المؤلفون: Zi-Qi Zhang, Xiao-Long Huang, Liang Zhou, Yin-Shan Huang, Cheng-Rui Zhang

المصدر: IEEE Journal of Microwaves, Vol 4, Iss 4, Pp 767-776 (2024)

مصطلحات موضوعية: Benzocyclobutene (BCB), self-packaged, transition, MEMS, silicon-based, low loss, Telecommunication, TK5101-6720, Electric apparatus and materials. Electric circuits. Electric networks, TK452-454.4

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/10699397/; https://doaj.org/toc/2692-8388

URL الوصول: https://doaj.org/article/64fde2b2b4b3423da56826b1c880e98c

المؤلفون: Konstantin S. Levchenko, Gregory E. Adamov, Dmitri Yu. Demin, Polina A. Chicheva, Konstantin A. Chudov, Pavel S. Shmelin, Evgeny P. Grebennikov

المصدر: Molbank, Vol 2020, Iss 4, p M1160 (2020)

مصطلحات موضوعية: di(bicyclo[4.2.0]octa-1(6),2,4-trien-3-yl)dimethylsilane, benzocyclobutene (BCB), monomer, polymers, dielectric coating, Inorganic chemistry, QD146-197

وصف الملف: electronic resource

Relation: https://www.mdpi.com/1422-8599/2020/4/M1160; https://doaj.org/toc/1422-8599

URL الوصول: https://doaj.org/article/21e1bc0bee024e2b89742eed9dab2985

المؤلفون: Andric, Stefan, Ohlsson, Lars, Wenrersson, Lars Erik

المصدر: 92nd ARFTG Microwave Measurement Conference, ARFTG 2019,Orlando, United States,-- 2019 92nd ARFTG Microwave Measurement Conference : Next Generation Microwave and Millimeter-Wave Measurement Techniques and Systems, ARFTG 2019 - Next Generation Microwave and Millimeter-Wave Measurement Techniques and Systems, ARFTG 2019.

مصطلحات موضوعية: Back-End-Of-Line (BEOL), Benzocyclobutene (BCB), Microstrip Transmission Line, Nanowire MOSFET, On-wafer Calibration, Thru-Reflect-Line (TRL), Teknik, Elektroteknik och elektronik, Engineering and Technology, Electrical Engineering, Electronic Engineering, Information Engineering

وصف الملف: electronic

URL الوصول: https://lup.lub.lu.se/record/1028e4e1-84b1-4bb1-874b-90122235d8e8
https://portal.research.lu.se/files/64886046/92ARFTG_Stefan_Andric.pdf
http://dx.doi.org/10.1109/ARFTG.2019.8637222

المؤلفون: Eblabla, A, Benakaprasad, B, Li, X, Wallis, DJ, Guiney, I, Elgaid, K

مصطلحات موضوعية: benzocyclobutene (BCB), GaN-based HEMTs, low-resistivity silicon substrates, microstrip lines, millimeter-wave

وصف الملف: application/pdf

Relation: https://www.repository.cam.ac.uk/handle/1810/264418

الاتاحة: https://www.repository.cam.ac.uk/handle/1810/264418
https://doi.org/10.17863/CAM.9904

المؤلفون: Simon Bleiker, Maaike Visser Taklo, Nicolas Lietaer, Andreas Vogl, Thor Bakke, Frank Niklaus

المصدر: Micromachines; Volume 7; Issue 10; Pages: 192

مصطلحات موضوعية: micro electro-mechanical systems (MEMS), imaging sensor, packaging, adhesive wafer bonding, benzocyclobutene (BCB)

وصف الملف: application/pdf

Relation: https://dx.doi.org/10.3390/mi7100192

الاتاحة: https://doi.org/10.3390/mi7100192

المؤلفون: Gregory E. Adamov, P. S. Shmelin, Dmitri Yu. Demin, K. S. Levchenko, Polina A. Chicheva, K. A. Chudov, E. P. Grebennikov

المصدر: Molbank, Vol 2020, Iss M1160, p M1160 (2020)

مصطلحات موضوعية: chemistry.chemical_classification, Dimethylsilane, Bicyclic molecule, benzocyclobutene (BCB), Organic Chemistry, Polymer, Dielectric, monomer, Carbon-13 NMR, Biochemistry, lcsh:QD146-197, di(bicyclo[4.2.0]octa-1(6),2,4-trien-3-yl)dimethylsilane, dielectric coating, chemistry.chemical_compound, Monomer, chemistry, Polymer chemistry, lcsh:Inorganic chemistry, Polymer coating, Physical and Theoretical Chemistry, polymers

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f0ecd57638e94e820a6d6c6e3e3f1bda
https://doi.org/10.3390/m1160

المؤلفون: Lars Ohlsson, Lars-Erik Wenrersson, Stefan Andric

المصدر: 2019 92nd ARFTG Microwave Measurement Conference (ARFTG)

مصطلحات موضوعية: 010302 applied physics, Materials science, business.industry, Back-End-Of-Line (BEOL), 02 engineering and technology, Electrical Engineering, Electronic Engineering, Information Engineering, Thru-Reflect-Line (TRL), 021001 nanoscience & nanotechnology, 01 natural sciences, Line (electrical engineering), Microstrip, Characteristic impedance, Microstrip Transmission Line, Nanowire MOSFET, On-wafer Calibration, Electric power transmission, Benzocyclobutene (BCB), Transmission line, 0103 physical sciences, MOSFET, Calibration, Optoelectronics, Radio frequency, 0210 nano-technology, business

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::389186ebff1ff4f0c7d7e0606a9f4a7c
https://lup.lub.lu.se/record/1028e4e1-84b1-4bb1-874b-90122235d8e8

المؤلفون: Xu Li, Bhavana Benakaprasad, Ivor Guiney, A. Eblabla, Khaled Elgaid, David J. Wallis

المساهمون: Wallis, David [0000-0002-0475-7583], Apollo - University of Cambridge Repository

مصطلحات موضوعية: low-resistivity silicon substrates, Materials science, Silicon, Transmission loss, chemistry.chemical_element, 02 engineering and technology, Substrate (electronics), 01 natural sciences, Microstrip, GaN-based HEMTs, chemistry.chemical_compound, Benzocyclobutene, Electrical resistivity and conductivity, 0103 physical sciences, millimeter-wave, 0202 electrical engineering, electronic engineering, information engineering, microstrip lines, Electrical and Electronic Engineering, 010302 applied physics, business.industry, Electrical engineering, 020206 networking & telecommunications, benzocyclobutene (BCB), Condensed Matter Physics, chemistry, Extremely high frequency, Optoelectronics, Radio frequency, business

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0383d3471e66e52e0def256c88f7bb87
https://eprints.gla.ac.uk/130067/1/130067.pdf

المؤلفون: Andreas Vogl, Nicolas Lietaer, Thor Bakke, Simon J. Bleiker, Maaike M. Visser Taklo, Frank Niklaus

المصدر: Micromachines
Micromachines, Vol 7, Iss 10, p 192 (2016)
Micromachines; Volume 7; Issue 10; Pages: 192

مصطلحات موضوعية: Materials science, Fabrication, Wafer bonding, lcsh:Mechanical engineering and machinery, imaging sensor, packaging, micro electro-mechanical systems (MEMS), adhesive wafer bonding, benzocyclobutene (BCB), Nanotechnology, 02 engineering and technology, 01 natural sciences, Article, 0103 physical sciences, Hardware_INTEGRATEDCIRCUITS, lcsh:TJ1-1570, Wafer, Annan elektroteknik och elektronik, Electrical and Electronic Engineering, Image sensor, Lithography, 010302 applied physics, Microelectromechanical systems, Interconnection, Other Electrical Engineering, Electronic Engineering, Information Engineering, Mechanical Engineering, 021001 nanoscience & nanotechnology, Control and Systems Engineering, Adhesive, 0210 nano-technology

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c08742cbfe2a18ef01389f62c579fc38
http://europepmc.org/articles/PMC6189772

المؤلفون: Merkle, Thomas, Leuther, Arnulf, Koch, S., Kallfass, I., Tessmann, Axel, Wagner, Sandrine, Massler, Hermann, Schlechtweg, M., Ambacher, Oliver

مصطلحات موضوعية: metamorphic high electron mobility transistor (mHEMT), monolithic microwave integrated circuit (MMIC), broadband amplifier, millimeter-wave, thin-film microstrip (TFMS), benzocyclobutene (BCB)

Time: 667

Relation: Compound Semiconductor Integrated Circuit Symposium (CSIC) 2014; IEEE Compound Semiconductor Integrated Circuit Symposium, CSIC 2014; https://publica.fraunhofer.de/handle/publica/385607

الاتاحة: https://publica.fraunhofer.de/handle/publica/385607
https://doi.org/10.1109/CSICS.2014.6978544

المؤلفون: Tessmann, Axel, Leuther, Arnulf, Massler, Hermann, Seelmann-Eggebert, M.

مصطلحات موضوعية: airbridge type transmission line (ABTL), benzocyclobutene (BCB), grounded coplanar waveguide (GCPW), metamorphic high electron mobility transistor (mHEMT), submillimeter-wave amplifier, terahertz monolithic integrated circuit (TMIC), WR-1.5 waveguide band

Time: 667

Relation: Compound Semiconductor Integrated Circuit Symposium (CSICS) 2012; IEEE Compound Semiconductor Integrated Circuit Symposium, CSICS 2012; https://publica.fraunhofer.de/handle/publica/376698

الاتاحة: https://publica.fraunhofer.de/handle/publica/376698
https://doi.org/10.1109/CSICS.2012.6340102

المؤلفون: Onur Fidaner, David A. B. Miller, V.A. Sabnis, Jun-Fei Zheng, James S. Harris, Hilmi Volkan Demir, J. Hanberg

المساهمون: Demir, Hilmi Volkan

المصدر: IEEE Transactions on Semiconductor Manufacturing

مصطلحات موضوعية: Materials science, Passivation, Wafer-scale integration, WSI circuits, Leakage currents, Industrial and Manufacturing Engineering, law.invention, Dielectric materials, law, Chemical-mechanical planarization, Integrated optoelectronics, Optical switches, Wafer, Electrical and Electronic Engineering, Aromatic polymers, Photodiodes, Electric breakdown, Leakage (electronics), Benzocyclobutene (BCB) polymer, Semiconductor device manufacturing, business.industry, Semiconductor device manufacture, Masks, Semiconductor device, Condensed Matter Physics, Electronic, Optical and Magnetic Materials, Photodiode, Etching, Electroabsorption, Planarization, Optoelectronics, Undercut, business

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fab17213f329b14ac99320f23d66d839
https://doi.org/10.1109/tsm.2004.841834

المؤلفون: Lu, Xing, Ma, Jun, Jiang, Huaxing, Liu, Chao, Xu, Peiqiang, Lau, Kei May

مصطلحات موضوعية: AlN/GaN, Benzocyclobutene (BCB) planarization, Gate-last self-aligned, High-temperature, In situ SiNx, MISHEMT, RF, Source/drain (S/D) regrowth

Relation: https://repository.hkust.edu.hk/ir/Record/1783.1-69385; IEEE Transactions on Electron Devices, v. 62, (6), June 2015, article number 7093156, p. 1862-1869; https://doi.org/10.1109/TED.2015.2421031; http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=0018-9383&rft.volume=62&rft.issue=6&rft.date=2015&rft.spage=1862&rft.aulast=Lu&rft.aufirst=Xing&rft.atitle=Fabrication+and+Characterization+of+Gate-Last+Self-Aligned+AlN%2FGaN+MISHEMTs+With+In+Situ+SiNx+Gate+Dielectric&rft.title=IEEE+Transactions+on+Electron+Devices; http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000355405800027; http://www.scopus.com/record/display.url?eid=2-s2.0-85027918539&origin=inward

الاتاحة: https://repository.hkust.edu.hk/ir/Record/1783.1-69385
https://doi.org/10.1109/TED.2015.2421031
http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=0018-9383&rft.volume=62&rft.issue=6&rft.date=2015&rft.spage=1862&rft.aulast=Lu&rft.aufirst=Xing&rft.atitle=Fabrication+and+Characterization+of+Gate-Last+Self-Aligned+AlN%2FGaN+MISHEMTs+With+In+Situ+SiNx+Gate+Dielectric&rft.title=IEEE+Transactions+on+Electron+Devices
http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000355405800027
http://www.scopus.com/record/display.url?eid=2-s2.0-85027918539&origin=inward

المؤلفون: Niklaus, Frank, Enoksson, Peter, Griss, Patrick, Kälvesten, Edvard, Stemme, Göran

المصدر: Journal of microelectromechanical systems. 10(4):525-531

مصطلحات موضوعية: adhesive bonding, benzocyclobutene (BCB), device transfer, film transfer, integration, transfer bonding, technology

وصف الملف: print

URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-21130

المؤلفون: Cao, Lei, Grimault-Jacquin, Anne-Sophie, Zerounian, Nicolas, Aniel, Frédéric

المساهمون: Institut d'électronique fondamentale (IEF), Université Paris-Sud - Paris 11 (UP11)-Centre National de la Recherche Scientifique (CNRS)

المصدر: ISSN: 1350-4495 ; Infrared Physics and Technology ; https://hal.science/hal-04356779 ; Infrared Physics and Technology, 2014, 63, pp.157-164. ⟨10.1016/j.infrared.2013.12.023⟩.

مصطلحات موضوعية: Benzocyclobutene (BCB), Coplanar waveguide (CPW), Terahertz (THz), Dispersion, Losses and VNA characterization, [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics, [SPI.ELEC]Engineering Sciences [physics]/Electromagnetism

Relation: hal-04356779; https://hal.science/hal-04356779

الاتاحة: https://hal.science/hal-04356779
https://doi.org/10.1016/j.infrared.2013.12.023

المؤلفون: Shih, Jian-Yu, Huang, Wen-Chun, Ko, Cheng-Ta, Yang, Zheng, Hu, Sheng-Hsiang, Leu, Jihperng, Chou, Keng C., Chen, Kuan-Neng

المساهمون: 交大名義發表, 材料科學與工程學系, 電子工程學系及電子研究所, National Chiao Tung University, Department of Materials Science and Engineering, Department of Electronics Engineering and Institute of Electronics

مصطلحات موضوعية: Adhesion, benzocyclobutene (BCB), 3-D integration

Relation: http://dx.doi.org/10.1109/TDMR.2014.2343793; http://hdl.handle.net/11536/25196; IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

الاتاحة: http://hdl.handle.net/11536/25196
https://doi.org/10.1109/TDMR.2014.2343793

المؤلفون: Sun, Xin, Zhu, Yun-hui, Liu, Zhen-hua, Cui, Qing-hu, Ma, Sheng-lin, Chen, Jing, Miao, Min, Jin, Yu-feng

المساهمون: Jin, YF (reprint author), Peking Univ, Natl Key Lab Sci & Technol Micro Nano Fabricat, Beijing 100871, Peoples R China., Peking Univ, Natl Key Lab Sci & Technol Micro Nano Fabricat, Beijing 100871, Peoples R China., Xiamen Univ, Dept Mech & Elect Engn, Xiamen 361005, Peoples R China., Beijing Informat Sci & Technol Univ, Informat Microsyst Inst, Beijing 100085, Peoples R China.

المصدر: SCI ; EI

مصطلحات موضوعية: Integrated passive device (IPD), Benzocyclobutene (BCB), Thin flim, 3D Integration, INDUCTORS

Relation: JOURNAL OF ZHEJIANG UNIVERSITY-SCIENCE C-COMPUTERS & ELECTRONICS.2013,14,(4),235-243.; 832513; http://hdl.handle.net/20.500.11897/225236; WOS:000317368700001

الاتاحة: https://hdl.handle.net/20.500.11897/225236
https://doi.org/10.1631/jzus.C12MNT01

المؤلفون: Liao, E.B., Tay, A.A.O., Ang, S.S.T., Feng, H.H., Nagarajan, R., Kripesh, V., Kumar, R., Lo, G.Q.

المساهمون: MECHANICAL ENGINEERING

المصدر: Scopus

مصطلحات موضوعية: Benzocyclobutene (BCB), Compliance, Electrical parasitic, Planar microspring interconnect, S-parameter

Relation: Liao, E.B., Tay, A.A.O., Ang, S.S.T., Feng, H.H., Nagarajan, R., Kripesh, V., Kumar, R., Lo, G.Q. (2009). Planar microspring - A novel compliant chip-to-package interconnect for wafer-level packaging. IEEE Transactions on Advanced Packaging 32 (2) : 379-389. ScholarBank@NUS Repository. https://doi.org/10.1109/TADVP.2008.924247; http://scholarbank.nus.edu.sg/handle/10635/61114; 000266778000015

الاتاحة: http://scholarbank.nus.edu.sg/handle/10635/61114

المؤلفون: Van Laere, Frederik, Roelkens, Guenther, Ayre, Melanie, Schrauwen, Jonathan, Taillaert, Dirk, Van Thourhout, Dries, Krauss, Thomas E., Baets, Roe

المصدر: Van Laere , F , Roelkens , G , Ayre , M , Schrauwen , J , Taillaert , D , Van Thourhout , D , Krauss , T E & Baets , R 2007 , ' Compact and highly efficient grating couplers between optical fiber and nanophotonic waveguides ' , IEEE Journal of Lightwave Technology , vol. 25 , pp. 151-156 . https://doi.org/10.1109/JLT.2006.888164

مصطلحات موضوعية: BenzoCycloButene (BCB) wafer bonding, gold mirror, grating couplers, integrated optics, MEMBRANE

الاتاحة: https://research-portal.st-andrews.ac.uk/en/publications/4d0abafb-6e7e-4cb4-940b-a411a0a12700
https://doi.org/10.1109/JLT.2006.888164
http://www.scopus.com/inward/record.url?scp=34147147948&partnerID=8YFLogxK

المؤلفون: Yin, W.-Y., Dong, X.T., Mao, J., Li, L.-W.

المساهمون: TEMASEK LABORATORIES, ELECTRICAL & COMPUTER ENGINEERING

المصدر: Scopus

مصطلحات موضوعية: Attenuation constant, Average power handling capability (APHC), Benzocyclobutene (BCB), Distributed pa-rameters, Finite-ground thin-film microstrip lines (FG-TFMLs), Thermal conductivity

Relation: Yin, W.-Y., Dong, X.T., Mao, J., Li, L.-W. (2005-10). Average power handling capability of finite-ground thin-film microstrip lines over ultra-wide frequency ranges. IEEE Microwave and Wireless Components Letters 15 (10) : 715-717. ScholarBank@NUS Repository. https://doi.org/10.1109/LMWC.2005.856829; http://scholarbank.nus.edu.sg/handle/10635/55177; 000232236000037

الاتاحة: http://scholarbank.nus.edu.sg/handle/10635/55177