المؤلفون: YU, D.-Q.^1,2, ZHANG, Y.-J.¹ yjzhang@aiofm.ac.cn, HE, Y.¹, YOU, K.¹, ZHANG, W.-C.¹, FAN, B.-Q.¹, XIE, H.¹

المصدر: Lasers in Engineering (Old City Publishing). 2024, Vol. 57 Issue 1-3, p105-129. 25p.

مصطلحات موضوعية: *OPEN spaces, *ATMOSPHERIC ammonia, *OPTICAL remote sensing, *EVALUATION methodology, *ATMOSPHERIC composition, *SEMICONDUCTOR lasers, *REMOTE sensing

مصطلحات جغرافية: HENAN Sheng (China)

الشركة/الكيان: CHINESE Academy of Sciences (Beijing, China)

المؤلفون: Wei, X -B, Su, Z -D, Liu, Y -H, Wang, Y, Huang, J -L, Yu, D -Q, Chen, J -Y

المساهمون: Science and Technology Planning Project of Guangzhou, Lisheng Cardiovascular Health Foundation of Beijing, Medical Science and Technology Research Funding of Guangdong

المصدر: QJM: An International Journal of Medicine ; volume 112, issue 12, page 900-906 ; ISSN 1460-2725 1460-2393

الاتاحة: http://dx.doi.org/10.1093/qjmed/hcz191
http://academic.oup.com/qjmed/advance-article-pdf/doi/10.1093/qjmed/hcz191/29117286/hcz191.pdf
http://academic.oup.com/qjmed/article-pdf/112/12/900/31222077/hcz191.pdf

المؤلفون: Yang, J.-Q, Ran, P, Li, J, Zhong, Q, Smith, Jr., S.C, Wang, Y, Fonarow, G.C, Qiu, J, Morgan, L, Wei, X.-B, Chen, X.-B, Huang, J.-L, Hao, Y.-C, Zhou, Y.-L, Siu, C.-W, Zhao, D, Chen, J.-Y, Yu, D.-Q, The CCC-ACS Investigators

المصدر: Frontiers in Cardiovascular Medicine, 9

مصطلحات موضوعية: cardiogenic shock, heart rate, acute myocardial infarction, risk score, heart failure

Relation: https://doi.org/10.17615/fhwe-n214; https://cdr.lib.unc.edu/downloads/0k225n925?file=thumbnail; https://cdr.lib.unc.edu/downloads/0k225n925

الاتاحة: https://doi.org/10.17615/fhwe-n214
https://cdr.lib.unc.edu/downloads/0k225n925?file=thumbnail
https://cdr.lib.unc.edu/downloads/0k225n925

المؤلفون: Liu, Y., Liu, Y.-h., Chen, J.-y., Tan, N., Li, H.-l., Luo, J.-f., Chen, Z.-j., Yu, D.-q., Li, G., Huang, W.-h., Xie, N.-j., He, P.-c., Yang, J.-q., Duan, C.-y., Chen, S.-q., Chen, P.-y.

المصدر: European Heart Journal Supplements ; volume 17, issue suppl C, page C17-C25 ; ISSN 1520-765X

الاتاحة: https://doi.org/10.1093/eurheartj/suv027
http://academic.oup.com/eurheartjsupp/article-pdf/17/suppl_C/C17/1306415/suv027.pdf

المؤلفون: Yu, D. Q., Oppermann, H., Kleff, J., Hutter, M.

المصدر: Journal of Materials Science: Materials in Electronics ; volume 20, issue 1, page 55-59 ; ISSN 0957-4522 1573-482X

الاتاحة: https://doi.org/10.1007/s10854-008-9606-4
http://link.springer.com/content/pdf/10.1007/s10854-008-9606-4.pdf
http://link.springer.com/article/10.1007/s10854-008-9606-4/fulltext.html
http://link.springer.com/content/pdf/10.1007/s10854-008-9606-4

المؤلفون: Huang, L.-J., Hou, S.-J., Li, J.-B., Yu, D.-Q.

المصدر: Journal of Asian Natural Products Research ; volume 9, issue 3, page 223-231 ; ISSN 1028-6020 1477-2213

الاتاحة: http://dx.doi.org/10.1080/10286020600603841
https://www.tandfonline.com/doi/pdf/10.1080/10286020600603841

المؤلفون: Huang, L.-J., Li, C.-H., Lu, Z.-M., Ma, Z.-B., Yu, D.-Q.

المصدر: Journal of Asian Natural Products Research ; volume 8, issue 6, page 561-566 ; ISSN 1028-6020 1477-2213

الاتاحة: http://dx.doi.org/10.1080/10286020500176229
https://www.tandfonline.com/doi/pdf/10.1080/10286020500176229

المؤلفون: Hou, S.-J., Zou, C.-C., Zhou, L., Lei, P.-S., Yu, D.-Q.

المصدر: Journal of Asian Natural Products Research ; volume 8, issue 8, page 689-696 ; ISSN 1028-6020 1477-2213

الاتاحة: http://dx.doi.org/10.1080/10286020500289170
https://www.tandfonline.com/doi/pdf/10.1080/10286020500289170

المؤلفون: WANG, Y.-H., CAO, Z.-Y., HE, W.-Y., YAN, X.-Z., LIU, X., LIU, H.-Y., LIANG, X.-T., YU, D.-Q.

المصدر: Journal of Asian Natural Products Research ; volume 8, issue 6, page 511-518 ; ISSN 1028-6020 1477-2213

الاتاحة: http://dx.doi.org/10.1080/10286020500176898
https://www.tandfonline.com/doi/pdf/10.1080/10286020500176898

المؤلفون: Wei, X.‐B., Liu, Y.‐H., Huang, J.‐L., Chen, X.‐L., Yu, D.‐Q., Tan, N., Chen, J.‐Y., He, P.‐C.

المساهمون: Science and Technology Projects of Guangdong, Science and Technology Planning Project of Guangzhou City

المصدر: Diabetic Medicine ; volume 35, issue 11, page 1499-1507 ; ISSN 0742-3071 1464-5491

الاتاحة: http://dx.doi.org/10.1111/dme.13761
https://api.wiley.com/onlinelibrary/tdm/v1/articles/10.1111%2Fdme.13761
https://onlinelibrary.wiley.com/doi/pdf/10.1111/dme.13761

المؤلفون: Lau, W. S., Yu, D. Q., Wang, X., Wong, H., Xu, Y.

المصدر: 2016 China Semiconductor Technology International Conference (CSTIC) ; page 1-3

الاتاحة: http://dx.doi.org/10.1109/cstic.2016.7464021
http://xplorestaging.ieee.org/ielx7/7458471/7463893/07464021.pdf?arnumber=7464021

المؤلفون: An, D, Chen, W, Yu, D-Q, Wang, S-W, Yu, W-Z, Xu, H, Wang, D-M, Zhao, D, Sun, Y-P, Wu, J-C, Tang, YY, Yin, S-M

مصطلحات موضوعية: Cellular nervous system, BALB/c mice, behavior, kunming mice, social isolation

Relation: 102.100.100/568726; https://figshare.com/articles/journal_contribution/Effects_of_social_isolation_re-socialization_and_age_on_cognitive_and_aggressive_behaviors_of_Kunming_mice_and_BALB_c_mice/22943855

الاتاحة: https://figshare.com/articles/journal_contribution/Effects_of_social_isolation_re-socialization_and_age_on_cognitive_and_aggressive_behaviors_of_Kunming_mice_and_BALB_c_mice/22943855

المؤلفون: Yan, L.-L., Lee, C.-K., Yu, D.-Q., Yu, A.-B., Choi, W.-K., Lau, J.-H., Yoon, S.-U.

المساهمون: ELECTRICAL & COMPUTER ENGINEERING

المصدر: Scopus

مصطلحات موضوعية: Copper, In/Sn solder, Interfacial reaction, Intermetallic compounds, Low-temperature bonding

Relation: Yan, L.-L., Lee, C.-K., Yu, D.-Q., Yu, A.-B., Choi, W.-K., Lau, J.-H., Yoon, S.-U. (2009-01). A hermetic seal using composite thin-film In/Sn solder as an intermediate layer and its interdiffusion reaction with Cu. Journal of Electronic Materials 38 (1) : 200-207. ScholarBank@NUS Repository. https://doi.org/10.1007/s11664-008-0561-x; http://scholarbank.nus.edu.sg/handle/10635/83352; 000261789900025

الاتاحة: http://scholarbank.nus.edu.sg/handle/10635/83352

المؤلفون: Jin, X.-M., Jia, M.-Y., Xue, P., Cai, J.-Ch., Pan, L., Yu, D.-Q.

المساهمون: National Natural Science Foundation of Xinjiang Uygur Autonomous Region of China

المصدر: Journal of Materials Processing Technology ; volume 214, issue 12, page 2834-2842 ; ISSN 0924-0136

الاتاحة: http://dx.doi.org/10.1016/j.jmatprotec.2014.06.022
https://api.elsevier.com/content/article/PII:S0924013614002453?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0924013614002453?httpAccept=text/plain

المؤلفون: Liu, L. L., Li, M. K., Yu, D. Q., Zhang, J., Zhang, H., Qian, C., Yang, Z.

المصدر: Applied Physics A ; volume 98, issue 4, page 831-835 ; ISSN 0947-8396 1432-0630

الاتاحة: http://dx.doi.org/10.1007/s00339-009-5538-y
http://link.springer.com/content/pdf/10.1007/s00339-009-5538-y.pdf
http://link.springer.com/article/10.1007/s00339-009-5538-y/fulltext.html
http://link.springer.com/content/pdf/10.1007/s00339-009-5538-y

المؤلفون: Yu, D.-Q., Lee, C., Yan, L.L., Choi, W.K., Yu, A., Lau, J.H.

المساهمون: ELECTRICAL & COMPUTER ENGINEERING

المصدر: Scopus

Relation: Yu, D.-Q., Lee, C., Yan, L.L., Choi, W.K., Yu, A., Lau, J.H. (2009). The role of Ni buffer layer on high yield low temperature hermetic wafer bonding using In/Sn/Cu metallization. Applied Physics Letters 94 (3) : -. ScholarBank@NUS Repository. https://doi.org/10.1063/1.3074367; http://scholarbank.nus.edu.sg/handle/10635/57637; 000262724000049

الاتاحة: http://scholarbank.nus.edu.sg/handle/10635/57637

المؤلفون: Yu, D.-Q., Yan, L.L., Lee, C., Choi, W.K., Thew, S., Foo, C.K., Lau, J.H.

المساهمون: ELECTRICAL & COMPUTER ENGINEERING

المصدر: Scopus

مصطلحات موضوعية: Hermeticity, In-Sn, Microelectromechanical systems (MEMS), Reliability, Wafer bonding, Wafer-level packaging

Relation: Yu, D.-Q., Yan, L.L., Lee, C., Choi, W.K., Thew, S., Foo, C.K., Lau, J.H. (2009-12). Wafer-level hermetic bonding using Sn/In and Cu/Ti/Au metallization. IEEE Transactions on Components and Packaging Technologies 32 (4) : 926-934. ScholarBank@NUS Repository. https://doi.org/10.1109/TCAPT.2009.2016108; http://scholarbank.nus.edu.sg/handle/10635/57791; 000272489400027

الاتاحة: http://scholarbank.nus.edu.sg/handle/10635/57791

المؤلفون: Yu, D.-Q., Lee, C., Yan, L.L., Thew, M.L., Lau, J.H.

المساهمون: ELECTRICAL & COMPUTER ENGINEERING

المصدر: Scopus

مصطلحات موضوعية: Hermeticity, In-Sn, Intermetallic compound, Low-temperature bonding, WLP

Relation: Yu, D.-Q., Lee, C., Yan, L.L., Thew, M.L., Lau, J.H. (2009-10-19). Characterization and reliability study of low temperature hermetic wafer level bonding using In/Sn interlayer and Cu/Ni/Au metallization. Journal of Alloys and Compounds 485 (1-2) : 444-450. ScholarBank@NUS Repository. https://doi.org/10.1016/j.jallcom.2009.05.136; http://scholarbank.nus.edu.sg/handle/10635/55269; 000271542900098

الاتاحة: http://scholarbank.nus.edu.sg/handle/10635/55269

المؤلفون: Yu, D. Q., Wu, C. M. L., Wong, Y. W., Lai, J. K. L.

المصدر: Journal of Materials Science: Materials in Electronics ; volume 18, issue 10, page 1057-1063 ; ISSN 0957-4522 1573-482X

الاتاحة: http://dx.doi.org/10.1007/s10854-006-9114-3
http://link.springer.com/content/pdf/10.1007/s10854-006-9114-3.pdf
http://link.springer.com/article/10.1007/s10854-006-9114-3/fulltext.html
http://link.springer.com/content/pdf/10.1007/s10854-006-9114-3

المؤلفون: Yu, D. Q., Jillek, W., Schmitt, E.

المصدر: Journal of Materials Science: Materials in Electronics ; volume 17, issue 3, page 219-227 ; ISSN 0957-4522 1573-482X

الاتاحة: http://dx.doi.org/10.1007/s10854-006-6764-0
http://link.springer.com/content/pdf/10.1007/s10854-006-6764-0.pdf
http://link.springer.com/article/10.1007/s10854-006-6764-0/fulltext.html
http://link.springer.com/content/pdf/10.1007/s10854-006-6764-0