المؤلفون: Soulié, Jean-Philippe, Sankaran, Kiroubanand, Van Troeye, Benoit, Leśniewska, Alicja, Varela Pedreira, Olalla, Oprins, Herman, Delie, Gilles, Fleischmann, Claudia, Boakes, Lizzie, Rolin, Cédric, Ragnarsson, Lars-Åke, Croes, Kristof, Park, Seongho, Swerts, Johan, Pourtois, Geoffrey, Tőkei, Zsolt, Adelmann, Christoph

المصدر: Journal of Applied Physics; 11/7/2024, Vol. 136 Issue 17, p1-34, 34p

مصطلحات موضوعية: COPPER, LINE drivers (Integrated circuits), TRANSISTORS, METALS, PREPAREDNESS

المؤلفون: Varela Pedreira, Olalla, Leśniewska, Alicja, Jourdan, Nicolas, Vega Gonzalez, Victor, Lariviere, Stephane, van der Veen, Marleen, Croes, Kristof, Tőkei, Zsolt

المصدر: 2019 IEEE International Interconnect Technology Conference, Brussels, Belgium, June 2019

مصطلحات موضوعية: Interconnect, Electromigration, TDDB

Relation: https://doi.org/10.5281/zenodo.10968895; https://doi.org/10.5281/zenodo.10968896; oai:zenodo.org:10968896

الاتاحة: https://doi.org/10.5281/zenodo.10968896

المؤلفون: Lofrano, Melina, Varela Pedreira, Olalla, Croes, Kristof, Tokei, Zsolt

المصدر: IITC, International Interconnect Technology Conference, Brussels, Belgium, 4-6 June 2019

Relation: https://doi.org/10.5281/zenodo.11184491; https://doi.org/10.5281/zenodo.11184492; oai:zenodo.org:11184492

الاتاحة: https://doi.org/10.5281/zenodo.11184492

المؤلفون: Varela Pedreira, Olalla, Zahedmanesh, Houman, Ding, Youqi, Ciofi, Ivan, Croes, Kristof

المصدر: Proceedings of the 2023 International Symposium on Physical Design

الاتاحة: http://dx.doi.org/10.1145/3569052.3578909
https://dl.acm.org/doi/pdf/10.1145/3569052.3578909

المؤلفون: Zahedmanesh, Houman¹, Varela Pedreira, Olalla¹, Tőkei, Zsolt¹, Croes, Kristof¹

المصدر: Journal of Applied Physics. 8/7/2019, Vol. 126 Issue 5, pN.PAG-N.PAG. 11p. 5 Diagrams, 1 Chart, 5 Graphs.

مصطلحات موضوعية: *ELECTRODIFFUSION, *NUCLEATION, *HIGH temperatures, *DISCONTINUOUS precipitation

المؤلفون: Beyne, Sofie, Croes, Kristof, Van der Veen, Marleen H., Varela Pedreira, Olalla, Qi, Qin, De Wolf, Ingrid, Tőkei, Zsolt

مصطلحات موضوعية: 1/f noise, copper, electromigration, noise measurement, interconnects, activation energy, barriers, liners

Relation: 2017 IEEE International Interconnect Technology Conference (IITC) pages:1-3; 2017 IEEE International Interconnect Technology Conference (IITC) edition:20 location:Hsinchu, Taiwan date:16-18 May 2017; https://lirias.kuleuven.be/handle/123456789/601125; https://lirias.kuleuven.be/bitstream/123456789/601125/2//pub08453.pdf

الاتاحة: https://lirias.kuleuven.be/handle/123456789/601125
https://doi.org/10.1109/IITC-AMC.2017.7968946
https://lirias.kuleuven.be/bitstream/123456789/601125/2//pub08453.pdf

المؤلفون: Wen, Liang Gong, Adelmann, Christoph, Varela Pedreira, Olalla, Dutta, Shibesh, Popovici, Mihaela Ioana, Briggs, Basoene, Heylen, Nancy, Vanstreels, Kris, Wilson, Chris, Van Elshocht, Sven, Croes, Kristof, Bommels, Juergen, Tokei, Zsolt

Relation: IEEE International Interconnect Technology Conference / Advanced Metallization Conference - IITC/AMC pages:34-36; IEEE International Interconnect Technology Conference / Advanced Metallization Conference - IITC/AMC location:San Jose, CA USA date:2016-05-23; https://lirias.kuleuven.be/handle/123456789/566079; C33682

الاتاحة: https://lirias.kuleuven.be/handle/123456789/566079

المؤلفون: Tokei, Zsolt, Ciofi, Ivan, Roussel, Philippe, Debacker, Peter, Raghavan, Praveen, van der Veen, Marleen, Jourdan, Nicolas, Wilson, Chris, Vega Gonzalez, Victor, Adelmann, Christoph, Wen, Liang Gong, Croes, Kristof, Varela Pedreira, Olalla, Moors, Kristof, Krishtab, Mikhail, Armini, Silvia, Boemmels, Juergen

Relation: Symposium on VLSI Technology pages:181-182; Symposium on VLSI Technology location:Honolulu, HI USA date:2016-06-13; https://lirias.kuleuven.be/handle/123456789/565997; C33931

الاتاحة: https://lirias.kuleuven.be/handle/123456789/565997

المؤلفون: de Marneffe, Jean-Francois, Zhang, Liping, Rutigliani, Vito, Noya, G, Cao, Yi, Lesniewska, Alicja, Varela Pedreira, Olalla, Croes, Kristof, Gillot, Christophe, Tokei, Zsolt, Boemmels, Juergen, Baklanov, Mikhaïl

Relation: IEEE International Interconnect Technology Conference - IITC / Materials for Advanced Metallization Conference - MAM pages:91-94; IEEE International Interconnect Technology Conference - IITC / Materials for Advanced Metallization Conference - MAM location:Grenoble France date:2015-05-18; https://lirias.kuleuven.be/handle/123456789/524583; C31514

الاتاحة: https://lirias.kuleuven.be/handle/123456789/524583

المؤلفون: De Messemaeker, Joke, Varela Pedreira, Olalla, Moussa, Alain, Nabiollahi, Nabi, Vanstreels, Kris, Van Huylenbroeck, Stefaan, Philipsen, Harold, Verdonck, Patrick, Vandevelde, Bart, De Wolf, Ingrid, Beyne, Eric, Croes, Kristof

وصف الملف: 1698676 bytes; application/pdf

Relation: Proc. IEEE, IRPS 2015, International Reliability Physics Symposium pages:1-10; IEEE International Reliability Physics Symposium - IRPS location:Monterey CA, USA date:2015-04-19; https://lirias.kuleuven.be/handle/123456789/524959; C31218; https://lirias.kuleuven.be/bitstream/123456789/524959/1//pub07681.pdf

الاتاحة: https://lirias.kuleuven.be/handle/123456789/524959
https://lirias.kuleuven.be/bitstream/123456789/524959/1//pub07681.pdf

المؤلفون: Wen, Liang Gong, Roussel, Philippe, Varela Pedreira, Olalla, Briggs, Basoene, Groven, Benjamin, Dutta, Shibesh, Popovici, Mihaela Ioana, Heylen, Nancy, Ciofi, Ivan, Vanstreels, Kris, Osterberg, Frederik, Hansen, Ole, Petersen, Dirch H, Opsomer, Karl, Detavernie, Christophe, Wilson, Chris, Van Elshocht, Sven, Croes, Kristof, Bommels, Jurgen, Tokei, Zsolt, Adelmann, Christoph

Relation: ACS Applied Materials and Interfaces vol:8 issue:39 pages:26119-26125; https://lirias.kuleuven.be/handle/123456789/566246; P34850

الاتاحة: https://lirias.kuleuven.be/handle/123456789/566246

المؤلفون: Bose, Ankit, Vijayaraghavan, Rajani K., Cowley, Aidan, Cherman, Vladimir, Varela Pedreira, Olalla, Tanner, Brian K., Danilewsky, Andreas, Wolf, Ingrid de, McNally, Patrick J.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. - 6, 4 (2016) , 653-662, ISSN: 2156-3950

Relation: https://freidok.uni-freiburg.de/data/129631

الاتاحة: https://freidok.uni-freiburg.de/data/129631
https://doi.org/10.1109/tcpmt.2016.2527060

المؤلفون: Croes, Kristof, De Messemaeker, Joke, Li, Yunlong, Guo, Wei, Varela Pedreira, Olalla, Cherman, Vladimir, Stucchi, Michele, De Wolf, Ingrid, Beyne, Eric

المصدر: IEEE Design & Test ; volume 33, issue 3, page 37-45 ; ISSN 2168-2356 2168-2364

الاتاحة: http://dx.doi.org/10.1109/mdat.2015.2501302
http://xplorestaging.ieee.org/ielx7/6221038/7462312/07329942.pdf?arnumber=7329942

المؤلفون: De Messemaeker, Joke, Varela Pedreira, Olalla, Philipsen, Harold, Beyne, Eric, De Wolf, Ingrid, Van der Donck, Tom, Croes, Kristof

Relation: IEEE Electronic Components and Technology Conference pages:613-619; IEEE Electronic Components and Technology Conference location:Lake Buena Vista USA date:2014-05-27; https://lirias.kuleuven.be/handle/123456789/477765; C27992

الاتاحة: https://lirias.kuleuven.be/handle/123456789/477765

المؤلفون: De Wolf, Ingrid, Czarnecki, Piotr, De Coster, Jeroen, Varela Pedreira, Olalla, Rottenberg, Xavier, Sangameswaran, Sandeep

Relation: Handbook of MEMS for Wireless and Mobile Applications pages:291-342; P28770; https://lirias.kuleuven.be/handle/123456789/433690

الاتاحة: https://lirias.kuleuven.be/handle/123456789/433690

المؤلفون: Wu, Chen, Li, Yunlong, Lesniewska, Alicja, Varela Pedreira, Olalla, de Marneffe, Jean-Francois, Ciofi, Ivan, Verdonck, Patrick, Baklanov, Mikhaïl, Boemmels, Juergen, De Wolf, Ingrid, Tokei, Zsolt, Croes, Kristof

وصف الملف: 3313717 bytes; application/pdf

Relation: Journal of Applied Physics vol:118 pages:1-10; https://lirias.kuleuven.be/handle/123456789/524591; P32237; https://lirias.kuleuven.be/bitstream/123456789/524591/1//pub07683.pdf

الاتاحة: https://lirias.kuleuven.be/handle/123456789/524591
https://lirias.kuleuven.be/bitstream/123456789/524591/1//pub07683.pdf

المؤلفون: De Wolf, Ingrid, De Coster, Jeroen, Cherman, Vladimir, Czarnecki, Piotr, Kalicinski, Stanislaw, Varela Pedreira, Olalla, Sangameswaran, Sandeep, Vanstreels, Kris

Relation: Proceedings of SPIE Europe Microtechnologies for the New Millennium pages:73620N; SPIE Europe Microtechnologies for the New Millennium location:Dresden Germany date:4-mei-2009; https://lirias.kuleuven.be/handle/123456789/304178; C18397

الاتاحة: https://lirias.kuleuven.be/handle/123456789/304178

المؤلفون: De Wolf, Ingrid, De Coster, Jeroen, Varela Pedreira, Olalla, Haspeslagh, Luc, Witvrouw, Ann

مصطلحات موضوعية: MEMS, test

Relation: Proc. ISTC/CSTIC 2009, International Semiconductor Technology Conference and China Semiconductor Technology International Conference pages:199-204; ISTC/CSTIC 2009, International Semiconductor Technology Conference and China Semiconductor Technology International Conference edition:7 location:Shanghai, China date:March 19-20 2009; https://lirias.kuleuven.be/handle/123456789/289004

الاتاحة: https://lirias.kuleuven.be/handle/123456789/289004

المؤلفون: De Wolf, Ingrid, De Coster, Jeroen, Varela Pedreira, Olalla, Haspeslagh, Luc, Witvrouw, Ann

Relation: Proceedings of the 7th IEEE Conference on Sensors pages:144-147; 7th IEEE Conference on Sensors location:Lecce, Italy date:Oct 26-29 2008; https://lirias.kuleuven.be/handle/123456789/304153; C16444

الاتاحة: https://lirias.kuleuven.be/handle/123456789/304153

المؤلفون: Haspeslagh, Luc, De Coster, Jeroen, Varela Pedreira, Olalla, De Wolf, Ingrid, Du Bois, Bert, Verbist, Agnes, Van Hoof, Rita, Willegems, Myriam, Locorotondo, Sabrina, Bryce, George, Vaes, Jan, van Drieenhuizen, Bert, Witvrouw, Ann

Relation: Proc Technical Digest International Electron Devices Meeting - IEDM pages:655-658; Technical Digest International Electron Devices Meeting - IEDM location:San Fransisco, CA USA date:Dec 15-17 2008; https://lirias.kuleuven.be/handle/123456789/303820; C16644

الاتاحة: https://lirias.kuleuven.be/handle/123456789/303820