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1Academic Journal
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2Academic Journal
المؤلفون: Jiyoung Son, Edgar C. Buck, Shawn L. Riechers, Xiao-Ying Yu
المصدر: Micromachines; Volume 12; Issue 1; Pages: 60
مصطلحات موضوعية: nanoparticle, working electrode, microfluidic electrochemical cell, epoxy stamping, conductive epoxy, CeO 2, graphite
وصف الملف: application/pdf
Relation: A:Physics; https://dx.doi.org/10.3390/mi12010060
الاتاحة: https://doi.org/10.3390/mi12010060
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3Academic Journal
المؤلفون: Alexa Rizzo, Claudia Luhrs, Brian Earp, Dragoslav Grbovic
المصدر: Materials; Volume 13; Issue 21; Pages: 4749
مصطلحات موضوعية: metamaterial, carbon nanotube, electromagnetic interference shielding, microwave absorption, conductive epoxy composites
وصف الملف: application/pdf
Relation: Carbon Materials; https://dx.doi.org/10.3390/ma13214749
الاتاحة: https://doi.org/10.3390/ma13214749
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4Academic Journal
المؤلفون: Clayton Neff, Edwin Elston, Amanda Schrand
المصدر: Designs; Volume 4; Issue 2; Pages: 14
مصطلحات موضوعية: conductive epoxy, conductive ink, harsh environments, high acceleration testing, interconnections, low temperature solder, printed electronics, wire bond pull testing
وصف الملف: application/pdf
Relation: Electrical Engineering Design; https://dx.doi.org/10.3390/designs4020014
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5Academic Journal
المؤلفون: Tao Zhang, Jun Ou-Yang, Xiaofei Yang, Benpeng Zhu
المصدر: Materials; Volume 11; Issue 9; Pages: 1621
مصطلحات موضوعية: PMN-PT, piezoelectric thick film, transfer, conductive epoxy
وصف الملف: application/pdf
Relation: Thin Films and Interfaces; https://dx.doi.org/10.3390/ma11091621
الاتاحة: https://doi.org/10.3390/ma11091621
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6Academic Journal
المصدر: High Voltage (2017)
مصطلحات موضوعية: heat conduction, dielectric properties, epoxy insulation, rubber, permittivity, electric breakdown, heat conductive epoxy, enhanced dielectric properties, cured epoxy, carboxyl-terminated polybutadiene, CTPB liquid rubber, thermal conductivity, hexagonal boron nitride, dielectric permittivity, dissipation factor, electrical resistivity, dielectric breakdown strength, mechanical toughness, electrical insulation, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Electricity, QC501-721
وصف الملف: electronic resource
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7Dissertation/ Thesis
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8Academic Journal
المصدر: High Voltage (2016)
مصطلحات موضوعية: thermal conductivity, thermal insulating materials, filled polymers, conducting polymers, dielectric materials, electric properties, failure analysis, composite insulating materials, high thermal conductivity polymer dielectrics, electrical insulation material, thermal insulation, electrical devices, electrical equipment, equipment size reduction, service life extension, inorganic thermally conductive particles, dielectric polymer composites, particle-filled thermal conductive composites, intrinsic thermal conductive polymer, surface treatment, thermal properties, electrical properties, thermally conductive epoxy, polyethylene composites, polyimide composites, tracking failure, thermal accumulation, thermal breakdown phenomenon, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Electricity, QC501-721
وصف الملف: electronic resource
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9
المساهمون: Norann, Randy [Perma Works LLC]
وصف الملف: Medium: ED
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10Book
المؤلفون: Chen, C. M. Hubert, Cook, Walter R., Harrison, Fiona A., Lin, Jiao Y. Y., Mao, Peter H., Schindler, Stephen M.
المساهمون: Franks, Larry A., Burger, Arnold, James, Ralph B., Hink, Paul L.
المصدر: Optical Science and Technology, SPIE's 48th Annual Meeting, San Diego, CA, 3-8 August 2003
مصطلحات موضوعية: CdZnTe radiation detectors, conductive epoxy, flip-chip devices, indium bump-bonding, radiation detector circuits, sample and hold circuits, semiconductor device bonding, X-ray astronomy detectors
Relation: https://doi.org/10.1117/12.506075; eprintid:84207
الاتاحة: https://doi.org/10.1117/12.506075
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11
المؤلفون: Edwin Elston, Clayton Neff, Amanda M. Schrand
المصدر: Designs, Vol 4, Iss 14, p 14 (2020)
Designs; Volume 4; Issue 2; Pages: 14مصطلحات موضوعية: Wire bonding, conductive epoxy, conductive ink, harsh environments, high acceleration testing, interconnections, low temperature solder, printed electronics, wire bond pull testing, Computer science, 02 engineering and technology, 01 natural sciences, lcsh:Technology, Industrial and Manufacturing Engineering, Printed circuit board, Material selection, lcsh:TA174, 0103 physical sciences, Conductive ink, Electronics, Engineering (miscellaneous), 010302 applied physics, Interconnection, business.industry, lcsh:T, Mechanical Engineering, Electrical engineering, 021001 nanoscience & nanotechnology, lcsh:Engineering design, Potting, Printed electronics, 0210 nano-technology, business
وصف الملف: application/pdf
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12Academic Journal
المؤلفون: Erol Sancaktar, Lan Bai
المصدر: Polymers; Volume 3; Issue 1; Pages: 427-466
مصطلحات موضوعية: electrically conductive epoxy, resistivity, conductivity, contact resistance, filler particle, percolation, volume fraction, nickel flakes, nickel powder, nickel filaments, silver particles, copper particles, conductive adhesive, adhesive thickness
وصف الملف: application/pdf
Relation: https://dx.doi.org/10.3390/polym3010427
الاتاحة: https://doi.org/10.3390/polym3010427
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13
المؤلفون: Takanobu Mato, So Noguchi
المصدر: IEEE transactions on applied superconductivity. 31(5):4600705
مصطلحات موضوعية: Materials science, Stability criteria, no-insulation winding technique, magnet stability, 01 natural sciences, Windings, Circuit stability, Thermal conductivity, 0103 physical sciences, Thermal stability, Electrical and Electronic Engineering, Composite material, 010306 general physics, Electrical conductor, Epoxy resins, Coils, Condensed Matter Physics, Conductive-epoxy-resin-coated REBCO coil, quench protection, Electronic, Optical and Magnetic Materials, Magnetic field, Overcurrent, Electromagnetic coil, Equivalent circuit, Joule heating
وصف الملف: application/pdf
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14
المؤلفون: Jun Ou-Yang, Xiaofei Yang, Benpeng Zhu, Tao Zhang
المصدر: Materials, Vol 11, Iss 9, p 1621 (2018)
Materials
Volume 11
Issue 9مصطلحات موضوعية: Fabrication, Materials science, Silicon, Composite number, chemistry.chemical_element, 02 engineering and technology, Substrate (electronics), Dielectric, 01 natural sciences, lcsh:Technology, Article, PMN-PT, 0103 physical sciences, General Materials Science, Composite material, lcsh:Microscopy, lcsh:QC120-168.85, 010302 applied physics, lcsh:QH201-278.5, lcsh:T, Epoxy, 021001 nanoscience & nanotechnology, Piezoelectricity, Ferroelectricity, chemistry, conductive epoxy, lcsh:TA1-2040, visual_art, visual_art.visual_art_medium, lcsh:Descriptive and experimental mechanics, piezoelectric thick film, lcsh:Electrical engineering. Electronics. Nuclear engineering, 0210 nano-technology, lcsh:Engineering (General). Civil engineering (General), transfer, lcsh:TK1-9971
وصف الملف: application/pdf
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15Academic Journal
المؤلفون: Katsuya Kikuchi, Laina Ma, Masahiko Mori, Masahiro Aoyagi, Motohiro Suzuki, Shigenari Ukita, Takeru Amano, Thanh Tung Bui, ブイ タン トゥン, 天野 建, 森 雅彦, 浮田 茂也, 菊地 克弥, 鈴木 基史, 青柳 昌宏, 馬 莱娜
المصدر: Proceedings of JIEP Annual Meeting. 2014, :430
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16Conference
المؤلفون: Menicanin, Aleksandar, Živanov, Ljiljana D, Movrin, D., Blaz, Nelu V.
المصدر: Proceedings of the International Spring Seminar on Electronics Technology
مصطلحات موضوعية: Substrates, Spiral chan, Quality factors, Passive devices, Manufacture, Innovative approaches, Fabrication, Fabricated structures, Conductive epoxy, Additive manufacturing technology, 3D printers
Relation: info:eu-repo/grantAgreement/MESTD/Integrated and Interdisciplinary Research (IIR or III)/45007/RS//; info:eu-repo/grantAgreement/MESTD/Technological Development (TD or TR)/32016/RS//; http://rimsi.imsi.bg.ac.rs/handle/123456789/1072; 2-s2.0-85029906895; 000426973000130
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17Academic Journal
المؤلفون: Amils, R.I., Gallego, J.D., Sebastian, J.L., Munoz, S., Martin, A., Leuther, Arnulf
مصطلحات موضوعية: cryogenic noise measurement, conductive epoxy, non-conductive epoxy, thermal conductivity, cryogenic low noise amplifiers
Time: 536
Relation: Cyrogenics; https://publica.fraunhofer.de/handle/publica/244824
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18
المؤلفون: J.L. Sebastian, Ricardo Amils, S. Munoz, Arnulf Leuther, A. Martín, Juan Daniel Gallego
المساهمون: Publica
مصطلحات موضوعية: Fabrication, Materials science, General Physics and Astronomy, Context (language use), 02 engineering and technology, 01 natural sciences, Noise (electronics), Thermal conductivity, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, General Materials Science, thermal conductivity, cryogenic low noise amplifiers, cryogenic noise measurement, Electrical conductor, 010302 applied physics, business.industry, Astrophysics::Instrumentation and Methods for Astrophysics, 020206 networking & telecommunications, Epoxy, Low-noise amplifier, non-conductive epoxy, conductive epoxy, visual_art, visual_art.visual_art_medium, Optoelectronics, business, Microwave
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19
المؤلفون: E. Messina, Cristina Riccucci, Gabriella Di Carlo, Cirino Vasi, Antonino Foti, Nancy Leone, Barbara Fazio, Onofrio M. Maragò, Antonio Cassata, Cristiano D’Andrea, Gaetano Di Marco, Leonardo Gargano, Pietro Giuseppe Gucciardi, Francesco Di Maggio, Gabriel Maria Ingo, Benedetto Robba
المصدر: ResearcherID
ACS applied materials & interfaces
8 (2016): 23244–23259. doi:10.1021/acsami.6b06145
info:cnr-pdr/source/autori:Messina, Elena; Leone, Nancy; Foti, Antonino; Di Marco, Gaetano; Riccucci, Cristina; Di Carlo, Gabriella; Di Maggio, Francesco; Cassata, Antonio; Gargano, Leonardo; D'Andrea, Cristiano; Fazio, Barbara; Marago, Onofrio Maria; Robba, Benedetto; Vasi, Cirino; Ingo, Gabriel Maria; Gucciardi, Pietro Giuseppe/titolo:Double-Wall Nanotubes and Graphene Nanoplatelets for Hybrid Conductive Adhesives with Enhanced Thermal and Electrical Conductivity/doi:10.1021%2Facsami.6b06145/rivista:ACS applied materials & interfaces (Print)/anno:2016/pagina_da:23244/pagina_a:23259/intervallo_pagine:23244–23259/volume:8مصطلحات موضوعية: liquid-phase exfoliation, Materials science, 02 engineering and technology, Carbon nanotube, 010402 general chemistry, 01 natural sciences, nanotubes, law.invention, Thermal conductivity, law, Microelectronics, thermal conductivity, chip bonding, General Materials Science, Composite material, Electrical conductor, Curing (chemistry), electrical conductivity, Graphene, business.industry, thermal interface materials, graphene, Epoxy, 021001 nanoscience & nanotechnology, 0104 chemical sciences, conductive epoxy, visual_art, visual_art.visual_art_medium, Adhesive, 0210 nano-technology, business
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20Dissertation/ Thesis
المؤلفون: 황근철
المساهمون: 김용권, 전기·컴퓨터공학부
مصطلحات موضوعية: RF MEMS, RF MEMS packaging, 패키징, LTCC, 저온 동시 소결 세라믹 기판, Sandblasting, 샌드블라스팅, Conductive epoxy bonding, 도전성 에폭시 접합, Via post, Packaging loss, 패키징 손실, Monolithic packaging, 일체형 패키징
وصف الملف: iv, 88 장
Relation: http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000058898; http://hdl.handle.net/10371/45549