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1
المؤلفون: A. Joi, A. Lesniewska, D. Dictus, K. C. Tso, K. Venkatraman, Y. Dordi, K. Croes, Z. Tokei, S. K. Yadav, P. W. Wu
المصدر: Journal of Applied Physics. 132:175704
مصطلحات موضوعية: General Physics and Astronomy
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2
المؤلفون: V. Vega-Gonzalez, J. Bekaert, E. Kesters, Q. T. Le, C. Lorant, O. Varela P., L. Teugels, N. Heylen, Z. El-Mekki, M. van der Veen, T. Webers, C. J. Wilson, H. Vats, L. Rynders, M. Cupak, J. Uk-Lee, Y. Drissi, L. Halipre, A.-L. Charley, P. Verdonck, T. Witters, S. V. Gompel, B. Briggs, Y. Kimura, N. Jourdan, I. Ciofi, A. Gupta, A. Contino, G. Boccardi, S. Lariviere, L. Dupas, B. De-Wachter, E. Vancoille, S. Decoster, F. Lazzarino, M Ercken, P. Debacker, R. Kim, D. Trivkovic, K. Croes, P. Leray, L. Dillemans, Y.-F. Chen, Z. Tokei, J. Versluijs, A. Lesniewska, S. Paolillo, R. Baert, H. Puliyalil
المصدر: 2019 IEEE International Electron Devices Meeting (IEDM).
مصطلحات موضوعية: 010302 applied physics, Chamfer, Materials science, business.industry, 02 engineering and technology, 021001 nanoscience & nanotechnology, 01 natural sciences, Electromigration, Modulation, 0103 physical sciences, Process integration, Optoelectronics, Node (circuits), Static random-access memory, Place and route, 0210 nano-technology, business, Block (data storage)
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المؤلفون: L. Kljucar, J. Mitard, N. Rassoul, H. Dekkers, S. Steudel, J.I.delAgua Borniquel, B.De Wachter, L. Teugels, D. Tsvetanova, K. Devriendt, I. Grisin, G. Boccardi, H. Hody, M. Nag, L.Di Piazza, C.J. Wilson, G.S. Kar, Z. Tokei, J. Ramalingam, Y. Cao, D.L. Diehl
المصدر: Extended Abstracts of the 2019 International Conference on Solid State Devices and Materials.
مصطلحات موضوعية: Scheme (programming language), Materials science, Electronic engineering, computer, computer.programming_language
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المؤلفون: B. Briggs, S. Guissi, C.J. Wilson, J. Ryckaert, S. Paolillo, K. Vandersmissen, J. Versluijs, C. Lorant, N. Heylen, J. Boemmels, Z. Tokei, Y. Sherazi, P. Weckx, L. Kljucar, M.VanDer Veen, G. Boccardi, V. DeHeyn, A. Gupta, J. Ervin, M. Kamon
المصدر: Extended Abstracts of the 2018 International Conference on Solid State Devices and Materials.
مصطلحات موضوعية: Materials science, CMOS, Engineering physics, Scaling
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المؤلفون: Z. Tokei
المصدر: Extended Abstracts of the 2018 International Conference on Solid State Devices and Materials.
مصطلحات موضوعية: Materials science, Engineering physics, Conductor
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المؤلفون: Jan Genoe, P. Raghavan, Z. Tokei, F. Catthoor, Soeren Steudel
Relation: https://zenodo.org/communities/eu; https://doi.org/10.5281/zenodo.3364520; https://doi.org/10.5281/zenodo.3364521; oai:zenodo.org:3364521
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المؤلفون: A Das, T Kokubo, Y Furukawa, H Struyf, I Vos, B Sijmus, F Iacopi, J Van. Aelst, Q.T Le, L Carbonell, S Brongersma, M Maenhoudt, Z Tokei, I Vervoort, E Sleeckx, M Stucchi, M Schaekers, W Boullart, E Rosseel, M Van Hove, S Vanhaelemeersch, A Shiota, K Maex
المصدر: Microelectronic Engineering. 64:25-33
مصطلحات موضوعية: Permittivity, Materials science, business.industry, Copper interconnect, Low-k dielectric, Dielectric, Integrated circuit, Condensed Matter Physics, Capacitance, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, law.invention, Material selection, law, Chemical-mechanical planarization, Optoelectronics, Electrical and Electronic Engineering, business
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9Academic Journal
المؤلفون: A. M. Urbanowicz, A. Humbert, G. Mannaert, Z. Tokei
المساهمون: The Pennsylvania State University CiteSeerX Archives
مصطلحات موضوعية: plasma damage, cleaning plasmas, low-k dielectrics, bias potential Introduction
وصف الملف: application/pdf
Relation: http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.697.961; http://www.scientific.net/SSP.134.317.pdf
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10Academic Journal
المؤلفون: A. M. Urbanowicz, A. Humbert, G. Mannaert, Z. Tokei, Baklanov A
المساهمون: The Pennsylvania State University CiteSeerX Archives
مصطلحات موضوعية: plasma damage, cleaning plasmas, low-k dielectrics, bias potential Introduction
وصف الملف: application/pdf
Relation: http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.429.7312; http://www.scientific.net/SSP.134.317.pdf