المؤلفون: Yunhyeok Im, Hyungyung Jo, Chigwan Oh, Young-Sang Cho, Jongkyu Yoo, Heeseok Lee, Myunghoon Lee, Vamsi Krishna Yaddanapudi

المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b0afb7564d04c7dc6134160952bce475
https://doi.org/10.1109/itherm54085.2022.9899553

المؤلفون: Heeseok Lee, Myunghoon Lee, Jongkyu Yoo, Young-Sang Cho, Hoi-Jin Lee, Taekeun An, Yunhyeok Im, Youngmin Shin, Vamsi Krishna Yaddanapudi, Wook Kim

المصدر: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

مصطلحات موضوعية: Temperature control, Computer science, Thermal resistance, 020208 electrical & electronic engineering, Hot spot (veterinary medicine), Hardware_PERFORMANCEANDRELIABILITY, 02 engineering and technology, Chip, 020202 computer hardware & architecture, Power (physics), Controllability, Reliability (semiconductor), Control theory, Hardware_INTEGRATEDCIRCUITS, 0202 electrical engineering, electronic engineering, information engineering, Observability

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8c5e1829974d51305fa834b198cc2ade
https://doi.org/10.1109/itherm45881.2020.9190609

المؤلفون: Vamsi Krishna Yaddanapudi, Rajiv Lochan Rath, Rohith Gandhi, Sivasubramani Krishnaswamy

المصدر: 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).

مصطلحات موضوعية: Stress (mechanics), Printed circuit board, Engineering, Reflow oven, business.industry, Soldering, Semiconductor device modeling, Electronic engineering, Mechanical engineering, Electronics, business, Finite element method, TRACE (psycholinguistics)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1d35d857982e2b3e33ac3789acc76188
https://doi.org/10.1109/eptc.2015.7412355

المؤلفون: Manoj Nagulapally, Vamsi Krishna Yaddanapudi, Desmond Tan, Aniket Abhay Kulkarni, Ankit Adhiya

المصدر: 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).

مصطلحات موضوعية: Engineering, business.industry, Computational fluid dynamics, Chip, Finite element method, Superposition principle, Electronics, business, computer, Simulation, Delphi, Network model, Block (data storage), computer.programming_language

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f2cbaeb28edc5fd4c7026c587ea3dbdd
https://doi.org/10.1109/eptc.2015.7412368