المؤلفون: Cheng-Lun Chen, Liang-Yih Hung, Yueh Yang Lee, Yu-Po Wang

المصدر: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5cca70f9585468dd11ae9375714ee85c
https://doi.org/10.1109/impact56280.2022.9966633

المؤلفون: Yueh Yang Lee, Shao Chien Cheng, Chia Wei Lin, Ching Yuan Ho

المصدر: Materials Letters. 275:128103

مصطلحات موضوعية: Materials science, Mechanical Engineering, Intermetallic, 02 engineering and technology, Adhesion, Heat sink, Surface reaction, 010402 general chemistry, 021001 nanoscience & nanotechnology, Condensed Matter Physics, 01 natural sciences, 0104 chemical sciences, Mechanics of Materials, Soldering, General Materials Science, Composite material, 0210 nano-technology, Linear growth, High temperature storage, Eutectic system

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::adda665e0af2cba419ef964eb73c298a
https://doi.org/10.1016/j.matlet.2020.128103

المؤلفون: Yueh-Yang Lee, 李岳陽

Thesis Advisors: Ching-Yuan Ho, 何青原

وصف الملف: 53

الاتاحة: http://ndltd.ncl.edu.tw/handle/23e43w