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1Academic Journal
المؤلفون: Wu, Binghan, Song, Cen, Zhao, Gang
المصدر: Journal of Industrial Engineering and Applied Science, 2(4), 66-72, (2024-08-01)
مصطلحات موضوعية: Heterogeneous integration, High-Performance Computing, Telecommunications, Sensors, Semiconductor Technologies, CMOS, GaAs, MEMS, Flip-Chip Bonding, Through-Silicon Vias (TSV), Wafer-Level Packaging (WLP), Power Efficiency, integration Density, Thermal Management, Design Verification, Fabrication Techniques, Processing Speed, Signal integrity, Data Throughput, Energy Consumption
Relation: https://zenodo.org/communities/jieas; https://doi.org/10.5281/zenodo.12794469; https://doi.org/10.5281/zenodo.12794470; oai:zenodo.org:12794470; https://www.suaspress.org/ojs/index.php/JIEAS/article/view/v2n4a11; ark:/40704/JIEAS.v2n4a11
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2Academic Journal
المؤلفون: Pasaribu, Tiara Kristina, Pasaribu, Donna Ria, Sihite, Jubilezer, Lumban Gaol, Bernas Alonso, Manurung, Erika Cahaya
المساهمون: Universitas HKBP Nommensen, Medan, Sumatera Utara, Indonesia
المصدر: Jurnal Mamangan; Vol 12, No 3 (2024): Jurnal Ilmu Sosial Mamangan Accredited 3 (SK Dirjen Ristek Dikti No. 158/E/KPT/2021); 689-704 ; Jurnal Ilmu Sosial Mamangan; Vol 12, No 3 (2024): Jurnal Ilmu Sosial Mamangan Accredited 3 (SK Dirjen Ristek Dikti No. 158/E/KPT/2021); 689-704 ; 2503-1570 ; 2301-8496 ; 10.22202/mamangan.v12i3
مصطلحات موضوعية: Education, social, language, IELTS, Listening, paraphrasing, strategies, While Listening Performance (WLP)
وصف الملف: application/pdf
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3Academic Journal
المؤلفون: Da-Wei Zhu, Hai-Lin Chen, Jiachen Xu, Bo-Ao Xu, Li Zhen
المصدر: IEEE Access, Vol 11, Pp 72950-72973 (2023)
مصطلحات موضوعية: Finite-difference time-domain (FDTD) method, weighted Laguerre polynomial (WLP), altering-direction implicit (ADI), Gauss–Seidel ideology, correction equation, Electrical engineering. Electronics. Nuclear engineering, TK1-9971
وصف الملف: electronic resource
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4Academic Journal
المؤلفون: Sun, Haiyan, Gao, Bo, Zhao, Jicong
المصدر: Soldering & Surface Mount Technology, 2020, Vol. 33, Issue 3, pp. 178-186.
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5Conference
المؤلفون: Loktev, Mikhail, Misat, Sylvain, Schiedon, Ralph, de Boeij, Jeroen, van der Stam, Michiel, Sixt, Pierre, Al Dujaili, Haidar, Dewolf, Tristan, Allouti, Nacima, Pain, Laurent, Vannuffel, Cyril, Coudrain, Perceval, Garnier, Arnaud
المساهمون: Kulicke & Soffa Liteq BV (Hooge Zijde 32, 5626 DC Eindhoven), Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information (CEA-LETI), Direction de Recherche Technologique (CEA) (DRT (CEA)), Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Commissariat à l'énergie atomique et aux énergies alternatives (CEA), Département Plate-Forme Technologique (DPFT), Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Direction de Recherche Technologique (CEA) (DRT (CEA)), IEEE
المصدر: 2022 Smart Systems Integration (SSI)
https://cea.hal.science/cea-03956462
2022 Smart Systems Integration (SSI), IEEE, Apr 2022, Grenoble, France. ⟨10.1109/SSI56489.2022.9901421⟩
https://ieeexplore.ieee.org/document/9901421مصطلحات موضوعية: die-to-die, alignment, WLP, Fan-out, RDL, Lithography, LITEQ 500, Overlay, [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics
Relation: cea-03956462; https://cea.hal.science/cea-03956462; https://cea.hal.science/cea-03956462/document; https://cea.hal.science/cea-03956462/file/Die-to-die_alignment_for_lithographic_processing_of_reconstructed_wafers%20%281%29.pdf
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6Academic Journal
المؤلفون: Gui-Ying Liu, Min Zhao, Wei-Jun Chen
المصدر: IEICE Electronics Express. 2023, 20(1):20220473
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7Academic Journal
المؤلفون: Qing-Hua Su, Kuo-Ning Chiang
المصدر: Materials; Volume 15; Issue 11; Pages: 3897
مصطلحات موضوعية: Wafer-Level Package (WLP), Finite Element Analysis (FEA), machine learning, Kernel Ridge Regression (KRR), Cluster algorithm
وصف الملف: application/pdf
Relation: Materials Simulation and Design; https://dx.doi.org/10.3390/ma15113897
الاتاحة: https://doi.org/10.3390/ma15113897
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8Academic Journal
المؤلفون: Mohamed Musa Hanafi, Parisa Azizi, Jeyanny Vijayanathan
المصدر: Agronomy; Volume 11; Issue 12; Pages: 2561
مصطلحات موضوعية: water leach purification (WLP), neutralisation underflow (NUF), sandy soil texture, phosphogypsum organic, soil conditioner, rare-earth metals, organic material
جغرافية الموضوع: agris
وصف الملف: application/pdf
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9Academic Journal
المؤلفون: Sunil Kumar Panigrahy, Yi-Chieh Tseng, Bo-Ruei Lai, Kuo-Ning Chiang
المصدر: Materials; Volume 14; Issue 18; Pages: 5342
مصطلحات موضوعية: FEM simulation, WLP, AI, machine learning, ANN, RNN, SVR, KRR, KNN, RF, regression model
وصف الملف: application/pdf
Relation: Materials Simulation and Design; https://dx.doi.org/10.3390/ma14185342
الاتاحة: https://doi.org/10.3390/ma14185342
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10Academic Journal
المؤلفون: Patric Skalecki, Maximilian Sesselmann, Sabrina Rechkemmer, Thorsten Britz, Andreas Großmann, Harald Garrecht, Oliver Sawodny
المصدر: Automation; Volume 2; Issue 1; Pages: 31-47
مصطلحات موضوعية: highway construction evaluation, 3D laser measurement, WLP, 3D road thickness, concrete construction, process analysis
وصف الملف: application/pdf
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11Academic Journal
المؤلفون: Katsumi Hattori, Masashi Hayakawa, Ryota Kimura, Yoshiaki Ando, 安藤 芳晃, 早川 正士, 服部 克巳, 木村 亮太
المصدر: Journal of Atmospheric Electricity. 2022, 41(2):52
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12Academic Journal
المؤلفون: Lixi Wan, Min Su, Weibao Qiu, Yao Lu, Zhiqiang Zhang
المصدر: IEICE Electronics Express. 2021, 18(20):20210303
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13Academic Journal
المؤلفون: Ma, Yunzhu
المصدر: Electronic Thesis and Dissertation Repository
مصطلحات موضوعية: WLP and PLP tests, L2 listening assessment, cognitive load, test-taking strategies, video-based listening tests, Education, Educational Assessment, Evaluation, and Research
وصف الملف: application/pdf
Relation: https://ir.lib.uwo.ca/etd/9399; https://ir.lib.uwo.ca/context/etd/article/12096/viewcontent/auto_convert.pdf; https://ir.lib.uwo.ca/context/etd/article/12096/filename/0/type/additional/viewcontent/Thesis_Change_Report_Yunzhu_Ma.docx
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14
المؤلفون: Peixoto, Nuno André Rodrigues Diogo
المساهمون: Fernandes, Paulo, Abreu, Cristiano, Chatinho, Vitor, Repositório Científico do Instituto Politécnico do Porto
مصطلحات موضوعية: WLP, Warpage, Mold Compound, Taguchi, debond
وصف الملف: application/pdf
الاتاحة: http://hdl.handle.net/10400.22/6231
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15
المؤلفون: Bartek, M., Zilmer, G., Teomin, D., Polyakov, A., Sinaga, S. M., Mendes, P. M., Burghartz, J. N.
المساهمون: Universidade do Minho
مصطلحات موضوعية: Wafer level packaging WLP, Chip scale packaging CSP, System-on-chip Soc, Embedded passives, Crosstalk suppression, Embedded passives, crosstalk suppression
وصف الملف: application/pdf
Relation: TOPICAL MEETING ON SILICON MONOLITHIC INTEGRATED CIRCUITS IN RF SYSTEMS, Atlanta, 2004 - "Digest of papers". Piscataway : IEEE, 2004. ISBN 0-7803-8703-1. p. 41-44.; 0-7803-8703-1
الاتاحة: http://hdl.handle.net/1822/1647
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16Conference
مصطلحات موضوعية: bumping, dealloying, electroplating, interconnects, lithography, nanoporous gold, NPG, TC bonding, WLP
Relation: Electronic Components and Technology Conference 2022; #PLACEHOLDER_PARENT_METADATA_VALUE#; IEEE 72nd Electronic Components and Technology Conference, ECTC 2022. Proceedings; https://publica.fraunhofer.de/handle/publica/426964
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17Conference
المساهمون: Centre Suisse d'Electronique et Microtechnique SA (CSEM), FemtoTools GmbH Zurich, Eidgenössische Technische Hochschule - Swiss Federal Institute of Technology Zürich (ETH Zürich), Svetan Ratchev, TC 5, WG 5.5
المصدر: IFIP Advances in Information and Communication Technology ; 6th International Precision Assembly Seminar (IPAS) ; https://inria.hal.science/hal-01363876 ; 6th International Precision Assembly Seminar (IPAS), Feb 2012, Chamonix, France. pp.28-35, ⟨10.1007/978-3-642-28163-1_4⟩
مصطلحات موضوعية: flip-chip, C-4, self-alignment, MEMS, MOEMS, no clean, force sensor, solder paste, bismuth, FemtoTools, wafer level packaging, WLP, chip scale packaging, CSP, direct chip attach, DCA, DRIE, SOI, [INFO]Computer Science [cs]
Relation: hal-01363876; https://inria.hal.science/hal-01363876; https://inria.hal.science/hal-01363876/document; https://inria.hal.science/hal-01363876/file/978-3-642-28163-1_4_Chapter.pdf
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18Conference
المؤلفون: Passerat-Palmbach, Jonathan, Caux, Jonathan, Siregar, Pridi, Mazel, Claude, Hill, David R.C.
المساهمون: Institut Supérieur d'Informatique, de Modélisation et de leurs Applications (ISIMA), Université Blaise Pascal - Clermont-Ferrand 2 (UBP)-Ministère de l'Education nationale, de l’Enseignement supérieur et de la Recherche (M.E.N.E.S.R.), Laboratoire d'Informatique, de Modélisation et d'optimisation des Systèmes (LIMOS), Université Blaise Pascal - Clermont-Ferrand 2 (UBP)-Université d'Auvergne - Clermont-Ferrand I (UdA)-SIGMA Clermont (SIGMA Clermont)-Ecole Nationale Supérieure des Mines de St Etienne (ENSM ST-ETIENNE)-Centre National de la Recherche Scientifique (CNRS), Clermont Université, Université Blaise Pascal - Clermont-Ferrand 2 (UBP), Integrative BioComputing (IBC), Integrative BioComputing, SARL, CPER Auvergne 2007-2014 Innov@Pôle - Auvergrid, FEDER
المصدر: European Simulation and Modelling ; https://inria.hal.science/hal-01083163 ; European Simulation and Modelling, Oct 2011, Guimaraes, Portugal
مصطلحات موضوعية: Stochastic Simulation, Multiple Replications In Parallel (MRIP), GP-GPU, CUDA, Warp-Level Parallelism (WLP), [INFO.INFO-DC]Computer Science [cs]/Distributed, Parallel, and Cluster Computing [cs.DC], [INFO.INFO-MO]Computer Science [cs]/Modeling and Simulation
Relation: info:eu-repo/semantics/altIdentifier/arxiv/1501.01405; hal-01083163; https://inria.hal.science/hal-01083163; https://inria.hal.science/hal-01083163v2/document; https://inria.hal.science/hal-01083163v2/file/esm2011_frree.pdf; ARXIV: 1501.01405
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19Academic Journal
المؤلفون: Passerat-Palmbach, Jonathan, Schweitzer, Pierre, Caux, Jonathan, Siregar, Pridi, Mazel, Claude, Hill, David R.C.
المساهمون: Institut Supérieur d'Informatique, de Modélisation et de leurs Applications (ISIMA), Université Blaise Pascal - Clermont-Ferrand 2 (UBP)-Ministère de l'Education nationale, de l’Enseignement supérieur et de la Recherche (M.E.N.E.S.R.), Laboratoire d'Informatique, de Modélisation et d'optimisation des Systèmes (LIMOS), Université Blaise Pascal - Clermont-Ferrand 2 (UBP)-Université d'Auvergne - Clermont-Ferrand I (UdA)-SIGMA Clermont (SIGMA Clermont)-Ecole Nationale Supérieure des Mines de St Etienne (ENSM ST-ETIENNE)-Centre National de la Recherche Scientifique (CNRS), Clermont Université, Université Blaise Pascal - Clermont-Ferrand 2 (UBP), Laboratoire de Physique Corpusculaire - Clermont-Ferrand (LPC), Université Blaise Pascal - Clermont-Ferrand 2 (UBP)-Institut National de Physique Nucléaire et de Physique des Particules du CNRS (IN2P3)-Centre National de la Recherche Scientifique (CNRS), Integrative BioComputing (IBC), Integrative BioComputing, SARL, CPER Auvergne 2007-2014 Innov@Pôle - Auvergrid, FEDER
المصدر: ISSN: 1757-2657.
مصطلحات موضوعية: CUDA, Warp-Level Parallelism (WLP), GPU, Stochastic Simulation, Multiple Replications In Parallel (MRIP), Aspect Oriented Programming (AOP), [INFO.INFO-DC]Computer Science [cs]/Distributed, Parallel, and Cluster Computing [cs.DC], [INFO.INFO-MO]Computer Science [cs]/Modeling and Simulation
Relation: hal-01099208; https://inria.hal.science/hal-01099208; https://inria.hal.science/hal-01099208/document; https://inria.hal.science/hal-01099208/file/ijcaet2013_frree.pdf
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20
المؤلفون: Kuo-Ning Chiang, Sunil Kumar Panigrahy, Bo-Ruei Lai, Yi-Chieh Tseng
المصدر: Materials
Materials, Vol 14, Iss 5342, p 5342 (2021)مصطلحات موضوعية: Technology, SVR, Computer science, KRR, KNN, Electronic packaging, CPU time, Review, FEM simulation, RNN, WLP, General Materials Science, Reliability (statistics), Microscopy, QC120-168.85, regression model, Artificial neural network, QH201-278.5, Engineering (General). Civil engineering (General), Chip, TK1-9971, Reliability engineering, Random forest, Support vector machine, Recurrent neural network, machine learning, Descriptive and experimental mechanics, AI, RF, Electrical engineering. Electronics. Nuclear engineering, TA1-2040, ANN
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