المؤلفون: Surya Bhattacharya, Jong Ming Chinq, Sharon Lim Pei Siang, Vivek Chidambaram Nachiappan, Wang Xiangyu, J. Jayabalan

المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: 010302 applied physics, Computer science, Digital-to-analog converter, Three-dimensional integrated circuit, Hardware_PERFORMANCEANDRELIABILITY, 02 engineering and technology, Integrated circuit design, 021001 nanoscience & nanotechnology, 01 natural sciences, Die (integrated circuit), law.invention, CMOS, law, 0103 physical sciences, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Miniaturization, Interposer, Power Management Unit, 0210 nano-technology

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d2b2c0e34891169f49ef5b5552c528fe
https://doi.org/10.1109/ectc.2019.00094

المؤلفون: Vivek Chidambaram Nachiappan, Clare Guanqi Huang, Chee Lip Gan, Chee Cheong Wong, Riko I Made, Chen Zhong, Eric Jian Rong Phua, Key Wen Tan, Hock Guan Ong, Wei Chuan Ong

المصدر: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:000207-000212

مصطلحات موضوعية: Interconnection, Materials science, Argon, business.industry, Metallurgy, Refractory metals, chemistry.chemical_element, Metal, chemistry, Electrical resistance and conductance, visual_art, Physical vapor deposition, visual_art.visual_art_medium, Forensic engineering, Microelectronics, Pharmacology (medical), Ceramic, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5cdd3741f49559c66d5d415d8209ba66
https://doi.org/10.4071/hiten-wa11

المؤلفون: Christoph Oetzel, Sunil Wickramanayaka, Leong Ching Wai, Vivek Chidambaram Nachiappan

المصدر: 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).

مصطلحات موضوعية: Materials science, Silicon, Reflow oven, 020208 electrical & electronic engineering, Metallurgy, Oxide, chemistry.chemical_element, 02 engineering and technology, Substrate (electronics), 021001 nanoscience & nanotechnology, chemistry.chemical_compound, chemistry, Soldering, 0202 electrical engineering, electronic engineering, information engineering, Wafer, Helium mass spectrometer, 0210 nano-technology, Helium

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0d9c3da790831eb9384b291cc9cce332
https://doi.org/10.1109/eptc.2016.7861438

المؤلفون: Chen Zhong, Wahyuaji Narotyama Putra, Wong Chee Cheong, I Made Riko, Eric Phua Jian Rong, Lim Ju Dy, Lau Fu Long, Lim Jun Zhang, Gan Chee Lip, Vivek Chidambaram Nachiappan

المصدر: 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).

مصطلحات موضوعية: Interconnection, Grain growth, Reliability (semiconductor), Materials science, business.industry, Electrical resistivity and conductivity, Metallurgy, Microelectronics, Grain boundary, business, Saturation (magnetic), Eutectic system

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::07f54b1f7fb0b40bddc258a9e59635b6
https://doi.org/10.1109/eptc.2012.6507045