المؤلفون: Muhammad Afiq Azmi, Mohd Zulkifly Abdullah, Raa Khimi Shuib, Zulkifli Mohamad Ariff, Wei Keat Loh, Renn Chan Ooi, Chun Keang Ooi, Muhammad Khalil Abdullah

المصدر: Polymer Bulletin.

مصطلحات موضوعية: Polymers and Plastics, Materials Chemistry, General Chemistry, Condensed Matter Physics

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::61fdebeac7ca8afcc5dbcb63561394a9
https://doi.org/10.1007/s00289-023-04805-6

المؤلفون: Chin, Ian¹ ian.chin@intel.com, Wei Keat Loh¹, Bin Abdullah, Mohd Zulkifly²

المصدر: Journal of Microelectronic & Electronic Packaging. 2023 4th Quarter, Vol. 20 Issue 4, p123-129. 7p.

مصطلحات موضوعية: *DIGITAL image correlation, *THERMAL expansion, *HEAT resistant materials, *SWELLING of materials, *HYGROTHERMOELASTICITY

المؤلفون: Charles Arvin, Sze Pei Lim, David Locker, Wei Keat Loh, Keith Sweatman, Francis Lee, Masahiro Tsuriya

المصدر: 2022 International Conference on Electronics Packaging (ICEP).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::eadb16e9349ce8ae907b554fcf576f79
https://doi.org/10.23919/icep55381.2022.9795576

المؤلفون: Ian Chin, Wei Keat Loh, Mohd Zulkifly Bin Abdullah

المصدر: 2022 International Conference on Electronics Packaging (ICEP).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b63594159c78f98e73d3f1a74690ac87
https://doi.org/10.23919/icep55381.2022.9795598

المؤلفون: Charles L. Arvin, Keith Sweatman, Wei Keat Loh, Derek Daily, David Locker, Naoki Kubota, Masahiro Tsuriya, Sze Pei Lim, Ravi Pokhrel

المصدر: 2021 International Conference on Electronics Packaging (ICEP).

مصطلحات موضوعية: Interconnection, Materials science, chemistry, Whisker, Intermetallic, chemistry.chemical_element, Fusible alloy, Tin, Engineering physics, Electromigration, Capacitance, Indium

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a756d6f8414b19ffd3d468cb8830caef
https://doi.org/10.23919/icep51988.2021.9451941

المؤلفون: Tatsuro Yoshida, Makoto Tsukahara, Haley Fu, Ron W. Kulterman, Kei Murayama, Arvind Purushotaman, Wei Keat Loh, Jenn An Wang, Kang Eu Ong

المصدر: 2021 International Conference on Electronics Packaging (ICEP).

مصطلحات موضوعية: Semiconductor industry, Substrate (building), Materials science, Silicon, chemistry, Semiconductor device modeling, chemistry.chemical_element, Mechanical engineering, Wafer, Material properties, Temperature measurement, Predictive modelling

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0395fe6a4d717359985365a8c132a20d
https://doi.org/10.23919/icep51988.2021.9451946

المؤلفون: Wei Keat Loh, Ong Kang Eu, Haley Fu, Jenn An Wang, Chih Chung Hsu, Ron W. Kulterman, Wen Hsin Weng

المصدر: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

مصطلحات موضوعية: Materials science, Semiconductor device modeling, Fluid mechanics, Epoxy, STRIPS, law.invention, law, visual_art, Heat transfer, visual_art.visual_art_medium, Integrated circuit packaging, Composite material, Material properties, Curing (chemistry)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0ee78dbb1200d0ed514a3e68e6ea1211
https://doi.org/10.1109/impact50485.2020.9268561

المؤلفون: Wei Keat Loh, Haley Fu, Chih Chung Hsu, Ron W. Kulterman

المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: 010302 applied physics, Materials science, 05 social sciences, Mechanical engineering, Fine pitch, Solder paste, 01 natural sciences, Electronic packages, Ball grid array, Soldering, 0103 physical sciences, Package on package, 0501 psychology and cognitive sciences, 050104 developmental & child psychology

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a91d931fa88d8786152698bc860da4f7
https://doi.org/10.1109/ectc.2019.00055

المؤلفون: Ron W. Kulterman, Chih Chung Hsu, Haley Fu, Wei Keat Loh, Jenn An Wang, Kang Eu Ong

المصدر: 2019 International Conference on Electronics Packaging (ICEP).

مصطلحات موضوعية: 010302 applied physics, Property (programming), business.industry, Computer science, 05 social sciences, Mechanical engineering, Computational fluid dynamics, 01 natural sciences, Finite element method, Superposition principle, Electronic packages, 0103 physical sciences, 0501 psychology and cognitive sciences, Representation (mathematics), business, Predictive modelling, 050104 developmental & child psychology, Shrinkage

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9019b893145f90678f84ab14c6ec61c1
https://doi.org/10.23919/icep.2019.8733601

المؤلفون: Chih Chung Hsu, Wei Keat Loh, Haley Fu, Ron W. Kulterman

المصدر: 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT).

مصطلحات موضوعية: 010302 applied physics, Computer science, 020208 electrical & electronic engineering, Mechanical engineering, 02 engineering and technology, Solid modeling, medicine.disease_cause, 01 natural sciences, Viscoelasticity, Finite element method, Electronic packages, Mold, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, medicine, Material properties, Curing (chemistry), Shrinkage

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::862fbe1c5330d844f143346fc8bf4467
https://doi.org/10.1109/iemt.2018.8511686

المؤلفون: Yung Hsiang Lee, Ian Chin, Wei Keat Loh

المصدر: 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT).

مصطلحات موضوعية: 010302 applied physics, Absorption (acoustics), Materials science, Moisture, Delamination, Electronic packaging, Mechanical engineering, Humidity, 02 engineering and technology, 021001 nanoscience & nanotechnology, 01 natural sciences, Corrosion, Reliability (semiconductor), 0103 physical sciences, 0210 nano-technology, Flip chip

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::349be87cd86726d78bb61b3e4bc8276f
https://doi.org/10.1109/iemt.2018.8511674

المؤلفون: Renn Chan Ooi, Muhammad Khalil Abdullah, M. H. H. Ishak, Mohd Zulkifly Abdullah, Abdul Aziz, Chun Keang Ooi, Wei Keat Loh

المصدر: Applied Mechanics and Materials. 786:361-366

مصطلحات موضوعية: Engineering, Finite volume method, business.industry, Mechanical engineering, General Medicine, Chip, Die (integrated circuit), Encapsulation (networking), Software, Fluent, Electronic engineering, Volume of fluid method, business, Flip chip

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a1b6a606992ca77e2a0a4acf68008cce
https://doi.org/10.4028/www.scientific.net/amm.786.361

المؤلفون: Wei Keat Loh, Kulterman, Ron, Fu, Haley, Tsuriya, Masahiro

المصدر: 2016 International Conference on Electronics Packaging (ICEP)

الاتاحة: http://dx.doi.org/10.1109/icep.2016.7486789
http://xplorestaging.ieee.org/ielx7/7481053/7486763/07486789.pdf?arnumber=7486789

المؤلفون: Wei Keat Loh, Kulterman, Ron, Purdie, Tim, Fu, Haley, Tsuriya, Masahiro

المصدر: 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC)

الاتاحة: http://dx.doi.org/10.1109/icep-iaac.2015.7111029
http://xplorestaging.ieee.org/ielx7/7102535/7110993/07111029.pdf?arnumber=7111029

المؤلفون: Wei Keat Loh, Ron W. Kultcrman, Haley Fu, Masahiro Tsuriya

المصدر: 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference.

مصطلحات موضوعية: Engineering, Measure (data warehouse), Digital image correlation, Engineering drawing, business.industry, media_common.quotation_subject, Field of view, Metrology, Software, JEDEC memory standards, Electronics, business, Function (engineering), media_common

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::cb29147b7dc7000069c70e3d40c085c5
https://doi.org/10.1109/iemt.2016.7761959

المؤلفون: Wei Keat Loh, Renn Chan Ooi, Mohd Zulkifly Abdullah, Dadan Ramdan, Wei Chiat Leong, Chun Keang Ooi, C. Y. Khor

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 2:1786-1795

مصطلحات موضوعية: Materials science, business.product_category, Gambit, Solid modeling, medicine.disease_cause, GeneralLiterature_MISCELLANEOUS, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, Ball grid array, Mold, Fluid–structure interaction, Volume of fluid method, medicine, Fluent, Electronic engineering, Die (manufacturing), Electrical and Electronic Engineering, Composite material, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::10d17bd858648673c628d607a0de3bc4
https://doi.org/10.1109/tcpmt.2012.2215860

المؤلفون: Renn Chan Ooi, Wei Keat Loh, M. A. Mujeebu, Z. M. Abdullah, Chun Keang Ooi, Dadan Ramdan

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 2:593-603

مصطلحات موضوعية: Materials science, business.industry, Mechanical engineering, Molding (process), Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, Shear rate, Rheology, Ball grid array, Volume of fluid method, Fluid dynamics, Fluent, Microelectronics, Electrical and Electronic Engineering, Composite material, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0d038c9fb0bc77542d9bb1166d8a2741
https://doi.org/10.1109/tcpmt.2011.2171513

المؤلفون: Mohd Nasir Tamin, Fethma M. Nor, Wei Keat Loh

المصدر: IEEE Transactions on Components and Packaging Technologies. 33:614-620

مصطلحات موضوعية: Stress (mechanics), Shear (sheet metal), Shear modulus, Shear rate, Materials science, Critical resolved shear stress, Metallurgy, Ultimate tensile strength, Shear stress, Shear strength, Electrical and Electronic Engineering, Composite material, Electronic, Optical and Magnetic Materials

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::100235bd5978b36f31803f488c71ef39
https://doi.org/10.1109/tcapt.2010.2050887

المؤلفون: Chee Kan, Lee, Derek, Rebsom, Wei Keat, Loh, Hui Ping, Ng, Kam Wah, Lau

المصدر: 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ; page 1-1

الاتاحة: http://dx.doi.org/10.1109/iemt.2008.5507826
http://xplorestaging.ieee.org/ielx5/5497984/5507772/05507826.pdf?arnumber=5507826

المؤلفون: Tamin, Mohd N., M. Nor, Fethma, Wei, Keat Loh

مصطلحات موضوعية: TJ Mechanical engineering and machinery

Relation: Tamin, Mohd N. and M. Nor, Fethma and Wei, Keat Loh (2007) Hybrid experimental-computational approach for solder/IMC interface shear strength determination in tin-lead solder joints. In: International Conference on Advanced Computation Engineering Experimenting, 2007, Portugal.

الاتاحة: http://eprints.utm.my/14102/
http://ieeexplore.ieee.org/document/5585732/