المؤلفون: Samuel Chef, Chee Lip Gan, Y.W. Siah, Jakub Breier, Shivam Bhasin, C.T. Chua, J.Y. Tay

المساهمون: School of Materials Science & Engineering, 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), Temasek Laboratories

مصطلحات موضوعية: 010302 applied physics, Random access memory, Materials [Engineering], business.industry, Computer science, Space electronics, Laser probe, 020208 electrical & electronic engineering, Transistor, 02 engineering and technology, Laser probing, Transistors, 01 natural sciences, Task (project management), law.invention, Random Access Memory, Microcontroller, law, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, Static random-access memory, business, Computer hardware

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f968cc0b788bf5c95d984b518fb39381
https://hdl.handle.net/10356/107598

المؤلفون: Chee Lip Gan, Qing Liu, Y.W. Siah, H. B. Kor

المصدر: International Symposium for Testing and Failure Analysis.

مصطلحات موضوعية: Materials science, business.industry, Optoelectronics, business, Sample (graphics)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::436bff1e445bf2ee5428d7939e9e13de
https://doi.org/10.31399/asm.cp.istfa2015p0087

المؤلفون: Y.W. Siah, H. B. Kor, Chee Lip Gan, Qing Liu

المساهمون: School of Materials Science and Engineering, 2015 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, Temasek Laboratories

المصدر: 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits.

مصطلحات موضوعية: Materials science, Materials [Engineering], Decapsulation, 3D Devices, Process (computing), Electronic engineering, Mechanical engineering, Structural integrity, Image warping, Die (integrated circuit)

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::eac8258115590279dd8c63ef07e9fc96
https://doi.org/10.1109/ipfa.2015.7224433

المؤلفون: Qing Liu, H. B. Kor, Chee Lip Gan, Y.W. Siah

المصدر: International Symposium for Testing and Failure Analysis.

مصطلحات موضوعية: Focus (computing), Materials science, law, Systems engineering, Nanotechnology, Laser, Adaptation (computer science), law.invention

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0e2c8c3dadc3f669ed61876e14c1960d
https://doi.org/10.31399/asm.cp.istfa2014p0094

المؤلفون: Qing Liu, Y.W. Siah, Chee Lip Gan, H. B. Kor, Y. J. Hong

المساهمون: School of Materials Science and Engineering, 2013 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, Temasek Laboratories

المصدر: Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

مصطلحات موضوعية: Alternative methods, Engineering drawing, Materials science, Materials [Engineering], business.industry, Rounding, Polishing, chemistry.chemical_element, Integrated circuit, Edge (geometry), Delayering, Copper, Die (integrated circuit), law.invention, chemistry, law, Hardware_INTEGRATEDCIRCUITS, Optoelectronics, Specimen preparation, business, Sample Preparation

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c253362491876767f2c7c95be997987f
https://doi.org/10.1109/ipfa.2013.6599147