

وصف الملف: application/pdf

Relation: https://dx.doi.org/10.3390/ma13061266

الاتاحة: https://doi.org/10.3390/ma13061266

المؤلفون: Hirofumi ITO, Kozo FUJIMOTO, Shinji FUKUMOTO, 伊藤 宏文, 福本 信次, 藤本 公三

المصدر: スマートプロセス学会誌 / Journal of Smart Processing. 2021, 10(1):39

المؤلفون: Müller, Jonas, Letz, Sebastian A., Flaviu-Bogdan, Simon, Bayer, Christoph F., Schletz, Andreas, Görlich, Jens, Nishimura, Takatoshi

المساهمون: Publica

المصدر: Journal of Microelectronics and Electronic Packaging. 19:18-24

مصطلحات موضوعية: FEM, power electronics packaging, silver sintering, Computer Networks and Communications, printed circuit board, Electrical and Electronic Engineering, die bonding, GaN package, HEMT, nanoscale sintering paste, Numerical analysis, Electronic, Optical and Magnetic Materials

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d3b2024990c780171f4ee808f45c1a54
https://doi.org/10.4071/imaps.1675410

المؤلفون: Bao Ngoc An, Benjamin Leyrer, Dai Ishikawa, Helge Wurst, Hideo Nakako, Marc Weber, Matthias Mail, Suguru Ueda, Thomas Blank, Yuki Kawana

المصدر: Transactions of The Japan Institute of Electronics Packaging. 2020, 13:E19-1

المؤلفون: Kodama Kenta, Maekawa Kana, Namazu Takahiro, 児玉 健太, 前川 夏菜, 生津 資大

المصدر: The Proceedings of the Symposium on Micro-Nano Science and Technology. 2020, :28-3

المؤلفون: Bao Ngoc An, Benjamin Leyrer, Dai Ishikawa, Helge Wurst, Hideo Nakako, Marc Weber, Matthias Mail, Thomas Blank

المصدر: Transactions of The Japan Institute of Electronics Packaging. 2020, 13:E20-1

المؤلفون: Jürgen Burggraf, Thomas Uhrmann, Mariana Pires

المصدر: ECS Transactions. 98:173-180

مصطلحات موضوعية: Die bonding, Computer science, Nanotechnology

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::87a92aeb7a8cbb10f21f294f5c7c1e69
https://doi.org/10.1149/09804.0173ecst

المؤلفون: Taiki Baba, Hiroyuki Murata, Yuta Tsuji, Noriyuki Masago, Naoaki Tsurumi, Kazunari Yoshizawa

المصدر: The Journal of Adhesion. 98:24-48

مصطلحات موضوعية: Die bonding, Ideal (set theory), Materials science, Surfaces and Interfaces, General Chemistry, Adhesion, Surfaces, Coatings and Films, Silver paste, Mechanics of Materials, Materials Chemistry, Adhesive, Gold surface, Composite material, Electrical conductor

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::27721e19f7c3c71ace74455119cddd80
https://doi.org/10.1080/00218464.2020.1807958

المؤلفون: Myeong In Kim, Jong-Hyun Lee, Sung Yoon Kim

المصدر: Journal of Materials Science: Materials in Electronics. 31:16720-16727

مصطلحات موضوعية: 010302 applied physics, Cu nanoparticles, Full density, Die bonding, Materials science, Condensed Matter Physics, Microstructure, 01 natural sciences, Atomic and Molecular Physics, and Optics, Electronic, Optical and Magnetic Materials, Micrometre, 0103 physical sciences, Shear strength, Electrical and Electronic Engineering, Composite material

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::623735372f40e1e1cd053dfc8fce5cc9
https://doi.org/10.1007/s10854-020-04227-4

المؤلفون: Jia-Juen Ong, Dinh-Phuc Tran, Shih-Chi Yang, Kai-Cheng Shie, Chih Chen

المصدر: Metals, Vol 11, Iss 1864, p 1864 (2021)

مصطلحات موضوعية: Mining engineering. Metallurgy, highly <111>-oriented nanotwinned copper, die shear test, TN1-997, grain growth, die-to-die bonding, die-to-wafer bonding, post-annealing

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doajarticles::1141ae5ce58ebb11cb6b2996ed07d891
https://www.mdpi.com/2075-4701/11/11/1864

المؤلفون: Jim Clatterbaugh, Tadeh Avanessian, Leyla Hashemi, Robin L. Zinsmaster

المصدر: ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

مصطلحات موضوعية: Die bonding, Materials science, visual_art, visual_art.visual_art_medium, Epoxy, Composite material, Die (integrated circuit), Flip chip

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f7841d7722cf699b6acfa7fadeb96f74
https://doi.org/10.1115/ipack2021-69495

المؤلفون: Xie, X.M., Wang, T.B., Shi, J.Z., Ye, R.Q., Stubhan, F., Freytag, J.

المصدر: Soldering & Surface Mount Technology, 2000, Vol. 12, Issue 1, pp. 40-44.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/09540910010312456

المؤلفون: Marc Weber, Bao Ngoc An, Hideo Nakako, Matthias Mail, Helge Wurst, Benjamin Leyrer, Dai Ishikawa, Thomas Blank

المصدر: Transactions of The Japan Institute of Electronics Packaging. 13:E20-003

مصطلحات موضوعية: Molecular dynamics, Die bonding, Materials science, chemistry, chemistry.chemical_element, Composite material, Copper

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e9bf5d0e7257d74459cc09d8b8eb629c
https://doi.org/10.5104/jiepeng.13.e20-003-1

المؤلفون: Wang, Y., Overmeyer, Ludger

المصدر: Procedia Technology 15

مصطلحات موضوعية: Flip-chip, die bonding, UV-curing adhesives, optoelectronic, component integration, low-temperature, ddc:600, Konferenzschrift

Relation: http://dx.doi.org/10.15488/3225; http://www.repo.uni-hannover.de/handle/123456789/3255

الاتاحة: http://www.repo.uni-hannover.de/handle/123456789/3255
https://doi.org/10.15488/3225

المؤلفون: Kai Hollstein, Kirsten Weide-Zaage

المصدر: 2020 International Wafer Level Packaging Conference (IWLPC).

مصطلحات موضوعية: Die bonding, Materials science, Wafer-scale integration, Silicon, chemistry, chemistry.chemical_element, Wafer, Adhesive, Adhesion, Composite material, Layer (electronics), Die (integrated circuit)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8ac1e6e9a0bd25aeac48524fc5728f2d
https://doi.org/10.23919/iwlpc52010.2020.9375868