المؤلفون: Peng-Chieh Shen, Tsung-Fu Tsai, Yi-Jing Lai, Tzu-Li Liu, Chau Yee Ng

المصدر: Dermatologica Sinica, Vol 41, Iss 3, Pp 133-144 (2023)

مصطلحات موضوعية: diagnosis, emerging treatment, vitiligo, Dermatology, RL1-803

وصف الملف: electronic resource

Relation: http://www.dermsinica.org/article.asp?issn=1027-8117;year=2023;volume=41;issue=3;spage=133;epage=144;aulast=Shen; https://doaj.org/toc/1027-8117; https://doaj.org/toc/2223-330X

URL الوصول: https://doaj.org/article/18bcd4187d4c4292ae9a4b447464ec02

المؤلفون: Rosalie Tzu-Li Liu, Tsung-Fu Tsai, Yi-Jing Lai, Chau Yee Ng

المصدر: Dermatologica Sinica, Vol 41, Iss 4, Pp 222-230 (2023)

مصطلحات موضوعية: cysteamine, isobionicamide, optical coherence tomography, postinflammatory hyperpigmentation research square preprints: https://doi.org/10.21203/rs.3.rs-2628737/v1, Dermatology, RL1-803

وصف الملف: electronic resource

Relation: http://www.dermsinica.org/article.asp?issn=1027-8117;year=2023;volume=41;issue=4;spage=222;epage=230;aulast=Liu; https://doaj.org/toc/1027-8117; https://doaj.org/toc/2223-330X

URL الوصول: https://doaj.org/article/b3d0867e3ae142d79d5be07366be51ab

المؤلفون: Tsung-Fu Tsai, Mei-Yun Chang, Yen-Ting Yeh, Hai-Yen Hsia, Chien-Hung Gow

المصدر: Heliyon, Vol 9, Iss 6, Pp e17317- (2023)

مصطلحات موضوعية: Acute myocardial infarction, Non-obstructive coronary arteries, Non-ST-Segment elevation myocardial infarction, Thymoma, Science (General), Q1-390, Social sciences (General), H1-99

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2405844023045255; https://doaj.org/toc/2405-8440

URL الوصول: https://doaj.org/article/1456dd50491e444f9051586ea3a63479

المؤلفون: Tsung-Fu Tsai, Chau Yee Ng

المصدر: Dermatologica Sinica, Vol 40, Iss 4, Pp 255-256 (2022)

مصطلحات موضوعية: Dermatology, RL1-803

وصف الملف: electronic resource

Relation: http://www.dermsinica.org/article.asp?issn=1027-8117;year=2022;volume=40;issue=4;spage=255;epage=256;aulast=Tsai; https://doaj.org/toc/1027-8117; https://doaj.org/toc/2223-330X

URL الوصول: https://doaj.org/article/82e761e1c8014df7a191dce2ae7d1a8b

المؤلفون: Tsung-Fu Tsai, 蔡宗甫

Thesis Advisors: 陳聖賢

وصف الملف: 32

الاتاحة: http://ndltd.ncl.edu.tw/handle/70796053346748511704

المؤلفون: Tsung-Fu Tsai, 蔡宗甫

Thesis Advisors: Ping-Shou Cheng, 鄭平守

وصف الملف: 126

الاتاحة: http://ndltd.ncl.edu.tw/handle/25179690091779364405

المؤلفون: Tsung-Fu Tsai, 蔡宗富

Thesis Advisors: Chin-Wen Chuang, 莊景文

وصف الملف: 31

الاتاحة: http://ndltd.ncl.edu.tw/handle/17631712986815131856

المؤلفون: Tsung-Fu Tsai, 蔡宗富

Thesis Advisors: Mei-Ching Huang, Shih-Jie Fang, 黃美卿, 方世杰

وصف الملف: 118

الاتاحة: http://ndltd.ncl.edu.tw/handle/05919115772180916239

المؤلفون: Tsung‐Fu Tsai, Chau Yee Ng

المصدر: The Journal of Dermatology.

مصطلحات موضوعية: Dermatology, General Medicine

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::038a63c1f1cebf5f67ab9ab80c198f39
https://doi.org/10.1111/1346-8138.16799

المؤلفون: Tzu-Li Liu, Tsung-Fu Tsai, Yi-Jing Lai, Chau Yee Ng

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::67f89090f13506cf45b54fcf8f35821f
https://doi.org/10.21203/rs.3.rs-2628737/v1

المؤلفون: Jui-Lin Liang, Ming-Hsien Tsai, Yi-Chun Hsieh, Huei-Syuan Liu, Shao-Wei Chen, Yung-Yun Huang, Li-Ching Lin, Tsung-Fu Tsai, Yun-Fang Liang, Wen-Li Hsu

المصدر: Oncology Letters. 25

مصطلحات موضوعية: Cancer Research, Oncology

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::de3c40b7ca8340cc67d2c50617d055bf
https://doi.org/10.3892/ol.2023.13678

المؤلفون: Tsung Fu Tsai, Mei Yun Chang, Hai Yen Hsia, Chien-Hung Gow

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::82fc3ac6cf55584c5a2f901ee856ef0c
https://doi.org/10.2139/ssrn.4349366

المؤلفون: Tsung-Fu Tsai, 蔡宗甫

Thesis Advisors: Hong-Yang Lu, 盧宏陽

وصف الملف: 78

الاتاحة: http://ndltd.ncl.edu.tw/handle/94400136381999825509

المؤلفون: Yi‐Chun Hsieh, Chu-Huang Chen, Ching-Ying Wu, Jennifer S. Kahle, Jui-Lin Liang, Jian-He Lu, Tohru Yoshioka, Yung‐Yun Huang, Ming-Hsien Tsai, Wen‐Li Hsu, Chia-Jung Yen, Chen Tung Yen, Tsung‐Fu Tsai, Li‐Ching Lin, Hsin-Su Yu

المصدر: Aging Cell

مصطلحات موضوعية: 0301 basic medicine, Genome instability, Keratinocytes, p53, DNA damage, Carcinogenesis, Ultraviolet Rays, TRPC7, Biology, ultraviolet pathology, medicine.disease_cause, Skin Aging, 03 medical and health sciences, Transient receptor potential channel, Mice, 0302 clinical medicine, medicine, Animals, Humans, skin and connective tissue diseases, tumor initiator gene, TRPC Cation Channels, Mice, Knockout, integumentary system, aging, Cell Biology, Original Articles, Cell biology, tumorigenesis, 030104 developmental biology, Knockout mouse, Original Article, Cell aging, 030217 neurology & neurosurgery, Intracellular

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8615ca5ced78535d6d9e71b2d08d9b2b
https://pubmed.ncbi.nlm.nih.gov/31755176

المؤلفون: Tsung-Fu Tsai, Ru-Yuan Yang, Hong-Yang Lu, Ming-Hong Lin

المصدر: Materials Science and Engineering: A. 372:56-65

مصطلحات موضوعية: Materials science, Argon, Annealing (metallurgy), Mechanical Engineering, Superlattice, chemistry.chemical_element, Condensed Matter Physics, Microstructure, Dark field microscopy, Crystallography, Electron diffraction, chemistry, Mechanics of Materials, Transmission electron microscopy, General Materials Science, Selected area diffraction

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::266e6ac80df0f8c3bdab2162279cbcd0
https://doi.org/10.1016/j.msea.2003.09.091

المؤلفون: Larry Lin, Jyun-lin Wu, Larry Chen, Tung-Chin Yeh, Gary Lu, An-Tai Xu, Tsung-Fu Tsai

المصدر: 2013 IEEE 63rd Electronic Components and Technology Conference.

مصطلحات موضوعية: Engineering, business.industry, Copper interconnect, Three-dimensional integrated circuit, Hardware_PERFORMANCEANDRELIABILITY, Temperature cycling, Chip, Reliability (semiconductor), Hardware_INTEGRATEDCIRCUITS, Power cycling, Electronic engineering, Wafer, Integrated circuit packaging, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0503f827fded73902f5d484a45f86496
https://doi.org/10.1109/ectc.2013.6575597

المؤلفون: Tsung-Fu Tsai, Kenneth Wu, Larry Lin, Roger Hsieh, Tung-Chin Yeh

المصدر: 2012 IEEE 62nd Electronic Components and Technology Conference.

مصطلحات موضوعية: Electroless nickel, Materials science, Organic solderability preservative, Soldering, Metallurgy, Integrated circuit packaging, Electromigration, Flip chip, Die (integrated circuit), Surface finishing

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ef567f36fc73eec5d09b7ba31492b88d
https://doi.org/10.1109/ectc.2012.6249002

المؤلفون: Tsung-Fu Tsai, Yu-Ting Lin, Ming-Song Sheu, Chih-Horng Chang, Hui-Chen Chu, Yian-Liang Kuo, Jeng-Hun Lee

المصدر: International Symposium for Testing and Failure Analysis.

مصطلحات موضوعية: Materials science, Soldering, Metallurgy, Sample preparation, Image enhancement, Lead (electronics)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c44281daad78f0910095e606cab1cd93
https://doi.org/10.31399/asm.cp.istfa2010p0079

المؤلفون: Tsung-Fu Tsai, J. Y. Chang, Chau-Jie Zhan, Tao-Chih Chang

المصدر: 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference.

مصطلحات موضوعية: Thermal copper pillar bump, Interconnection, Materials science, business.industry, Wafer bonding, Soldering, Metallurgy, Electronic packaging, Microelectronics, Three-dimensional integrated circuit, Composite material, business, Electromigration

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a745abc6f9e45baf9c4613c985da8bd6
https://doi.org/10.1109/impact.2009.5382156

المؤلفون: Jing-Ye Juang, Jing-Yao Chang, Tsung-Fu Tsai, Li-Cheng Shen, Chien-Wei Chien

المصدر: 2008 58th Electronic Components and Technology Conference.

مصطلحات موضوعية: Electroless nickel, Interconnection, Materials science, Soldering, Metallurgy, Bumping, Composite material, Ternary operation, Microstructure, Chip, Flip chip

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::051a279f29247ae25e745fb33d725f1d
https://doi.org/10.1109/ectc.2008.4549950