المؤلفون: Xiangyu Liu, Yongsheng Sun, Junlin Huang, Xiaolu Shang, Changze Liu

المصدر: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::74b2df33bf2a8749c2b4bc3aa655957b
https://doi.org/10.1109/ipfa55383.2022.9915742