المؤلفون: Stocchi M., Cao Z., Joseph C. H., Voss T., Mencarelli D., Pierantoni L., Kaynak C. B., Hebeler J., Zwick T., Wietstruck M., Kaynak M.

المساهمون: Stocchi, M., Cao, Z., Joseph, C. H., Voss, T., Mencarelli, D., Pierantoni, L., Kaynak, C. B., Hebeler, J., Zwick, T., Wietstruck, M., Kaynak, M.

وصف الملف: STAMPA

Relation: info:eu-repo/semantics/altIdentifier/pmid/35273271; info:eu-repo/semantics/altIdentifier/wos/WOS:000838209800003; volume:12; issue:1; numberofpages:9; journal:SCIENTIFIC REPORTS; https://hdl.handle.net/11566/308584; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-85126400485

الاتاحة: https://hdl.handle.net/11566/308584
https://doi.org/10.1038/s41598-022-07902-0

المؤلفون: Prigent, Gaëtan, Franc, Anne-Laure, Wietstruck, M, Kaynak, M.

المساهمون: Équipe Microondes et Opto-microondes pour Systèmes de Télécommunications (LAAS-MOST), Laboratoire d'analyse et d'architecture des systèmes (LAAS), Université Toulouse Capitole (UT Capitole), Université de Toulouse (UT)-Université de Toulouse (UT)-Institut National des Sciences Appliquées - Toulouse (INSA Toulouse), Institut National des Sciences Appliquées (INSA)-Université de Toulouse (UT)-Institut National des Sciences Appliquées (INSA)-Université Toulouse - Jean Jaurès (UT2J), Université de Toulouse (UT)-Université Toulouse III - Paul Sabatier (UT3), Université de Toulouse (UT)-Centre National de la Recherche Scientifique (CNRS)-Institut National Polytechnique (Toulouse) (Toulouse INP), Université de Toulouse (UT)-Université Toulouse Capitole (UT Capitole), Université de Toulouse (UT), Groupe de Recherche en Electromagnétisme (LAPLACE-GRE), LAboratoire PLasma et Conversion d'Energie (LAPLACE), Université Toulouse III - Paul Sabatier (UT3), Université de Toulouse (UT)-Université de Toulouse (UT)-Centre National de la Recherche Scientifique (CNRS)-Institut National Polytechnique (Toulouse) (Toulouse INP), Innovations for High Performance Microelectronics (IHP)

المصدر: Journées Nationales Microondes (JNM 2019) ; https://laas.hal.science/hal-02309789 ; Journées Nationales Microondes (JNM 2019), May 2019, Caen, France

مصطلحات موضوعية: [SPI.ELEC]Engineering Sciences [physics]/Electromagnetism, [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics

جغرافية الموضوع: Caen, France

Relation: hal-02309789; https://laas.hal.science/hal-02309789; https://laas.hal.science/hal-02309789/document; https://laas.hal.science/hal-02309789/file/JNM2019_Filtre_SIW_version_longue.pdf

الاتاحة: https://laas.hal.science/hal-02309789
https://laas.hal.science/hal-02309789/document
https://laas.hal.science/hal-02309789/file/JNM2019_Filtre_SIW_version_longue.pdf

المؤلفون: Wipf, S. Tolunay, Goeritz, A., Wipf, C., Wietstruck, M., Burak, A., Tuerkmen, E., Guerbuez, Y., Kaynak, M.

Relation: https://aperta.ulakbim.gov.tr/record/52151; oai:zenodo.org:52151

الاتاحة: https://aperta.ulakbim.gov.tr/record/52151

المؤلفون: Kaynak, C. Baristiran, Yamamoto, Y., Goeritz, A., Korndoerfer, F., Zaumseil, P., Kulse, P., Schulz, K., Wietstruck, M., Shafique, A., Gurbuz, Y., Kaynak, M.

المصدر: IEEE ELECTRON DEVICE LETTERS 39(5) 753-756

Relation: https://aperta.ulakbim.gov.tr/record/30613; oai:zenodo.org:30613

الاتاحة: https://aperta.ulakbim.gov.tr/record/30613

المؤلفون: Wang X., Xiong K., Li L., Hwang J. C. M., Jin X., Fabi G., Farina M., Hartwig O., Prechtl M., Dusberg G. S., Goritz A., Wietstruck M., Kaynak M.

المساهمون: IEEE, Wang, X., Xiong, K., Li, L., Hwang, J. C. M., Jin, X., Fabi, G., Farina, M., Hartwig, O., Prechtl, M., Dusberg, G. S., Goritz, A., Wietstruck, M., Kaynak, M.

مصطلحات موضوعية: atomic force microscopy, conductivity measurement, microwave imaging, nanomaterial, scanning probe microscopy

Relation: info:eu-repo/semantics/altIdentifier/isbn/978-2-87487-059-0; ispartofbook:2020 50th European Microwave Conference, EuMC 2020; 50th European Microwave Conference, EuMC 2020; firstpage:987; lastpage:990; numberofpages:4; http://hdl.handle.net/11566/288364; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-85100916641

الاتاحة: http://hdl.handle.net/11566/288364
https://doi.org/10.23919/EuMC48046.2021.9338192

المؤلفون: Stocchi, M., Wietstruck, M., Schulze, S., Zhibo, C., Tolunay, S., Kaynak, Mehmet

Relation: Stocchi, M. and Wietstruck, M. and Schulze, S. and Zhibo, C. and Tolunay, S. and Kaynak, Mehmet (2020) Full-wave RF modeling of a fan-out wafer-level packaging technology based on Al-Al wafer bonding. In: IEEE 20th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF), San Antonio, TX, USA

الاتاحة: https://research.sabanciuniv.edu/id/eprint/46509/
https://doi.org/10.1109/SIRF46766.2020.9040180

المؤلفون: Kaynak, C. Baristiran, Goeritz, A., Durmaz, E. C., Wietstruck, M., Onat, Ege, Özcan, Ali Şah, Türkoğlu, Enes Recep, Gürbüz, Yaşar, Kaynak, M.

Relation: Kaynak, C. Baristiran and Goeritz, A. and Durmaz, E. C. and Wietstruck, M. and Onat, Ege and Özcan, Ali Şah and Türkoğlu, Enes Recep and Gürbüz, Yaşar and Kaynak, M. (2020) Thermo-mechanical modeling and experimental validation of an uncooled microbolometer. In: IEEE 20th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF), San Antonio, TX, USA

الاتاحة: https://research.sabanciuniv.edu/id/eprint/46508/
https://doi.org/10.1109/SIRF46766.2020.9040193

المؤلفون: Zoschke, K., MacKowiak, P., Kröhnert, K., Oppermann, H., Jürgensen, N., Wietstruck, M., Göritz, A., Tolunay Wipf, S., Kaynak, M., Lang, K.-D.

Time: 621

Relation: Electronic Components and Technology Conference (ECTC) 2020; IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Proceedings; https://publica.fraunhofer.de/handle/publica/409407

الاتاحة: https://publica.fraunhofer.de/handle/publica/409407
https://doi.org/10.1109/ECTC32862.2020.00076

المؤلفون: Stocchi M., Mencarelli D., Pierantoni L., Kot D., Lisker M., Goritz A., Kaynak C. B., Wietstruck M., Kaynak M.

المساهمون: Stocchi, M., Mencarelli, D., Pierantoni, L., Kot, D., Lisker, M., Goritz, A., Kaynak, C. B., Wietstruck, M., Kaynak, M.

مصطلحات موضوعية: Bolometers, Temperature sensors, Uncooled infrared

وصف الملف: ELETTRONICO

Relation: info:eu-repo/semantics/altIdentifier/pmid/31503619; info:eu-repo/semantics/altIdentifier/wos/WOS:000473324200014; volume:58; issue:19; firstpage:5233; lastpage:5239; numberofpages:7; journal:APPLIED OPTICS; http://hdl.handle.net/11566/270635; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-85068460932; https://www.osapublishing.org/ao/abstract.cfm?uri=ao-58-19-5233

الاتاحة: http://hdl.handle.net/11566/270635
https://doi.org/10.1364/AO.58.005233
https://www.osapublishing.org/ao/abstract.cfm?uri=ao-58-19-5233

المؤلفون: Stocchi M., Mencarelli D., Pierantoni L., Goritz A., Kaynak C. B., Wietstruck M., Kaynak M.

المساهمون: Stocchi, M., Mencarelli, D., Pierantoni, L., Goritz, A., Kaynak, C. B., Wietstruck, M., Kaynak, M.

مصطلحات موضوعية: Rarefied gases, Boltzmann equation, Thermal transpiration

وصف الملف: ELETTRONICO

Relation: info:eu-repo/semantics/altIdentifier/pmid/31366965; info:eu-repo/semantics/altIdentifier/wos/WOS:000477950800001; volume:9; issue:1; firstpage:11078; lastpage:11086; numberofpages:9; journal:SCIENTIFIC REPORTS; http://hdl.handle.net/11566/270633; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-85070860977; https://www.nature.com/articles/s41598-019-47472-2

الاتاحة: http://hdl.handle.net/11566/270633
https://doi.org/10.1038/s41598-019-47472-2
https://www.nature.com/articles/s41598-019-47472-2

المؤلفون: Kaynak, C. Baristiran, Yamamoto, Y., Goeritz, A., Korndoerfer, F., Stocchi, M., Wietstruck, M., Gürbüz, Yaşar, Kaynak, M.

المساهمون: Eriksson, M. A., Lagally, M. G.

Relation: Kaynak, C. Baristiran and Yamamoto, Y. and Goeritz, A. and Korndoerfer, F. and Stocchi, M. and Wietstruck, M. and Gürbüz, Yaşar and Kaynak, M. (2019) Process effects on the noise performance of SiGe/Si multi quantum well thermistor. In: 2nd Joint International Technology and Device Meeting, ISTDM 2019 / International Conference on Silicon Epitaxy and Heterostructures, ICSI 2019 Conference, Madison, WI, USA

الاتاحة: https://research.sabanciuniv.edu/id/eprint/46683/
https://doi.org/10.1149/09301.0105ecst

المؤلفون: Baristiran-Kaynak, Canan, Göritz, A., Yamamoto, Y., Wietstruck, M., Stocchi, M., Ünal, Kadir Eren, Özdemir, Mehmet Bora, Özsoy, Yusuf, Gürbüz, Yaşar, Kaynak, Mehmet

وصف الملف: application/pdf

Relation: https://research.sabanciuniv.edu/id/eprint/37953/1/Development_and_Mechanical_Modeling_of_Si1-XGex-Si_MQW_Based_Uncooled_Microbolometers_in_a_130_nm_BiCMOS.pdf; Baristiran-Kaynak, Canan and Göritz, A. and Yamamoto, Y. and Wietstruck, M. and Stocchi, M. and Ünal, Kadir Eren and Özdemir, Mehmet Bora and Özsoy, Yusuf and Gürbüz, Yaşar and Kaynak, Mehmet (2019) Development and mechanical modeling of Si1-XGex/Si MQW based uncooled microbolometers in a 130 nm BiCMOS. In: 19th IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF), Orlando, FL, USA

الاتاحة: https://research.sabanciuniv.edu/id/eprint/37953/
https://research.sabanciuniv.edu/id/eprint/37953/1/Development_and_Mechanical_Modeling_of_Si1-XGex-Si_MQW_Based_Uncooled_Microbolometers_in_a_130_nm_BiCMOS.pdf
https://doi.org/10.1109/SIRF.2019.8709124

المؤلفون: Kaynak, C. B., Goritz, A., Yuji Yamamoto, Wietstruck, M., Stocchi, M., Unal, K. E., Ozdemir, M. B., Ozsoy, Y., Gurbuz, Y., Kaynak, M.

المساهمون: Vrba, J., Svanda, M., Fiser, O., Vrba, D.

المصدر: Scopus-Elsevier

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::7ada2a29701346d699b77364be40d455
https://research.sabanciuniv.edu/id/eprint/40243/

المؤلفون: Wietstruck, M., Marschmeyer, S., Tolunay Wipf, S., Wipf, C., Voß, T., Bertrand, M., Pistono, E., Acri, G., Podevin, F., Ferrari, P., Kaynak, Mehmet

Relation: Wietstruck, M. and Marschmeyer, S. and Tolunay Wipf, S. and Wipf, C. and Voß, T. and Bertrand, M. and Pistono, E. and Acri, G. and Podevin, F. and Ferrari, P. and Kaynak, Mehmet (2018) Design optimization of through-silicon vias for substrate-integrated waveguides embedded in high-resistive silicon interposer. In: IEEE 20th Electronics Packaging Technology Conference (EPTC), Singapore

الاتاحة: https://research.sabanciuniv.edu/id/eprint/46883/
https://doi.org/10.1109/EPTC.2018.8654426

المؤلفون: Baristiran Kaynak, C., Yamamoto, Y., Göritz, A., Korndörfer, F., Zaumseil, P., Kulse, P., Schulz, K., Fraschke, M., Marschmeyer, S., Wolansky, D., Wietstruck, M., Shafique, Atia, Gürbüz, Yaşar, Kaynak, Mehmet

المساهمون: Liu, Q., Hartmann, J. M., Thean, A., Miyazaki, S., Ogura, A., Gong, X., Caymax, M., Schulze, A., Mashi, G., Mai, A., Osting, M., Niu, G., Harame, D.

Relation: Baristiran Kaynak, C. and Yamamoto, Y. and Göritz, A. and Korndörfer, F. and Zaumseil, P. and Kulse, P. and Schulz, K. and Fraschke, M. and Marschmeyer, S. and Wolansky, D. and Wietstruck, M. and Shafique, Atia and Gürbüz, Yaşar and Kaynak, Mehmet (2018) Si1-xGex/Si MQW based uncooled microbolometer development and integration into 130 nm BiCMOS technology. In: 8th Symposium on SiGe, Ge, and Related Compounds: Materials, Processing, and Devices - AiMES 2018, ECS and SMEQ Joint International Meeting, Cancun, Mexico

الاتاحة: https://research.sabanciuniv.edu/id/eprint/46618/
https://doi.org/10.1149/08607.0373ecst

المؤلفون: Inac, M., Wietstruck, M., Goritz, A., Cetindogan, B., Baristiran-Kaynak, C., Lisker, M., Kruger, A., Trusch, A., Saarow, U., Heinrich, P., Voss, T., Kaynak, Mehmet

Relation: Inac, M. and Wietstruck, M. and Goritz, A. and Cetindogan, B. and Baristiran-Kaynak, C. and Lisker, M. and Kruger, A. and Trusch, A. and Saarow, U. and Heinrich, P. and Voss, T. and Kaynak, Mehmet (2018) Oxide surface roughness optimization of BiCMOS beol wafers for 200 mm wafer level microfluidic packaging based on fusion bonding. In: IEEE 19th Electronics Packaging Technology Conference (EPTC), Singapore

الاتاحة: https://research.sabanciuniv.edu/id/eprint/45829/
https://doi.org/10.1109/EPTC.2017.8277523

المؤلفون: Wietstruck, M., Marschmeyer, S., Lisker, M., Kruger, A., Wolansky, D., Fraschke, M., Kulse, P., Goritz, A., Inac, M., Voss, T., Mai, A., Kaynak, Mehmet

Relation: Wietstruck, M. and Marschmeyer, S. and Lisker, M. and Kruger, A. and Wolansky, D. and Fraschke, M. and Kulse, P. and Goritz, A. and Inac, M. and Voss, T. and Mai, A. and Kaynak, Mehmet (2018) Through-Silicon Via process module with backside metallization and redistribution layer within a 130 nm SiGe BiCMOS technology. In: IEEE 19th Electronics Packaging Technology Conference (EPTC), Singapore

الاتاحة: https://research.sabanciuniv.edu/id/eprint/45830/
https://doi.org/10.1109/EPTC.2017.8277510

المؤلفون: Kaynak, C. Baristiran, Yamamoto, Y., Göritz, A., Korndörfera, F., Zaumseil, P., Kulse, P., Schulz, K., Wietstruck, M., Costina, I., Shafique, Atia, Gürbüz, Yaşar, Kaynak, Mehmet

المساهمون: Andresen, B. F., Norton, P. R., Fulop, G. F., Hanson, C. M., Miller, J. L.

Relation: Kaynak, C. Baristiran and Yamamoto, Y. and Göritz, A. and Korndörfera, F. and Zaumseil, P. and Kulse, P. and Schulz, K. and Wietstruck, M. and Costina, I. and Shafique, Atia and Gürbüz, Yaşar and Kaynak, Mehmet (2018) Pixel resistance optimization of a Si0.5Ge0.5/Si MQWs thermistor based on in-situ B doping for microbolometer applications. In: Infrared Technology and Applications XLIV 2018, Orlando, FL, USA

الاتاحة: https://research.sabanciuniv.edu/id/eprint/45825/
https://doi.org/10.1117/12.2304636

المؤلفون: Inac, M., Wietstruck, M., Goritz, A., Cetindogan, B., Baristiran-Kaynak, C., Lisker, M., Kruger, A., Trusch, A., Saarow, U., Heinrich, P., Voss, T., Kaynak, M.

المصدر: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) ; page 1-4

الاتاحة: http://dx.doi.org/10.1109/eptc.2017.8277523
http://xplorestaging.ieee.org/ielx7/8267583/8277424/08277523.pdf?arnumber=8277523

المؤلفون: Wietstruck, M., Marschmeyer, S., Lisker, M., Kruger, A., Wolansky, D., Fraschke, M., Kulse, P., Goritz, A., Inac, M., Voss, T., Mai, A., Kaynak, M.

المصدر: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) ; page 1-6

الاتاحة: http://dx.doi.org/10.1109/eptc.2017.8277510
http://xplorestaging.ieee.org/ielx7/8267583/8277424/08277510.pdf?arnumber=8277510