المؤلفون: Jung-Pin Lai, Ying-Lei Lin, Ho-Chuan Lin, Chih-Yuan Shih, Yu-Po Wang, Ping-Feng Pai

المصدر: Micromachines, Vol 14, Iss 2, p 265 (2023)

مصطلحات موضوعية: integrated circuit, packaging and testing, machine learning, Optuna, Mechanical engineering and machinery, TJ1-1570

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2072-666X/14/2/265; https://doaj.org/toc/2072-666X

URL الوصول: https://doaj.org/article/491cdb1909354190b22af590ad29fee4

المؤلفون: Xiao-Ling Wang, Lei Wang, Chao-Lu Hasi, Yu-Po Wang, Ajab Khan, Bin-Zhi Ren, Zhi-Zhen Liu, Shun-Lin Hou, Li-Hong Yang, Liao-Yun Zhang, Yong-Kang Dong, Jun Xu, Jun Xie, Pei-Fang Wei

المصدر: Chinese Medical Journal, Vol 133, Iss 16, Pp 1986-1988 (2020)

مصطلحات موضوعية: Medicine

وصف الملف: electronic resource

Relation: http://journals.lww.com/10.1097/CM9.0000000000000922; https://doaj.org/toc/0366-6999; https://doaj.org/toc/2542-5641

URL الوصول: https://doaj.org/article/2ae94baaea7f4c38bebb7f41d367711d

المؤلفون: Jung-Pin Lai, Ying-Lei Lin, Ho-Chuan Lin, Chih-Yuan Shih, Yu-Po Wang, Ping-Feng Pai

المصدر: Micromachines, Vol 13, Iss 8, p 1305 (2022)

مصطلحات موضوعية: integrated circuit, packaging and testing, machine learning, LSSVR, Mechanical engineering and machinery, TJ1-1570

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2072-666X/13/8/1305; https://doaj.org/toc/2072-666X

URL الوصول: https://doaj.org/article/c84732707d1543f1a669849474cdc460

المؤلفون: Yu-Po Wang, 王裕博

Thesis Advisors: Cheng-Fu Chou, 周承復

وصف الملف: 58

الاتاحة: http://ndltd.ncl.edu.tw/handle/70566895985986761937

المؤلفون: Yu-Po Wang, 王裕博

Thesis Advisors: 曾淑芬

وصف الملف: 92

الاتاحة: http://ndltd.ncl.edu.tw/handle/56707974312686482968

المؤلفون: Yu-Po Wang, 汪玉柏

Thesis Advisors: 廖慶榮

وصف الملف: 67

الاتاحة: http://ndltd.ncl.edu.tw/handle/79321303256914286053

المؤلفون: Li-Chi Huang, Yan-Ping Zhang, Chih-Ming Chen, Liang-Yih Hung, Yu-Po Wang

المصدر: Journal of Materials Science: Materials in Electronics. 33:13143-13151

مصطلحات موضوعية: Electrical and Electronic Engineering, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Electronic, Optical and Magnetic Materials

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d15fcc0f34c35057c6e1cc00c1d8f39a
https://doi.org/10.1007/s10854-022-08253-2

المؤلفون: Chih-Yuan Shih, Chia Chu Lai, Yu-Po Wang

المصدر: IMAPSource Proceedings. 2022

مصطلحات موضوعية: Automotive Engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e7411722f8b5618847687250d7320380
https://doi.org/10.4071/001c.74737

المؤلفون: Shuai-Lin Liu, Nicholas Kao, Vito Lin, Teny Shih, Yu-Po Wang

المصدر: IMAPSource Proceedings. 2022

مصطلحات موضوعية: Automotive Engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e6bb433525e7f926dbf9849ae0cfdb42
https://doi.org/10.4071/001c.74633

المؤلفون: Yuan-Chang Ni, Wen-Yu Teng, Yu-Cheng Pai, Carl Chen, Yu-Po Wang

المصدر: 2023 International Conference on Electronics Packaging (ICEP).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a89eb35278a53a368a8b4583266a8e91
https://doi.org/10.23919/icep58572.2023.10129669

المؤلفون: Wen-Yu Teng, Jackson Lee, Liang-Yih Hung, Don-Son Jiang, Yu-Po Wang

المصدر: 2023 International Conference on Electronics Packaging (ICEP).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4592feeca0ebb5c35f34fe4aa69ebeed
https://doi.org/10.23919/icep58572.2023.10129672

المؤلفون: Freedman Yen, Vito Lin, Yu-Po Wang

المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ed767145ca9cfc511cc7d77fee278b57
https://doi.org/10.1109/eptc56328.2022.10013154

المؤلفون: Feng Kao, David Wang, Sam Lin, Teny Shih, L.C. Chang, Yu-Po Wang

المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4fd40f6d9118486dd23e254499af679d
https://doi.org/10.1109/eptc56328.2022.10013122

المؤلفون: Ching-Chia Chen, Wen-Yu Teng, Fang Lin Tsai, Jackson Lee, Liang Yih Hung, Don Son Jiang, Yu-Po Wang

المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0e5d86c27b5b0d76196804ff9da5535b
https://doi.org/10.1109/eptc56328.2022.10013253

المؤلفون: Cheng-Lun Chen, Liang-Yih Hung, Yueh Yang Lee, Yu-Po Wang

المصدر: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5cca70f9585468dd11ae9375714ee85c
https://doi.org/10.1109/impact56280.2022.9966633

المؤلفون: Fenny Liu, Sean Huang, Sheng Fong Yu, Chun Yen Li, Liang-Yih Hung, Yu Po Wang

المصدر: ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::32ac18356f4e451e9736594fbe7d7566
https://doi.org/10.1115/ipack2022-97175

المؤلفون: Yu-Cheng Pai, Chan-Yu Yeh, Wen-Yu Teng, Andrew Kang, Yu-Po Wang

المصدر: 2022 International Conference on Electronics Packaging (ICEP).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::934f8ccadc85b2597e40fa8e7ce55eba
https://doi.org/10.23919/icep55381.2022.9795493

المؤلفون: Wen-Yu Teng, Jackson Lee, Hsin-Ming Tseng, Liang Yih Hung, Don Son Jiang, Yu-Po Wang

المصدر: 2022 International Conference on Electronics Packaging (ICEP).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9695d55a3e9992096b7bccda8abdce2d
https://doi.org/10.23919/icep55381.2022.9795431

المؤلفون: Ken Zhang, Vito Lin, David Lai, Yu-Po Wang

المصدر: 2022 International Conference on Electronics Packaging (ICEP).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::bb8836aa2e7f77d8688bee620c9f9689
https://doi.org/10.23919/icep55381.2022.9795386

المؤلفون: Po Yuan James Su, David Ho, Jacy Pu, Yu Po Wang

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7e154d2fa98d22743f9b724f0e02036f
https://doi.org/10.1109/ectc51906.2022.00337