المؤلفون: Zhang, Yunan, Tsai, Po-An, Tseng, Hung-Wei

مصطلحات موضوعية: Computer Science - Hardware Architecture

URL الوصول: http://arxiv.org/abs/2205.01252

المؤلفون: Hu, Yu-Ching, Li, Yuliang, Tseng, Hung-Wei

مصطلحات موضوعية: Computer Science - Databases

URL الوصول: http://arxiv.org/abs/2112.07552

المؤلفون: Hsu, Kuan-Chieh, Tseng, Hung-Wei

مصطلحات موضوعية: Computer Science - Distributed, Parallel, and Cluster Computing, Computer Science - Performance, Electrical Engineering and Systems Science - Signal Processing

URL الوصول: http://arxiv.org/abs/2107.05473

المؤلفون: Rohloff, Alec, Allen, Zackary, Lin, Kung-Min, Okrend, Joshua, Nie, Chengyi, Liu, Yu-Chia, Tseng, Hung-Wei

مصطلحات موضوعية: Computer Science - Networking and Internet Architecture, Computer Science - Human-Computer Interaction, Computer Science - Operating Systems

URL الوصول: http://arxiv.org/abs/2101.07327

المؤلفون: Koo, Gunjae, Oh, Yunho, Tseng, Hung-Wei, Ro, Won Woo, Annavaram, Murali

المساهمون: Defense Advanced Research Projects Agency, National Science Foundation, Samsung, National Research Foundation of Korea

المصدر: IEEE Transactions on Computers ; volume 72, issue 1, page 250-263 ; ISSN 0018-9340 1557-9956 2326-3814

الاتاحة: http://dx.doi.org/10.1109/tc.2022.3154602
https://ieeexplore.ieee.org/ielam/12/9984045/9721679-aam.pdf
http://xplorestaging.ieee.org/ielx7/12/9984045/09721679.pdf?arnumber=9721679

المؤلفون: Razaviyayn, Meisam, Tseng, Hung-Wei, Luo, Zhi-Quan

مصطلحات موضوعية: Computer Science - Learning, Statistics - Machine Learning

URL الوصول: http://arxiv.org/abs/1511.01776

المؤلفون: Shiau, Jenq-Tzong, Li, Cheng-Che, Tseng, Hung-Wei, Chen, Shien-Tsung

المصدر: Water (20734441); Nov2024, Vol. 16 Issue 22, p3165, 17p

مصطلحات موضوعية: CLIMATE change models, CLIMATE change, STANDARD deviations, WATERSHEDS

المؤلفون: Zhang, Yunan, Tsai, Po-An, Tseng, Hung-Wei

المساهمون: University of California, Riverside

المصدر: 2024 57th IEEE/ACM International Symposium on Microarchitecture (MICRO) ; page 1201-1216

الاتاحة: https://doi.org/10.1109/micro61859.2024.00090
http://xplorestaging.ieee.org/ielx8/10763948/10764425/10764668.pdf?arnumber=10764668

المؤلفون: Ha, Dongho, Liu, Lufei, Chou, Yuan Hsi, Go, Seokjin, Ro, Won Woo, Tseng, Hung-Wei, Aamodt, Tor M.

المساهمون: National Science Foundation

المصدر: 2024 57th IEEE/ACM International Symposium on Microarchitecture (MICRO) ; page 1041-1057

الاتاحة: https://doi.org/10.1109/micro61859.2024.00080
http://xplorestaging.ieee.org/ielx8/10763948/10764425/10764639.pdf?arnumber=10764639

المؤلفون: Ha, Dongho, Zhang, Yunan, Kao, Chen-Chien, Hughes, Christopher J., Ro, Won Woo, Tseng, Hung-Wei

المساهمون: National Science Foundation, University of California

المصدر: SC24: International Conference for High Performance Computing, Networking, Storage and Analysis ; page 1-16

الاتاحة: https://doi.org/10.1109/sc41406.2024.00016
http://xplorestaging.ieee.org/ielx8/10793057/10793058/10793224.pdf?arnumber=10793224

المؤلفون: Wudenhe, Abenezer, Liu, Yu-Chia, Chen, Chris, Tseng, Hung-Wei

المصدر: 2024 IEEE International Symposium on Performance Analysis of Systems and Software (ISPASS)

الاتاحة: http://dx.doi.org/10.1109/ispass61541.2024.00038
http://xplorestaging.ieee.org/ielx8/10589923/10590014/10590035.pdf?arnumber=10590035

المؤلفون: Tseng, Hung-Wei, Liu, Yang, Gahagan, Mark, Li, Jing, Jing, Yanqin, Swanson, Steven

وصف الملف: application/pdf

URL الوصول: https://escholarship.org/uc/item/324465dv

المؤلفون: Choi, Jinyoung, Blagodurov, Sergey, Tseng, Hung-Wei

المصدر: 2021 IEEE International Parallel and Distributed Processing Symposium (IPDPS) ; page 13-22

الاتاحة: https://doi.org/10.1109/ipdps49936.2021.00011
http://xplorestaging.ieee.org/ielx7/9458946/9458962/09460471.pdf?arnumber=9460471

المؤلفون: Hsu, Kuan-Chieh, Tseng, Hung-Wei

المصدر: Proceedings of the International Conference for High Performance Computing, Networking, Storage and Analysis

الاتاحة: http://dx.doi.org/10.1145/3458817.3476177
https://dl.acm.org/doi/pdf/10.1145/3458817.3476177

المؤلفون: Liu, Yu-Chia, Tseng, Hung-Wei

المساهمون: National Science Foundation, University of California, Riverside, Broadcom Inc., NSF (National Science Foundation)

المصدر: MICRO-54: 54th Annual IEEE/ACM International Symposium on Microarchitecture

الاتاحة: http://dx.doi.org/10.1145/3466752.3480122
https://dl.acm.org/doi/abs/10.1145/3466752.3480122
https://dl.acm.org/doi/pdf/10.1145/3466752.3480122

المؤلفون: Gall, James E., Ku, Heng-Yu, Gurney, Keyleigh, Tseng, Hung-Wei, Yeh, Hsin-Te, Association for Educational Communications and Technology, Washington, DC.

المصدر: Association for Educational Communications and Technology. 2004 Chicago(IL).

Peer Reviewed: Y

Page Count: 5

Descriptors: Citations (References), Educational Technology, Educational Research, Social Sciences, Periodicals, Social Science Research, Journal Articles

المؤلفون: Hsu, Kuan-Chieh, Tseng, Hung-Wei

المساهمون: National Science Foundation

المصدر: IEEE Micro ; volume 44, issue 4, page 11-19 ; ISSN 0272-1732 1937-4143

الاتاحة: http://dx.doi.org/10.1109/mm.2024.3414941
http://xplorestaging.ieee.org/ielx8/40/10645300/10587311.pdf?arnumber=10587311

المؤلفون: Matam, Kiran Kumar, Koo, Gunjae, Zha, Haipeng, Tseng, Hung-Wei, Annavaram, Murali

المساهمون: Samsung, Institute for Information and communications Technology Promotion, National Research Foundation of Korea, DARPA, NSF

المصدر: Proceedings of the 46th International Symposium on Computer Architecture

الاتاحة: http://dx.doi.org/10.1145/3307650.3322275
https://dl.acm.org/doi/pdf/10.1145/3307650.3322275

المؤلفون: Hu, Yu-Ching, Lokhandwala, Murtuza Taher, I., Te, Tseng, Hung-Wei

المساهمون: National Science Foundation, Facebook

المصدر: Proceedings of the 52nd Annual IEEE/ACM International Symposium on Microarchitecture

الاتاحة: http://dx.doi.org/10.1145/3352460.3358282
https://dl.acm.org/doi/pdf/10.1145/3352460.3358282

المؤلفون: Hsu, Kuan-Chieh, Tseng, Hung-Wei

المساهمون: National Science Foundation, Intel Corporation

المصدر: 56th Annual IEEE/ACM International Symposium on Microarchitecture

الاتاحة: http://dx.doi.org/10.1145/3613424.3614285
https://dl.acm.org/doi/pdf/10.1145/3613424.3614285