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1
المؤلفون: Y. Raffel, M. Drescher, R. Olivo, M. Lederer, R. Hoffmann, L. Pirro, T. Chohan, T. Kampfe, K. Seidel, S. De, J. Heitmann
المصدر: 2022 IEEE International Integrated Reliability Workshop (IIRW).
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2
المؤلفون: Y. Raffel, R. Olivo, M. Lederer, F. Muller, R. Hoffmann, T. Ali, K. Mertens, L. Pirro, M. Drescher, S. Beyer, T. Kampfe, K. Seidel, L. M. Eng, J. Heitmann
المصدر: 2022 IEEE International Memory Workshop (IMW).
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3Interfacial Layer Engineering to Enhance Endurance and Noise Immunity of FeFETs for IMC Applications
المصدر: International Conference on IC Design and Technology (ICICDT)
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4
المؤلفون: D. Lipp, Y. Raffel, A. Jayakumar, R. Olivo, R. Pfuetzner, R. Illgen, A. Muehlhoff, Jan Hoentschel, L. Pirro, Michael Otto, O. Zimmerhackl, Alban Zaka, Konrad Seidel
المصدر: IRPS
مصطلحات موضوعية: 010302 applied physics, Surface (mathematics), Materials science, Silicon, business.industry, Noise reduction, Transistor, chemistry.chemical_element, 01 natural sciences, Noise (electronics), law.invention, Reliability (semiconductor), chemistry, law, Logic gate, 0103 physical sciences, Optoelectronics, business, Communication channel
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5
المصدر: Silicon Nanoelectronics Workshop (SNW)