المؤلفون: Woo, Young Han, Seo, Jeongeun, Kwon, Hun Yeong

المصدر: Proceedings of the 25th Annual International Conference on Digital Government Research

الاتاحة: http://dx.doi.org/10.1145/3657054.3657081
https://dl.acm.org/doi/pdf/10.1145/3657054.3657081

المؤلفون: Amy Shay, Mike Marshall, Jonathan Cohen, Keith Best, Gurvinder Singh, Woo Young Han

المصدر: International Symposium on Microelectronics. 2017:000584-000589

مصطلحات موضوعية: Residue (complex analysis), Semiconductor, Materials science, business.industry, Semiconductor device fabrication, Automotive Engineering, Miniaturization, Nanotechnology, Wafer, Photoresist, business, Lithography, Rapid detection

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9b3a7c732c88edab2c4ea784a9384532
https://doi.org/10.4071/isom-2017-tha36_058

المؤلفون: Amy Shay, Woo Young Han, Mike Marshall, Bryan Selby

المصدر: 2019 International Wafer Level Packaging Conference (IWLPC).

مصطلحات موضوعية: business.product_category, Reliability (semiconductor), Semiconductor, Materials science, business.industry, Die (manufacturing), Mechanical engineering, Wafer, Electronics, Image sensor, business, Chip, Wafer-level packaging

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a4e1c3d85fc3322d2c7b8efc82a7929d
https://doi.org/10.23919/iwlpc.2019.8914148

المؤلفون: Thornell John, Singh Gurvinder, Chet Suresh, Woo Young Han

المصدر: International Symposium on Microelectronics. 2016:000540-000544

مصطلحات موضوعية: Thermal copper pillar bump, Materials science, business.industry, Nanotechnology, Root cause, Chip, Fluorescence, Semiconductor industry, Chip-scale package, Automotive Engineering, White light, Optoelectronics, Wafer, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::043911a0961da219332c779b2909e60b
https://doi.org/10.4071/isom-2016-poster8

المؤلفون: Matt Wilson, Woo Young Han, Mike Marshall

المصدر: 2018 International Wafer Level Packaging Conference (IWLPC).

مصطلحات موضوعية: Die shrink, Computer science, Analytics, business.industry, Automotive industry, Process control, Thread (computing), Statistical process control, business, Vertical integration, Metrology, Reliability engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8d16b0807ed5cb5a66ba62c0b65d5535
https://doi.org/10.23919/iwlpc.2018.8573292

المؤلفون: Woo Young Han, Ki-In Na, Jaemin Byun, Byungjae Park

المصدر: SMC

مصطلحات موضوعية: 0209 industrial biotechnology, Occupancy grid mapping, Computer science, 020206 networking & telecommunications, 02 engineering and technology, Computer Science::Robotics, 020901 industrial engineering & automation, Lidar, Control theory, 0202 electrical engineering, electronic engineering, information engineering, Trajectory, Motion planning, Closed loop, Simulation

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::89fec64be7b4171bced2bab89b760dd1
https://doi.org/10.1109/smc.2016.7844532

المؤلفون: Woo-Young Han, Won-Kyoung Min, Sung-Joong Kim, Chung-Jin Kwon

المصدر: SPIE Proceedings.

مصطلحات موضوعية: Electric motor, Engineering, Recurrent neural network, Artificial neural network, Control theory, business.industry, Adaptive estimator, Feed forward, System identification, Control engineering, Synchronous motor, business, Backpropagation

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2a70932ada2d28b17bd061a3c0d1edad
https://doi.org/10.1117/12.664658