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1Academic Journal
المؤلفون: Beyne, Eric, Van Hoof, Rita, Webers, Tomas, Brebels, Steven, Rossi, Stéphanie, Lechleiter, François, Di Ianni, Marianna, Ostmann, Andreas
المصدر: Microelectronics International: An International Journal, 2001, Vol. 18, Issue 3, pp. 36-42.
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2Academic Journal
المؤلفون: Pinel, Stèphane, Marty, Antoine, Tasselli, Josiane, Bailbe, Jean-Pierre, Beyne, Eric, Van Hoof, Rita, Marco Colás, Santiago, Morante i Lleonart, Joan Ramon, Vendier, Olivier, Huan, Marc
المصدر: Articles publicats en revistes (Enginyeria Electrònica i Biomèdica)
مصطلحات موضوعية: Anàlisi tèrmica, Administració, Finite element analysis, Thermal conductivity, Thermal management (packaging)
وصف الملف: 10 p.; application/pdf
Relation: Reproducció del document publicat a http://dx.doi.org/10.1109/TCAPT.2002.1010013; IEEE Transactions on Components Packaging and Technologies, 2002, vol. 25, núm. 2, p. 244-253.; http://dx.doi.org/10.1109/TCAPT.2002.1010013; http://hdl.handle.net/2445/8724; 505014
الاتاحة: http://hdl.handle.net/2445/8724
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3
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4Academic Journal
المؤلفون: Leseduarte Cuevas, Sergio, Marco Colás, Santiago, Beyne, Eric, Van Hoof, Rita, Marty, Antoine, Pinel, Stèphane, Vendier, Olivier, Coello-Vera, Augustín
المصدر: Articles publicats en revistes (Enginyeria Electrònica i Biomèdica)
مصطلحات موضوعية: Delamination, Finite element analysis, Integrated circuit design, Integrated circuit interconnections, Integrated circuit packaging, Thermal stresses, Circuits integrals
وصف الملف: 7 p.; application/pdf
Relation: Reproducció del document publicat a http://dx.doi.org/10.1109/6144.888852; IEEE Transactions on Components Packaging and Manufacturing Technology Part A, 2000, vol. 23, núm. 4, p. 673-679.; http://dx.doi.org/10.1109/6144.888852; http://hdl.handle.net/2445/8692; 154101
الاتاحة: http://hdl.handle.net/2445/8692
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5
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6Conference
المؤلفون: Malak, Maurine, Claes, Tom, Garcia-Munoz, Victor, Tyagi, Hemant Kumar, Van Hoof, Rita, Winderickx, Gillis, Severi, Simone, Lee, Woochang, Kim, Dongho, Ahn, Sungmo, Van Dorpe, Pol, Rottenberg, Xavier, Peumans, Peter, Tilmans, Harrie A.C.
المصدر: 2018 IEEE Micro Electro Mechanical Systems (MEMS) ; page 735-738
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7Conference
المؤلفون: Witvrouw, Ann, Van Hoof, Rita, Bryce, George, Du Bois, Bert, Verbist, Agnes, Severi, Simone, Haspeslagh, Luc, Osman, Haris, De Coster, Jeroen, Wen, Lianggong, Puers, Bob, Beernaert, Roel, De Smet, Herbert, Rudra, Sukumar, Van Thourhout, Dries
Relation: ECS Transactions vol:33 issue:6 pages:799-812; 218th ECS Meeting location:Las Vegas, USA date:Oct 10-15 2010; https://lirias.kuleuven.be/handle/123456789/303084; C20695
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8ConferenceA novel gap narrowing process for creating high aspect ratio transduction gaps for MEM HF resonators
المؤلفون: Stoffels, Steve, Bryce, George, Van Hoof, Rita, Du Bois, Bert, Mertens, Robert, Puers, Bob, Tilmans, Harrie, Witvrouw, Ann
Relation: Materials Research Society Symposium Proceedings; MRS Proceedings vol:1139; Microelectromechanical Systems‚ - Materials and Devices II location:Boston, MA USA date:Dec 1-5 2008; https://lirias.kuleuven.be/handle/123456789/303485; C18772
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9Conference
المؤلفون: Haspeslagh, Luc, De Coster, Jeroen, Pedreira, Olalla Varela, De Wolf, Ingrid, Du Bois, Bert, Verbist, Agnes, Van Hoof, Rita, Willegems, Myriam, Locorotondo, Sabrina, Bryce, George, Vaes, Jan, van Drieenhuizen, Bert, Witvrouw, Ann
المصدر: 2008 IEEE International Electron Devices Meeting ; page 1-4
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10Conference
المؤلفون: Bryce, George, Severi, Simone, Du Bois, Bert, Willegems, Myriam, Claes, Gert, Van Hoof, Rita, Haspeslagh, Luc, Decoutere, Stefaan, Witvrouw, Ann
Relation: 214th ECS Meeting location:Honolulu, HI USA date:Oct 12-17 2008; https://lirias.kuleuven.be/handle/123456789/304048; C17122
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11Conference
المؤلفون: Lenci, Silvia, Gonzalez, Pilar, De Meyer, Kristin, Van Hoof, Rita, Frederickx, Danny, Witvrouw, Ann
Relation: Proceedings of the 21st IEEE International Conference on Micro Electro Mechnical Systems - MEMS pages:427-430; 21st IEEE International Conference on Micro Electro Mechnical Systems - MEMS location:Tucson, AZ USA date:Jan 13-17 2008; https://lirias.kuleuven.be/handle/123456789/304521; C15959
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12Conference
المؤلفون: Claes, Gert, Van Hoof, Rita, Du Bois, Bert, Van Barel, Greg, Stoffels, Steve, Decoutere, Stefaan, Nguyen, V, Hentz, S, Robert, P, Celis, Jean-Pierre, Witvrouw, Ann
Relation: Proceedings of Eurosensors XXII pages:831-834; Eurosensors XXII location:Dresden, Germany date:Sept 7-10 2008; https://lirias.kuleuven.be/handle/123456789/303430; C16375
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13Academic Journal
المؤلفون: El-Rifai, Joumana, Sedky, Sherif, Van Hoof, Rita, Severi, Simone, Lin, Dennis, Sangameswaran, Sandeep, Puers, Robert, Van Hoof, Chris, Witvrouw, Ann
المصدر: Sensors and Actuators A: Physical ; volume 188, page 230-239 ; ISSN 0924-4247
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14Conference
المؤلفون: Pinel, Stephane, Tasselli, Josiane, Marty, Antoine, Bailbe, Jean-Pierre, Beyne, Eric, Van Hoof, Rita, Marco, Santiago, Leseduarte, Sergio, Vendier, Olivier, Coello-Vera, Augustin
المساهمون: Courtois, Bernard, Crary, Selden B., Gabriel, Kaigham J., Karam, Jean Michel, Markus, Karen W., Tay, Andrew A. O.
المصدر: SPIE Proceedings ; Design, Test, Integration, and Packaging of MEMS/MOEMS ; ISSN 0277-786X
الاتاحة: http://dx.doi.org/10.1117/12.382262
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15Conference
المؤلفون: Puigcorbe, J., Leseduarte, Sergio, Marco, Santiago, Beyne, Eric, Van Hoof, Rita, Marty, Antoine, Pinel, Stephane, Vendier, Olivier, Coello-Vera, Augustin
المساهمون: Courtois, Bernard, Crary, Selden B., Gabriel, Kaigham J., Karam, Jean Michel, Markus, Karen W., Tay, Andrew A. O.
المصدر: SPIE Proceedings ; Design, Test, Integration, and Packaging of MEMS/MOEMS ; ISSN 0277-786X
الاتاحة: http://dx.doi.org/10.1117/12.382329
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16Academic Journal
المؤلفون: Van Hoof, Rita, Bryce, George, Claes, Gert, Witvrouw, Ann, Severi, Simone
Relation: Microelectronic Engineering vol:88 issue:8 pages:2420-2423; https://lirias.kuleuven.be/handle/123456789/334796; P21473
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17Academic Journal
المؤلفون: El Rifai, Joumana, Sedky, Sherif, Van Hoof, Rita, Severi, Simone, Lin, Dennis, Puers, Bob, Van Hoof, Chris, Witvrouw, Ann
Relation: Sensors and Actuators A, Physical vol:188 pages:230-239; 16th International Conference on Solid-State Sensors, Actuators and Microsystems - TRANSDUCERS location:Beijing China date:06/05/2011; https://lirias.kuleuven.be/handle/123456789/334820; C22461
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18Academic Journal
المؤلفون: Guo, Bin, Severi, Simone, Bryce, George, Claes, Gert, Van Hoof, Rita, Du Bois, Bert, Haspeslagh, Luc, Witvrouw, Ann, Decoutere, Stefaan
مصطلحات موضوعية: boron, crystallisation, electrical resistivity, ge-si alloys, micromechanical devices, plasma cvd, semiconductor doping, semiconductor materials, semiconductor thin films, transmission electron microscopy, x-ray diffraction, chemical-vapor-deposition, microcrystalline silicon, amorphous-silicon, rf discharges, poly-sige, films, plasma, growth, parameters, pressure
وصف الملف: 381347 bytes; application/pdf
Relation: Journal of the electrochemical society vol:157 issue:2 pages:D103-D110; https://lirias.kuleuven.be/handle/123456789/272966; https://lirias.kuleuven.be/bitstream/123456789/272966/1//pub05350.pdf
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19Academic Journal
المؤلفون: Stoffels, Steve, Autizi, Enrico, Van Hoof, Rita, Severi, Simone, Puers, Bob, Witvrouw, Ann, Tilmans, Harrie
Relation: Journal of Applied Physics vol:108 issue:8; https://lirias.kuleuven.be/handle/123456789/304223; P21474
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20Academic Journal
المؤلفون: Van Barel, Gregory, Du Bois, Bert, Van Hoof, Rita, De Wachter, Jef, De Ceuninck, Ward, Witvrouw, Ann
Relation: JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 20 5); http://hdl.handle.net/1942/11047; 20; 000277305000034
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