المؤلفون: Wong, Han, Fischer, Felix

المصدر: Nano Letters. 24(33)

مصطلحات موضوعية: Conductive Polymer, Dielectrophoresis, Directed Assembly, Molecular Electronics, Nanogap, Nanowires, Wafer-Scale

وصف الملف: application/pdf

URL الوصول: https://escholarship.org/uc/item/432819r2
https://escholarship.org/content/qt432819r2/qt432819r2.pdf

المؤلفون: Yuan Zhu, Tomas Nyberg, Leif Nyholm, Daniel Primetzhofer, Xun Shi, Zhen Zhang

المصدر: Nano-Micro Letters, Vol 17, Iss 1, Pp 1-12 (2024)

مصطلحات موضوعية: Wafer-scale Ag2S films, Reactive sputter, Silver nucleation, Ag+ migration, Energy-efficient neuromorphic computing, Technology

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2311-6706; https://doaj.org/toc/2150-5551

URL الوصول: https://doaj.org/article/bb3527e63f6345a8bfd867bfaf4b77a3

المؤلفون: Xiaomin Zhang, Jiahan Xu, Aomiao Zhi, Jian Wang, Yue Wang, Wenkai Zhu, Xingjie Han, Xuezeng Tian, Xuedong Bai, Baoquan Sun, Zhongming Wei, Jing Zhang, Kaiyou Wang

المصدر: Advanced Science, Vol 11, Iss 42, Pp n/a-n/a (2024)

مصطلحات موضوعية: in situ defect passivation, MoS2, sulfur defects, transistors, wafer‐scale epitaxy, Science

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2198-3844

URL الوصول: https://doaj.org/article/c5ad0948f16f4c639a88dfbbffffd4a8

المؤلفون: Yong‐Bok Lee, Pan‐Kyu Choi, Min‐Ho Kang, Su‐Hyun Kim, Seung‐Jun Lee, Tae‐Soo Kim, So‐Young Lee, Jun‐Bo Yoon

المصدر: Advanced Electronic Materials, Vol 10, Iss 9, Pp n/a-n/a (2024)

مصطلحات موضوعية: CMOS‐compatible fabrication, electrothermal actuation, nanoelectromechanical System (NEMS), non‐volatile Switch, wafer‐scale, Electric apparatus and materials. Electric circuits. Electric networks, TK452-454.4, Physics, QC1-999

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2199-160X

URL الوصول: https://doaj.org/article/7ff507fafc994d549f8cf108e58aee0d

المؤلفون: Boseong Son, Huijin Kim, Young-Woong Lee, Purusottam Reddy Bommireddy, Si-Hyun Park

المصدر: IEEE Journal of the Electron Devices Society, Vol 12, Pp 905-911 (2024)

مصطلحات موضوعية: Wafer-scale monolithic integration, p-GaN-depletion MOSFET, GaN LED, micro-LED displays, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/10668404/; https://doaj.org/toc/2168-6734

URL الوصول: https://doaj.org/article/44f7e96cd5e84144b47ace29ba1494a8

المؤلفون: Fanyi Kong, Chenhua Ji, Gaolei Zhao, Lei Zhang, Zheng Hao, Hu Wang, Jianxun Dai, Huolin Huang, Lujun Pan, Dawei Li

المصدر: Nanomaterials, Vol 14, Iss 19, p 1597 (2024)

مصطلحات موضوعية: surface-enhanced Raman scattering, wafer-scale fabrication, Ag-TiO2 hybrids, UV photo-reduction, sub-micrometer plastics detection, Chemistry, QD1-999

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2079-4991/14/19/1597; https://doaj.org/toc/2079-4991

URL الوصول: https://doaj.org/article/ea423c689c7f47afb5f1a27a4726e61c

المؤلفون: Roqueta, Fabrice, Boutaleb, Mohamed, Nguyen, Phuc Viet Khoa, Mencik, Jean-Mathieu

المساهمون: ST Microélectronics, ST Microélectronic, Laboratoire de Mécanique Gabriel Lamé (LaMé), Université d'Orléans (UO)-Université de Tours (UT)-Institut National des Sciences Appliquées - Centre Val de Loire (INSA CVL), Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA), Dynamique et Vibrations des Structures (DVS), Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Université d'Orléans (UO)-Université de Tours (UT)-Institut National des Sciences Appliquées - Centre Val de Loire (INSA CVL)

المصدر: 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2024)
https://hal.science/hal-04575395
25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2024), Apr 2024, Catania, Italy

مصطلحات موضوعية: wafer warpage, patterned wafer, Finite Element Analysis, Homogenization, wafer scale, [SPI]Engineering Sciences [physics]

جغرافية الموضوع: Catania, Italy

Relation: hal-04575395; https://hal.science/hal-04575395; https://hal.science/hal-04575395/document; https://hal.science/hal-04575395/file/Paper.pdf

الاتاحة: https://hal.science/hal-04575395
https://hal.science/hal-04575395/document
https://hal.science/hal-04575395/file/Paper.pdf

المؤلفون: Zhiming Chen, An Cao, Dilong Liu, Zhaoting Zhu, Fan Yang, Yulong Fan, Rui Liu, Zhulin Huang, Yue Li

المصدر: Advanced Science, Vol 11, Iss 12, Pp n/a-n/a (2024)

مصطلحات موضوعية: non‐closely‐packed gold array, plasmonic sensing, self‐confined dewetting, surface lattice resonance, wafer scale, Science

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2198-3844

URL الوصول: https://doaj.org/article/65c98efa2f6a44fc83220b25e8131eef

المؤلفون: Zijia Liu, Xunguo Gong, Jinran Cheng, Lei Shao, Chunshui Wang, Jian Jiang, Ruiqing Cheng, Jun He

المصدر: Chip, Vol 3, Iss 1, Pp 100080- (2024)

مصطلحات موضوعية: 2D materials, Wafer-scale synthesis, 2D integrated devices, Post-moore electronics, Information technology, T58.5-58.64

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2709472323000436; https://doaj.org/toc/2709-4723

URL الوصول: https://doaj.org/article/b03acc9f58834f2487522975ab3243fe

المؤلفون: Meng Liang, Han Yan, Nasrullah Wazir, Changjian Zhou, Zichao Ma

المصدر: Nanomaterials, Vol 14, Iss 17, p 1408 (2024)

مصطلحات موضوعية: two-dimensional semiconductors, wafer-scale preparation, field-effect transistors, contact resistance, high-κ dielectric, post-Moore electronics, Chemistry, QD1-999

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2079-4991/14/17/1408; https://doaj.org/toc/2079-4991

URL الوصول: https://doaj.org/article/e4f4d1959355432ab87fff36e0137162

المؤلفون: Ziqian Hao, Jun Qian, Yating Li, Qinyong Dai, Longfei Li, Jiacheng Xie, Li Sun, Xiaomu Wang, Xinran Wang, Yi Shi, Yun Li

المصدر: Advanced Electronic Materials, Vol 10, Iss 1, Pp n/a-n/a (2024)

مصطلحات موضوعية: inkjet printed, integrated logic, organic Schottky‐gate transistors, single‐battery‐driven, wafer‐scale, Electric apparatus and materials. Electric circuits. Electric networks, TK452-454.4, Physics, QC1-999

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2199-160X

URL الوصول: https://doaj.org/article/a76056d5626b4db98fce7a50f9c8dc8f

المؤلفون: Aparicio Rebollo, Francisco Javier, Holgado, Miguel, Borrás Martos, Ana Isabel, Blaszczyk-Lezak, Iwona Krystina, Griol, Amadeu, Barrios, Carlos A., Casquel, Rafael, Sanza, Francisco J., Sohlström, Hans, Antelius, Mikael, González-Elipe, Agustín R., Barranco Quero, Ángel

المساهمون: Universidad de Sevilla. Departamento de Física Aplicada I, Universidad de Sevilla. FQM196: Nanotecnología en Superficies y Plasma, EU Project CDS2008–0023, EU Project MAT2010–21218, EU Project P09-TEP-5283

مصطلحات موضوعية: Organic luminescent films, Visible blind, UV wavelenght shifting, Resonant photonic structure, Wafer scale integration

Relation: CDS2008–0023; MAT2010–21218; P09-TEP-5283; https://idus.us.es/handle//11441/154560

الاتاحة: https://idus.us.es/handle//11441/154560

المؤلفون: Mengwen Chen, Chenyu Wang, Xiao-Hui Tian, Jie Tang, Xiaowen Gu, Guang Qian, Kunpeng Jia, Hua-Ying Liu, Zhong Yan, Zhilin Ye, Zhijun Yin, Shi-Ning Zhu, Zhenda Xie

المصدر: Materials, Vol 17, Iss 8, p 1720 (2024)

مصطلحات موضوعية: thin-film lithium niobate, quasi-phase matching, electric field poling, wafer-scale fabrication, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85

Relation: https://www.mdpi.com/1996-1944/17/8/1720; https://doaj.org/toc/1996-1944; https://doaj.org/article/9f67aa53e18b42e1a44fdbdc7f5c758a

الاتاحة: https://doi.org/10.3390/ma17081720
https://doaj.org/article/9f67aa53e18b42e1a44fdbdc7f5c758a

المؤلفون: Eun-Kyung Chu, Eun Jeong Youn, Hyun Woong Kim, Bum Doo Park, Ho Kun Sung, Hyeong-Ho Park

المصدر: Micromachines, Vol 15, Iss 5, p 560 (2024)

مصطلحات موضوعية: micro-light-emitting diode, indium tin oxide, wafer-scale characterization, high pixel-per-inch, Mechanical engineering and machinery, TJ1-1570

Relation: https://www.mdpi.com/2072-666X/15/5/560; https://doaj.org/toc/2072-666X; https://doaj.org/article/9100158a199e461a91c5c785df4a8e44

الاتاحة: https://doi.org/10.3390/mi15050560
https://doaj.org/article/9100158a199e461a91c5c785df4a8e44

المؤلفون: Xiaoling Lu, Walid-Madhat Munief, Pavel Damborský, Alice Kasjanow, Jaroslav Katrlík, Vivek Pachauri, Sven Ingebrandt

المصدر: MethodsX, Vol 11, Iss , Pp 102402- (2023)

مصطلحات موضوعية: Wafer-scale processing of (reduced) GO thin-films (WSPgo), Science

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2215016123003989; https://doaj.org/toc/2215-0161

URL الوصول: https://doaj.org/article/d466bc7d3bd64dc98918fe0837d8ba5f

المؤلفون: Yi Rang Lim, Seunghun Jang, Garam Bae, Hye Yoon Jeon, Cheolho Jeon, Da Som Song, Yeong Min Kwon, Moonjeong Jang, Soonmin Yim, Sung Myung, Sun Sook Lee, Hyunju Chang, Wooseok Song, Ki‐Seok An, Jongsun Lim

المصدر: Advanced Electronic Materials, Vol 9, Iss 12, Pp n/a-n/a (2023)

مصطلحات موضوعية: heterostructures, molybdenum disulfide, photodetectors, platinization, wafer‐scale synthesis, Electric apparatus and materials. Electric circuits. Electric networks, TK452-454.4, Physics, QC1-999

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2199-160X

URL الوصول: https://doaj.org/article/a8f82a29dfda4e7fa095bffe28d8a254

المؤلفون: Majety, Sridhar

مصطلحات موضوعية: Electrical engineering, Color centers, Ion beam etching, Silicon Carbide, Triangular cross-section photonics, Wafer-scale etching

وصف الملف: application/pdf

URL الوصول: https://escholarship.org/uc/item/3gc086ms
https://escholarship.org/content/qt3gc086ms/qt3gc086ms.pdf

المؤلفون: Zimeng Ye, Chao Tan, Xiaolei Huang, Yi Ouyang, Lei Yang, Zegao Wang, Mingdong Dong

المصدر: Nano-Micro Letters, Vol 15, Iss 1, Pp 1-42 (2023)

مصطلحات موضوعية: Wafer-scale growth, Molybdenum disulfide, Gas deposition, Integrated circuits, Technology

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2311-6706; https://doaj.org/toc/2150-5551

URL الوصول: https://doaj.org/article/738a6c6b3b0f4c8e979230da2496e996

المؤلفون: Tae Wan Park, Young Lim Kang, Eun Bin Kang, Hyunsung Jung, Seoung‐Ki Lee, Geon‐Tae Hwang, Jung Woo Lee, Si‐Young Choi, Sahn Nahm, Se‐Hun Kwon, Kwang Ho kim, Woon Ik Park

المصدر: Advanced Science, Vol 10, Iss 29, Pp n/a-n/a (2023)

مصطلحات موضوعية: block copolymer, nanopatterning, nanotransfer printing, self‐assembly, wafer scale, Science

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2198-3844

URL الوصول: https://doaj.org/article/9f37dffdca7f4386824aaf573a0cfb5a

المؤلفون: Xiang Lan, Yingliang Cheng, Xiangdong Yang, Zhengwei Zhang

المصدر: Chip, Vol 2, Iss 3, Pp 100057- (2023)

مصطلحات موضوعية: Wafer-scale, Fabrication technology, Transition metal dichalcogenides, Electronic devices, Information technology, T58.5-58.64

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2709472323000205; https://doaj.org/toc/2709-4723

URL الوصول: https://doaj.org/article/fb103294d8ed40b08900322a764bcea3