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1Academic Journal
المؤلفون: Marwan Debees, Furkan Luleci, F. Necati Catbas
المصدر: Advances in Bridge Engineering, Vol 4, Iss 1, Pp 1-34 (2023)
مصطلحات موضوعية: System reliability, Component reliability, Prestressed bridge, Monte-Carlo Simulation, Structural repair, Bridge engineering, TG1-470
وصف الملف: electronic resource
Relation: https://doaj.org/toc/2662-5407
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2Academic Journal
المؤلفون: Tianzuo QU, Qishu FANG, Yanlong QIAO
المصدر: 南方能源建设, Vol 9, Iss 2, Pp 125-130 (2022)
مصطلحات موضوعية: probabilistic safety assessment (psa), component reliability database, classic estimate, bayesian estimate, common cause failure, Energy industries. Energy policy. Fuel trade, HD9502-9502.5
وصف الملف: electronic resource
Relation: https://doaj.org/toc/2095-8676
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3Academic Journal
المؤلفون: Yuttana Dechgummarn, Pradit Fuangfoo, Warayut Kampeerawat
المصدر: IEEE Access, Vol 10, Pp 111923-111935 (2022)
مصطلحات موضوعية: Reliability assessment, nonsequential Monte Carlo simulation, multinomial distribution, multinomial Monte Carlo simulation, component risk priority index, per-time-based component reliability index, Electrical engineering. Electronics. Nuclear engineering, TK1-9971
وصف الملف: electronic resource
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4Academic Journal
المؤلفون: Puneet Goswami, Abdulfattah Noorwali, Arvind Kumar, Mohammad Zubair Khan, Prakash Srivastava, Shivani Batra
المصدر: Electronics; Volume 12; Issue 5; Pages: 1137
مصطلحات موضوعية: component-based systems, software component, Mamdani Fuzzy inference system, Fuzzy C-means clustering, component reliability, Gaussian membership function
وصف الملف: application/pdf
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5Conference
المساهمون: Rasmuson, Dale
المصدر: Conference: Challenges to PSA During the Nuclear Renaissance, PSA2008,Knoxville, TN,09/07/2008,09/11/2008
وصف الملف: Medium: ED
URL الوصول: http://www.osti.gov/scitech/servlets/purl/940063
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6Academic Journal
المؤلفون: Jakob Schober, Constanze Eulenkamp, Karl Nicolaus, Gregor Feiertag
المصدر: IEEE Access, Vol 9, Pp 140581-140589 (2021)
مصطلحات موضوعية: Cu pillars, electronics packaging, component reliability, mobile communication, SAW, Qualcomm TFAP, Electrical engineering. Electronics. Nuclear engineering, TK1-9971
وصف الملف: electronic resource
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7Conference
المساهمون: Cadwallader, L
المصدر: Conference: Eighth International Topical Meeting on Nuclear Applications and Utilization of Accelerators,Pocatello, Idaho,07/29/2007,08/02/2007
وصف الملف: Medium: ED
URL الوصول: http://www.osti.gov/scitech/servlets/purl/923504
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8Academic Journal
المؤلفون: Fuqiu Li, Zhenqing Wang, Xiaopeng Li, Wei Zhang
المصدر: IEEE Access, Vol 8, Pp 193681-193685 (2020)
مصطلحات موضوعية: Reliability synthesis, phased mission systems, hierarchical synthesis, component reliability, Electrical engineering. Electronics. Nuclear engineering, TK1-9971
وصف الملف: electronic resource
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9Report
المساهمون: Holdelin, Juan
وصف الملف: Medium: ED; Size: 7.42 MB
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10Conference
المساهمون: Kelly, D
المصدر: Conference: 2007 ESREL Safety and Reliability Conference,University of Stavanger, Norway,06/25/2007,06/27/2007
وصف الملف: Medium: ED
URL الوصول: http://www.osti.gov/scitech/servlets/purl/911890
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11Academic Journal
المصدر: IEEE Access, Vol 7, Pp 57476-57487 (2019)
مصطلحات موضوعية: Bayesian three-parameter Weibull model, coherent system, component reliability, masked data, metropolis within Gibbs algorithm, Electrical engineering. Electronics. Nuclear engineering, TK1-9971
وصف الملف: electronic resource
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12Academic Journal
المؤلفون: Changhai Li, Yunlong Teng, Zhonglai Wang, Qi Huang
المصدر: IEEE Access, Vol 7, Pp 163877-163886 (2019)
مصطلحات موضوعية: Component reliability analysis, imprecise Bayesian inference, imprecise Gamma-generalized inverse Weibull model, incomplete lifetime data, robotic device, Electrical engineering. Electronics. Nuclear engineering, TK1-9971
وصف الملف: electronic resource
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13Book
المؤلفون: Caterina Casavola, Luciano Lamberti, Vincenzo Moramarco, Giovanni Pappalettera, Carmine Pappalettere
المساهمون: Edward Fisher, Casavola, Caterina, Lamberti, Luciano, Moramarco, Vincenzo, Pappalettera, Giovanni, Pappalettere, Carmine
مصطلحات موضوعية: Electronic component reliability, electronic speckle pattern interferometry, bad thermal contact, deformation field, damage detection
وصف الملف: STAMPA
Relation: info:eu-repo/semantics/altIdentifier/isbn/978-1-78985-847-1; ispartofbook:Application Specific Integrated Circuits : Technologies, Digital Systems and Design Methodologies; firstpage:77; lastpage:89; numberofpages:13; alleditors:Edward Fisher; http://hdl.handle.net/11589/176496
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14Academic Journal
المؤلفون: I. V. Postnikov, V. A. Stennikov
المصدر: Известия высших учебных заведений: Проблемы энергетики, Vol 19, Iss 3-4, Pp 20-30 (2017)
مصطلحات موضوعية: heat supply system, reliability optimization, nodal reliability indices, component reliability, component failure and restoration rates, average reliability parameters, Production of electric energy or power. Powerplants. Central stations, TK1001-1841
وصف الملف: electronic resource
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15Academic Journal
المؤلفون: Fina Andika Frida Astuti, Sugiono Sugiono, Moch Agus Choiron
المصدر: Journal of Engineering and Management in Industrial System, Vol 5, Iss 1, Pp 1-7 (2017)
مصطلحات موضوعية: Exercise Book Machine, Mean Time to Failure (MTTF), Component Reliability, Monte Carlo Simulation, Industrial engineering. Management engineering, T55.4-60.8
وصف الملف: electronic resource
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16Academic Journal
المؤلفون: Sam D. Weller, Philipp R. Thies, Tessa Gordelier, Lars Johanning
المصدر: Journal of Marine Science and Engineering, Vol 3, Iss 4, Pp 1349-1361 (2015)
مصطلحات موضوعية: component reliability testing, “valley of death”, reliability uncertainties, Naval architecture. Shipbuilding. Marine engineering, VM1-989, Oceanography, GC1-1581
وصف الملف: electronic resource
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17Academic Journal
المؤلفون: Postnikov Ivan V.
المصدر: E3S Web of Conferences, Vol 39, p 02002 (2018)
مصطلحات موضوعية: district heating system, reliability optimization, nodal reliability indices, component reliability, failure and restoration rates, Markov random process, Environmental sciences, GE1-350
Relation: https://doi.org/10.1051/e3sconf/201839012002; https://doaj.org/toc/2267-1242; https://doaj.org/article/31b48aa29fb346c39b41e8f155cbab79
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18
المؤلفون: Karl Dr. Nicolaus, Constanze Eulenkamp, Jakob Schober, Gregor Feiertag
المصدر: IEEE Access, Vol 9, Pp 140581-140589 (2021)
مصطلحات موضوعية: Thermal copper pillar bump, Materials science, General Computer Science, business.industry, SAW, Surface acoustic wave, mobile communication, General Engineering, Temperature cycling, Highly accelerated stress test, Cu pillars, Qualcomm TFAP, TK1-9971, Duplexer, Chip-scale package, component reliability, Miniaturization, Optoelectronics, electronics packaging, General Materials Science, Radio frequency, Electrical engineering. Electronics. Nuclear engineering, business
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19Academic Journal
المؤلفون: John D. Sørensen, Erik E. Kostandyan
المصدر: Energies, Vol 4, Iss 12, Pp 2236-2248 (2011)
مصطلحات موضوعية: wind turbines, electrical component reliability, IGBT damage model, SnAg solder damage model, Technology
وصف الملف: electronic resource
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20Academic Journal
المؤلفون: Bergman, Bo, Arjas, Elja, Rausand, Marvin, Natvig, Bent, Doksum, Kjell A., Schweder, Tore
المصدر: Scandinavian Journal of Statistics, 1985 Jan 01. 12(1), 1-41.
URL الوصول: https://www.jstor.org/stable/4615970