يعرض 1 - 20 نتائج من 41 نتيجة بحث عن '"Void Defect"', وقت الاستعلام: 0.50s تنقيح النتائج
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    Academic Journal
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    Academic Journal

    المصدر: Medicina (Lithuania)

    Relation: Zhelev, Daniel, Hristov, Stoyan, Zderic, Ivan, Ivanov, Stoyan, Visscher, Luke, Baltov, Asen, Ribagin, Simeon, Stoffel, Karl, Kralinger, Franz, Winkler, Jörg, Richards, R. Geoff, Varga, Peter, & Gueorguiev, Boyko (2023) Treatment of Metaphyseal Defects in Plated Proximal Humerus Fractures with a New Augmentation Technique - A Biomechanical Cadaveric Study. Medicina (Lithuania), 59(9), Article number: 1604.; https://eprints.qut.edu.au/254191/; Faculty of Engineering; School of Mechanical, Medical & Process Engineering

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    Academic Journal

    المساهمون: School of Materials Science and Engineering, School of Electrical and Electronic Engineering, SP Group – NTU Joint Laboratory

    مصطلحات موضوعية: Engineering::Materials, Epoxy Resin, Void Defect

    وصف الملف: application/pdf

    Relation: EMA-EP010-SNJL-002; Polymer Degradation and Stability; Deng, Y., Wang, Q., Ma, J., Oh, J. T. & Chen, Z. (2023). The combined impact of voids and thermal aging on the mechanical reliability of epoxy resin evaluated by statistical analysis. Polymer Degradation and Stability, 215, 110455-. https://dx.doi.org/10.1016/j.polymdegradstab.2023.110455; https://hdl.handle.net/10356/170904; 2-s2.0-85163849532; 215; 110455

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    Academic Journal
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    Academic Journal

    المساهمون: School of Mechanical and Aerospace Engineering, HP-NTU Digital Manufacturing Corporate Lab

    Relation: I1801E0028; International Journal of Plasticity; Chen, K., Teo, B. H. W., Rao, W., Kang, G., Zhou, K., Zeng, J. & Du, H. (2021). Experimental and modeling investigation on the viscoelastic-viscoplastic deformation of polyamide 12 printed by multi jet fusion. International Journal of Plasticity, 143, 103029-. https://dx.doi.org/10.1016/j.ijplas.2021.103029; https://hdl.handle.net/10356/160583; 143; 103029

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    Academic Journal

    المؤلفون: Takao ABE, 阿部 孝夫

    المصدر: 応用物理 / Oyo Buturi. 2007, 76(8):927

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    Academic Journal
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    Conference

    المساهمون: Alimenti, Federico, M., Impronta, Palazzari, Valeria, Placidi, Pisana, Stopponi, Giovanni, Scorzoni, Andrea, Roselli, Luca

    مصطلحات موضوعية: FDTD method, void defect, VLSI CMOS interconnections

    Relation: ispartofbook:Proceedings of the XXVII Assemblée Générale de l'Union Radio-Scientifique Internationale (URSI); XXVII Assemblée Générale de l'Union Radio-Scientifique Internationale (URSI); firstpage:AD.P.1; http://hdl.handle.net/11391/157888; http://www.ursi.org/en/general_assemblies_proceedings.asp