المؤلفون: Wunderle, B., May, D., Cirulis, I., Braun, S., Zschenderlein, U., Heilmann, J., Türk, P., Pantou, R., Schacht, R., Rzepka, R., Ras, M. Abo, Kurth, S., Kuhn, H.

المصدر: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) ; page 1-9

الاتاحة: http://dx.doi.org/10.1109/estc60143.2024.10712030
http://xplorestaging.ieee.org/ielx8/10711924/10711994/10712030.pdf?arnumber=10712030

المؤلفون: Cirulis, I., Zschenderlein, U., Braun, S., Radestock, M., Pantou, R., Vogel, K., Selbmann, F., Kurth, S., Wunderle, B., Kuhn, H.

المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)

الاتاحة: http://dx.doi.org/10.23919/empc55870.2023.10418420
http://xplorestaging.ieee.org/ielx7/10418252/10418244/10418420.pdf?arnumber=10418420

المؤلفون: Zschenderlein, U., Zhang, H., Ecke, Ramona, Jöhrmann, N., Wunderle, Bernhard

Relation: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2021; 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021; https://publica.fraunhofer.de/handle/publica/411675

الاتاحة: https://publica.fraunhofer.de/handle/publica/411675
https://doi.org/10.1109/EuroSimE52062.2021.9410834

المؤلفون: Zschenderlein, U., Klingler, M., Arnold, J., Baum, Mario, Weißbach, M., Schaal, M., Wunderle, Bernhard

Relation: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2019; 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019; https://publica.fraunhofer.de/handle/publica/406018

الاتاحة: https://publica.fraunhofer.de/handle/publica/406018
https://doi.org/10.1109/EuroSimE.2019.8724559

المؤلفون: Wunderle, B., May, D., Zschenderlein, U., Ecke, R., Springborn, M., Johrmann, N., Pareek, K. A., Heilmann, J., Stiebing, M., Arnold, J., Dudek, R., Schulz, S., Wolf, M. J., Rzepka, S.

المصدر: 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ; volume 695, page 1-13

الاتاحة: http://dx.doi.org/10.1109/eurosime.2018.8369901
http://xplorestaging.ieee.org/ielx7/8362775/8369858/08369901.pdf?arnumber=8369901

المؤلفون: Kumar, A., Zschenderlein, U., Baum, Mario, Brunschwiler, T., Wright, D.N., Wunderle, Bernhard

Relation: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) 2018; 24th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2018; https://publica.fraunhofer.de/handle/publica/407372

الاتاحة: https://publica.fraunhofer.de/handle/publica/407372
https://doi.org/10.1109/THERMINIC.2018.8593327

المؤلفون: Stiebing, M., Vogel, D., Steller, W., Wolf, M.J., Zschenderlein, U., Wunderle, B.

Time: 621

Relation: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2017; 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017; https://publica.fraunhofer.de/handle/publica/397547

الاتاحة: https://publica.fraunhofer.de/handle/publica/397547
https://doi.org/10.1109/EuroSimE.2017.7926250

المؤلفون: Zschenderlein, U., Baum, Mario, Schlottig, G., Schindler-Saefkow, Florian, Kumar, S.G., Wang, W.-S., Brunschwiler, T., Wunderle, Bernhard

Relation: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2016; 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016; https://publica.fraunhofer.de/handle/publica/394316

الاتاحة: https://publica.fraunhofer.de/handle/publica/394316
https://doi.org/10.1109/EuroSimE.2016.7463389

المؤلفون: Brunschwiler, T., Zürcher, J., Zimmermann, Sven, Burg, B.R., Schlottig, G., Chen, X., Sinha, T., Baum, Mario, Hofmann, Christian, Pantou, Remi, Achen, A., Zschenderlein, U., Kumar, S., Wunderle, Bernhard, Haupt, M., Schindler-Saefkow, Florian, Strässle, R.

Relation: Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2016; 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016. Proceedings; https://publica.fraunhofer.de/handle/publica/395989

الاتاحة: https://publica.fraunhofer.de/handle/publica/395989
https://doi.org/10.1109/ITHERM.2016.7517541

المؤلفون: Heilmann, J., Nikitin, I., Zschenderlein, U., May, D., Pressel, K., Wunderle, B.

Relation: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2016; 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016; https://publica.fraunhofer.de/handle/publica/394444

الاتاحة: https://publica.fraunhofer.de/handle/publica/394444
https://doi.org/10.1109/EuroSimE.2016.7463347

المؤلفون: Heilmann, Jens, Nikitin, I., Zschenderlein, U., May, D., Pressel, K., Wunderle, Bernhard

Time: 621

Relation: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2016; Microelectronics reliability; NanoTherm; 318117; https://publica.fraunhofer.de/handle/publica/251954

الاتاحة: https://publica.fraunhofer.de/handle/publica/251954
https://doi.org/10.1016/j.microrel.2017.04.016

المؤلفون: Kumar, S. G., Zschenderlein, U., Pantou, R., Brunschwiler, T., Schlottig, G., Schindler-Saefkow, F., Wunderle, B.

المصدر: 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ; page 1-8

الاتاحة: http://dx.doi.org/10.1109/eurosime.2015.7103126
http://xplorestaging.ieee.org/ielx7/7095627/7103074/07103126.pdf?arnumber=7103126

المؤلفون: Zschenderlein, U., Suresh, K., Baum, Mario, Wunderle, Bernhard

Relation: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2015; 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015; https://publica.fraunhofer.de/handle/publica/391731

الاتاحة: https://publica.fraunhofer.de/handle/publica/391731
https://doi.org/10.1109/EuroSimE.2015.7103150

المؤلفون: Vogel, D., Zschenderlein, U., Auerswald, E., Holck, O., Ramm, P., Wunderle, B., Pufall, R.

المصدر: 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ; volume 2, page 1-8

الاتاحة: http://dx.doi.org/10.1109/eurosime.2014.6813868
http://xplorestaging.ieee.org/ielx7/6808929/6813763/06813868.pdf?arnumber=6813868

المؤلفون: Zschenderlein, U., Vogel, D., Auerswald, E., Hölck, O., Rajendran, H., Ramm, P., Pufall, R., Wunderle, B.

Relation: Electronic Components and Technology Conference (ECTC) 2014; IEEE 64th Electronic Components and Technology Conference, ECTC 2014; https://publica.fraunhofer.de/handle/publica/386787

الاتاحة: https://publica.fraunhofer.de/handle/publica/386787
https://doi.org/10.1109/ECTC.2014.6897432

المؤلفون: Zschenderlein, U., Frühauf, J., Straube, H., Gärtner, E., Kämpfe, B., Luczak, F., Zimny, F., Petrick, H., Böhme, H.

Time: 621, 620

Relation: International Congress on Microreliability and Nanoreliability in Key Technology Applications (MNR) 2007; World Congress MicroNanoReliability 2007; MicroNanoReliability 2007, 1st World Congress MicroNanoReliability; https://publica.fraunhofer.de/handle/publica/357237

الاتاحة: https://publica.fraunhofer.de/handle/publica/357237

المؤلفون: Zschenderlein, U., Frühauf, J., Straube, H., Gärtner, E., Kämpfe, B., Luczak, F., Zimny, F., Petrick, H., Böhme, H.

Relation: Chemnitzer Fachtagung Mikromechanik und Mikroelektronik 2007; Mikro-System-Technik Chemnitz '07: Mikromechanik & Mikroelektronik; https://publica.fraunhofer.de/handle/publica/357400

الاتاحة: https://publica.fraunhofer.de/handle/publica/357400

المؤلفون: Zschenderlein, U., Wunderle, B.

المصدر: 2011 12th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems (EuroSimE); 2011, p1/7-7/7-7/7, 1p