المؤلفون: Herrmann, A., van Soestbergen, M., Erich, S.J.F., van der Ven, L.G.J., Huinink, H.P., van Driel, W.D., Mavinkurve, A., De Buyl, F., Adan, O.C.G.

المصدر: Herrmann , A , van Soestbergen , M , Erich , S J F , van der Ven , L G J , Huinink , H P , van Driel , W D , Mavinkurve , A , De Buyl , F & Adan , O C G 2022 , ' Elucidating the large variation in ion diffusivity of microelectronic packaging materials ' , Microelectronics Reliability , vol. 136 , 114656 . https://doi.org/10.1016/j.microrel.2022.114656

مصطلحات موضوعية: Diffusion cell, Ion diffusion, Microelectronic packaging, Mold compound, TOF-SIMS

وصف الملف: application/pdf

الاتاحة: https://research.tue.nl/en/publications/c55dec3a-043c-4798-9698-59f0763b6e7a
https://doi.org/10.1016/j.microrel.2022.114656
https://pure.tue.nl/ws/files/214510843/1_s2.0_S0026271422001809_main.pdf
http://www.scopus.com/inward/record.url?scp=85134893806&partnerID=8YFLogxK

المؤلفون: Herrmann, A., Erich, S.J.F., van der Ven, L.G.J., Huinink, H.P., van Driel, W.D., van Soestbergen, M., Mavinkurve, A., De Buyl, F., Fischer, H.R., Mol, J.M.C., Adan, O.C.G.

المصدر: Herrmann , A , Erich , S J F , van der Ven , L G J , Huinink , H P , van Driel , W D , van Soestbergen , M , Mavinkurve , A , De Buyl , F , Fischer , H R , Mol , J M C & Adan , O C G 2022 , ' Interphase effect on the effective moisture diffusion in epoxy–SiO 2 composites ' , Microelectronics Reliability , vol. 134 , 114550 . https://doi.org/10.1016/j.microrel.2022.114550

مصطلحات موضوعية: EMC, Epoxy, Interphase diffusion, Moisture diffusion

وصف الملف: application/pdf

الاتاحة: https://research.tue.nl/en/publications/6c75a72c-33d8-4712-b8d3-ce3209a8a94b
https://doi.org/10.1016/j.microrel.2022.114550
https://pure.tue.nl/ws/files/205405677/1_s2.0_S0026271422000749_main.pdf
http://www.scopus.com/inward/record.url?scp=85130191370&partnerID=8YFLogxK

المؤلفون: Akhavan-Safar, Alireza, Ashcroft, Ian, Ashforth, Cindy, Bain, Erich, Blackman, Bamber, Bortner, Michael J., Breedlove, Evan L., Budzik, Michal K., Bulters, Markus, Burns, Barry, Carbas, R.J.C., Carolan, Declan, Carpenter, Samuel, Case, Scott W., Chen, Chao, Choffat, Fabien, Condron, David, Cook, Simon, Corsaro, Antonio, Crimmins, Matthew, da Silva, Lucas F.M., Das, Arit, Davis, Chelsea S., de Armentia, Sara Lopez, de Barros, Silvio, de Buyl, F., de Freitas, Sofia Teixeira, Debor, Felix, del Real, Juan Carlos, Di Fratta, Claudio, Dillard, David A., Dillingham, Giles, Feng, Shaoguang, Forster, Aaron M., Fortman, David, Tenreiro, A. Francisco G., Gohl, Jared A., Handwerker, Hermann, Haque, Nazmul, Harkness, B., Hayez, V., He, Sammy, Hedegaard, Aaron, Hill, John, Huang, Jian-ping (JP), Ilcewicz, Larry, Ivankovic, Alojz, Jackson, Christopher M., Jensen, Robert, Kalantar, Tom

المصدر: Advances in Structural Adhesive Bonding ; page xvii-xxii ; ISBN 9780323912143

الاتاحة: http://dx.doi.org/10.1016/b978-0-323-91214-3.09993-2
https://api.elsevier.com/content/article/PII:B9780323912143099932?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:B9780323912143099932?httpAccept=text/plain

المؤلفون: Herrmann, A., Erich, S. J.F., van der Ven, L. G.J., Huinink, H. P., van Driel, W. D., van Soestbergen, M., Mavinkurve, A., De Buyl, F., Mol, J. M.C., Adan, O. C.G.

المصدر: Herrmann , A , Erich , S J F , van der Ven , L G J , Huinink , H P , van Driel , W D , van Soestbergen , M , Mavinkurve , A , De Buyl , F , Mol , J M C & Adan , O C G 2020 , ' The influence of phosphor particles on the water transport in optical silicones for LEDs ' , Optical Materials: X , vol. 6 , 100047 . https://doi.org/10.1016/j.omx.2020.100047

مصطلحات موضوعية: Diffusion, Dynamic vapour sorption (DVS), LED, Moisture transport, Phosphor particles, Silicone

Relation: https://research.tue.nl/en/publications/1067f2b0-d714-4d55-a66b-ae14a29b6ec7

الاتاحة: https://research.tue.nl/en/publications/1067f2b0-d714-4d55-a66b-ae14a29b6ec7
https://doi.org/10.1016/j.omx.2020.100047
http://www.scopus.com/inward/record.url?scp=85081015019&partnerID=8YFLogxK

المؤلفون: Herrmann, A., Erich, S. J.F., van der Ven, L. G.J., Huinink, H. P., van Driel, W.D., van Soestbergen, M., Mavinkurve, A., De Buyl, F., Fischer, H. R., Mol, J.M.C., Adan, O. C.G.

المساهمون: Transport in Permeable Media, EIRES Systems for Sustainable Heat, Physical Chemistry, Thermo-Chemical Materials Lab

المصدر: Microelectronics Reliability, 134:114550. Elsevier
Microelectronics Reliability, 134

مصطلحات موضوعية: Epoxy, EMC, Interphase diffusion, Moisture diffusion, Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::604182d9a1a268ff6d37033bd9a8a286
https://research.tue.nl/en/publications/6c75a72c-33d8-4712-b8d3-ce3209a8a94b

المؤلفون: Herrmann, A. (author), Erich, S. J.F. (author), van der Ven, L. G.J. (author), Huinink, H. P. (author), van Driel, W.D. (author), van Soestbergen, M. (author), Mavinkurve, A. (author), De Buyl, F. (author), Fischer, H. R. (author), Mol, J.M.C. (author), Adan, O. C.G. (author)

مصطلحات الفهرس: EMC, Epoxy, Interphase diffusion, Moisture diffusion, journal article

URL: http://resolver.tudelft.nl/uuid:aa1d0f21-8b01-41be-a5bb-dd312d60e10e
http://www.scopus.com/inward/record.url?scp=85130191370&partnerID=8YFLogxK
http://www.scopus.com/inward/record.url?scp=85130191370&partnerID=8YFLogxK
Microelectronics Reliability--0026-2714--cbe01e13-16db-48e4-bcc8-01ba8275c723

المؤلفون: Herrmann, A. (author), van Soestbergen, M. (author), Erich, S. J.F. (author), van der Ven, L. G.J. (author), Huinink, H. P. (author), van Driel, W.D. (author), Mavinkurve, A. (author), De Buyl, F. (author), Adan, O. C.G. (author)

مصطلحات الفهرس: Diffusion cell, Ion diffusion, Microelectronic packaging, Mold compound, TOF-SIMS, journal article

URL: http://resolver.tudelft.nl/uuid:2efc8aea-bfc6-4539-812a-d7bddbdeb5d8
http://www.scopus.com/inward/record.url?scp=85134893806&partnerID=8YFLogxK
http://www.scopus.com/inward/record.url?scp=85134893806&partnerID=8YFLogxK
Microelectronics Reliability--0026-2714--cbe01e13-16db-48e4-bcc8-01ba8275c723

المؤلفون: Munirathinam, B., van Dam, J.P.B., Herrmann, A., van Driel, W.D., De Buyl, F., Erich, S.J.F., van der Ven, L.G.J., Adan, O.C.G., Mol, J.M.C.

المصدر: Munirathinam , B , van Dam , J P B , Herrmann , A , van Driel , W D , De Buyl , F , Erich , S J F , van der Ven , L G J , Adan , O C G & Mol , J M C 2021 , ' Exploring water and ion transport process at silicone/copper interfaces using in-situ electrochemical and Kelvin probe approaches ' , Journal of Materials Science and Technology , vol. 64 , pp. 203-213 . https://doi.org/10.1016/j.jmst.2019.07.044

مصطلحات موضوعية: Delamination, Impedance, Scanning Kelvin probe, Silicone, Water transport

الاتاحة: https://research.tue.nl/en/publications/e537f471-e67a-438a-9790-85567273100d
https://doi.org/10.1016/j.jmst.2019.07.044
http://www.scopus.com/inward/record.url?scp=85076966000&partnerID=8YFLogxK

المؤلفون: Munirathinam, B. (author), van Dam, J.P.B. (author), Herrmann, Annemarie (author), van Driel, W.D. (author), De Buyl, F. (author), Erich, S. J.F. (author), van der Ven, L.G.J. (author), Adan, O. C.G. (author), Mol, J.M.C. (author)

مصطلحات الفهرس: Silicone, Impedance, Water transport, Scanning Kelvin probe, Delamination, journal article

URL: http://resolver.tudelft.nl/uuid:a1341e9a-44d1-4ede-8aae-c2c031a73f9e
http://www.scopus.com/inward/record.url?scp=85076966000&partnerID=8YFLogxK
http://www.scopus.com/inward/record.url?scp=85076966000&partnerID=8YFLogxK
Journal of Materials Science & Technology: an international journal in the field of materials science--1005-0302--0a8653cc-b9c3-4ec8-af6e-c8d624084abc

المؤلفون: Herrmann, A., Erich, S.J.F., van den Ven, L.G.J., van Driel, W.D., van Soestbergen, M., Mavinkurve, A., De Buyl, F., Adan, O.C.G.

المصدر: Herrmann , A , Erich , S J F , van den Ven , L G J , van Driel , W D , van Soestbergen , M , Mavinkurve , A , De Buyl , F & Adan , O C G 2017 , Understanding the transport phenomena leading to tarnishing of the reflecting silver layer causing reduced light output of LEDs . in 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017, 3-5 April 2017, Dresden, Germany . , 7926238 , Institute of Electrical and Electronics Engineers , ....

Relation: https://research.tue.nl/en/publications/0d06ff32-9be8-4bad-9317-7c964627b57f; urn:ISBN:978-1-5090-4345-3

الاتاحة: https://research.tue.nl/en/publications/0d06ff32-9be8-4bad-9317-7c964627b57f
https://doi.org/10.1109/EuroSimE.2017.7926238
http://www.scopus.com/inward/record.url?scp=85020224247&partnerID=8YFLogxK

المؤلفون: Comyn, J., de Buyl, F., Comyn, T.P.

المصدر: International Journal of Adhesion and Adhesives ; volume 23, issue 6, page 495-497 ; ISSN 0143-7496

الاتاحة: http://dx.doi.org/10.1016/s0143-7496(03)00091-5
https://api.elsevier.com/content/article/PII:S0143749603000915?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0143749603000915?httpAccept=text/plain

المؤلفون: Comyn, J, de Buyl, F, Shephard, N.E, Subramaniam, C

المصدر: International Journal of Adhesion and Adhesives ; volume 22, issue 5, page 385-393 ; ISSN 0143-7496

الاتاحة: http://dx.doi.org/10.1016/s0143-7496(02)00019-2
https://api.elsevier.com/content/article/PII:S0143749602000192?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0143749602000192?httpAccept=text/plain

المؤلفون: Comyn, J, De Buyl, F, Subramanian, C

المصدر: International Journal of Adhesion and Adhesives ; volume 22, issue 4, page 331-336 ; ISSN 0143-7496

الاتاحة: http://dx.doi.org/10.1016/s0143-7496(02)00012-x
https://api.elsevier.com/content/article/PII:S014374960200012X?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S014374960200012X?httpAccept=text/plain

المؤلفون: Comyn, J., de Buyl, F.

المصدر: European Polymer Journal ; volume 37, issue 12, page 2385-2391 ; ISSN 0014-3057

الاتاحة: http://dx.doi.org/10.1016/s0014-3057(01)00156-2
https://api.elsevier.com/content/article/PII:S0014305701001562?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0014305701001562?httpAccept=text/plain

المؤلفون: Mehr, M. Yazdan, Hajipour, P., Karampoor, M.R., van Zeijl, H., van Driel, W.D., Cooremans, T., De Buyl, F., Zhang, G.Q.

المساهمون: Nederlandse Organisatie voor Wetenschappelijk Onderzoek, Technische Universiteit Delft, Institutes Organisation of NWO

المصدر: Microelectronics Reliability ; volume 164, page 115554 ; ISSN 0026-2714

الاتاحة: https://doi.org/10.1016/j.microrel.2024.115554
https://api.elsevier.com/content/article/PII:S0026271424002348?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0026271424002348?httpAccept=text/plain

المؤلفون: de Buyl, F., Kirsch-De Mesmaeker, Andrée, Kelly, John M, Tossi, Alessandro

المصدر: Journal of photochemistry and photobiology. A, Chemistry, 60 (1

مصطلحات موضوعية: Chimie, Chimie inorganique, Chimie organique, Chimie de coordination, Photochimie

وصف الملف: No full-text files

Relation: uri/info:scp/0002259686; http://hdl.handle.net/2013/ULB-DIPOT:oai:dipot.ulb.ac.be:2013/77068

الاتاحة: http://hdl.handle.net/2013/ULB-DIPOT:oai:dipot.ulb.ac.be:2013/77068